Patent Assignment
Reel/Frame 012918/0893
Assignment of Assignor's Interest
Recorded: 2002-05-17
Received: 2002-05-28
Pages: 5
Assignee
AGERE SYSTEMS INC.
555 UNION BOULEVARD, ALLENTOWN, PA, 18109, UNITED STATES
Covered Property
(1)
Integrated Circuit Die Having Alignment Marks in the Bond Pad Region and Method of Manufacturing Same
Application:
10/150,790 →