Patent Assignment
Reel/Frame 037581/0466
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2016-01-25
Received: 2016-01-25
Pages: 21
Assignor
PANNOVA SEMIC, LLC
Executed: 2016-01-13
Assignee
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Applications
(41)
SEMICONDUCTOR DEVICE
App. No. 13/308,038
→
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 13/049,307
→
MULTILAYER SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT
App. No. 13/008,579
→
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
App. No. 12/890,058
→
SEMICONDUCTOR DEVICE
App. No. 12/721,067
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION
App. No. 12/425,682
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SEMICONDUCTOR DEVICE
App. No. 12/372,130
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CARRIER FRAME FOR ELECTRONIC COMPONENTS AND PRODUCTION METHOD FOR ELECTRONIC COMPONENTS
App. No. 12/246,021
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RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
App. No. 12/208,804
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LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE LEAD FRAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
App. No. 12/189,952
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SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
App. No. 11/950,625
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SEMICONDUCTOR DEVICE HAVING RECESSED CONNECTOR PORTIONS
App. No. 11/826,673
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STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 11/717,953
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LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
App. No. 11/154,541
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RESIN-ENCAPSULATION SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
App. No. 11/090,011
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
App. No. 11/057,195
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LEAD FRAME, RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING THE SAME
App. No. 11/018,541
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RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/991,864
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SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER
App. No. 10/919,402
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STACKED CHIP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 10/881,044
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SEMICONDUCTOR INTEGRATED CIRCUIT, AND ELECTROSTATIC WITHSTAND VOLTAGE TEST METHOD AND APPARATUS THEREFOR
App. No. 10/875,624
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SEMICONDUCTOR DEVICE
App. No. 10/766,892
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SEMICONDUCTOR DEVICE WITH FOLDED FILM SUBSTRATE AND DISPLAY DEVICE USING THE SAME
App. No. 10/756,121
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RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
App. No. 10/747,982
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LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
App. No. 10/689,642
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
App. No. 10/649,741
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
App. No. 10/607,274
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 10/608,295
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LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
App. No. 10/438,847
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STACKED SEMICONDUCTOR CHIPS ATTACHED TO A WIRING BOARD
App. No. 10/320,379
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SEMICONDUCTOR DEVICE
App. No. 10/320,362
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SEMICONDUCTOR DEVICE
App. No. 10/320,405
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SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION LAYER FORMED BETWEEN ELECTRODE PORTIONS
App. No. 10/307,450
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RESIN ENCAPSULATION SEMICONDUCTOR DEVICE UTILIZING GROOVED LEADS AND DIE PAD
App. No. 10/199,109
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RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
App. No. 10/173,900
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SEMICONDUCTOR PACKAGE HAVING TWO CHIPS INTERNALLY CONNECTED TOGETHER WITH BUMP ELECTRODES AND BOTH CHIPS EXTERNALLY CONNECTED TO LEAD FRAME WITH BOND WIRES
App. No. 10/170,136
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SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
App. No. 10/165,279
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SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
App. No. 09/984,191
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SEMICONDUCTOR DEVICE HAVING A PLURALITY OF STACKED SEMICONDUCTOR CHIPS ON A WIRING BOARD
App. No. 09/946,363
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LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
App. No. 09/879,082
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Resin-molded semicondutor device, method for manufacturing the same, and leadframe
App. No. 09/771,548
→