Patent Assignment
Reel/Frame 012960/0743
Assignment of Assignor's Interest
Recorded: 2002-05-29
Received: 2002-06-11
Pages: 2
Assignor
BEPPU, TOSHIYASU
Executed: 2002-05-17
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Polishing Method Using Ceria Slurry, and Method of Manufacturing Semiconductor Device
Application:
10/156,014 →