IP Library Granted Patent US 6,628,001
Granted Patent Utility
US 6,628,001 · Confirmation No. 3733

INTEGRATED CIRCUIT DIE HAVING ALIGNMENT MARKS IN THE BOND PAD REGION AND METHOD OF MANUFACTURING SAME

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Code Description Pages PDF
2003-07-31 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-05-17 TRNA Transmittal of New Application 2 View
2002-05-17 SPEC Specification 16 View
2002-05-17 CLM Claims 6 View
2002-05-17 ABST Abstract 1 View
2002-05-17 DRW Drawings-only black and white line drawings 2 View
2002-05-17 OATH Oath or Declaration filed 6 View
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Quick Facts
Patent No.
US 6,628,001
App. No.
10/150,790
Filed
2002-05-17
Granted
2003-09-30
Art Unit
2815
PTA
0 days