Patent Assignment
Reel/Frame 012957/0070
Assignment of Assignor's Interest
Recorded: 2002-05-24
Pages: 3
Assignee
MEGIC CORPORATION
SCIENCE-BASED INDUSTRIAL PARK, 21 R&D FIRST ROAD, HSIN-CHU R.O.C., TAIWAN
Covered Property
(1)
Post Passivation Method for Semiconductor Chip or Wafer
Patent:
7,405,149 →
Application:
10/154,662 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →