IP Library Assignment 012963/0426
Patent Assignment
Reel/Frame 012963/0426

Assignment of Assignor's Interest

Recorded: 2002-06-06 Pages: 3
Assignor
KIMOTO, HISAMITSU
Executed: 2002-04-13
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Apparatus Including a Multi-Layer Wiring Configuration and Manufacturing Method Therefor
Patent: 6,770,973 →
Application: 09/850,254 →
Publication: US 2001/0050381
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 13, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013745/0782 →
Assignment of Assignor's Interest May 28, 2004
From: NEC CORPORATION; NEC ELECTRONICS CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 015368/0427 →