Patent Assignment
Reel/Frame 013008/0383
Assignment of Assignor's Interest
Recorded: 2002-06-12
Pages: 4
Assignor
NAGAO, KOICHI
Executed: 2002-05-30
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
KADOMA-SHI, 1006-BANCHI, OAZA-KADOMA, OSAKA 571-8501, JAPAN
Covered Property
(1)
Semiconductor Package Having Two Chips Internally Connected Together with Bump Electrodes and Both Chips Externally Connected to Lead Frame with Bond Wires
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 19, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 033777/0873 →
Assignment of Assignor's Interest
Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
Assignment of Assignor's Interest
Jan 25, 2016
From: PANNOVA SEMIC, LLC
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 037581/0466 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →