Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device
View Patent ↗A lead frame is provided which can prevent a short circuit between wires and the ends of adjacent leads, the short circuit being caused by wire sweep during the injection of molding resin, in a configuration where the electrodes of a semiconductor chip and the leads disposed around the semiconductor chip. The lead having sides substantially perpendicular to the direction of a resin flow has an end whose upstream side relative to the resin flow is constricted.
1. A lead frame, comprising:
a frame;
a support plate in the frame; and
a plurality of leads connected to the frame, the plurality of leads protruding toward a center of the frame,
wherein a lead has an end extending toward the center of the frame, having a bonding portion connected to a wire and a constricted portion closer to the center of the frame than the bonding portion, and is flat between the constricted portion and the bonding portion, and
a longitudinal side of the lead is constricted at the constricted portion.
2. The lead frame according to claim 1 , wherein the constricted side of the lead forms an angle of 75° to 105° relative to an injection direction of resin.
3. The lead frame according to claim 1 , wherein the support plate is a radiator plate, and
the lead frame further comprises frame insulating tape between a top surface of the radiator plate and undersides of ends of the leads.
4. The lead frame according to claim 3 , wherein the leads protrude inward out of an inner frame of the insulating tape.
5. The lead frame according to claim 1 , wherein the end of the lead having the constricted side has a width smaller than a thickness of the end of the lead.
6. The lead frame according to claim 1 , wherein another lead is adjacent to the constricted side of the lead.
7. A semiconductor device, comprising:
a semiconductor chip having a plurality of electrodes;
a support plate on which the semiconductor chip is mounted;
a plurality of leads around the semiconductor chip, the plurality of leads protruding toward the semiconductor chip;
a plurality of wires for connecting the electrodes of the semiconductor chip and the leads; and
a molding resin member for integrally molding the semiconductor chip, the support plate, the wires, and joints of the leads and the wires,
wherein a lead has an end extending toward the semiconductor chip, a bonding portion connected to the wire and a constricted portion closer to the semiconductor chip than the bonding portion, and is flat between the constricted portion and the bonding portion,
a longitudinal side of the lead is constricted at the constricted portion.
8. The semiconductor device according to claim 7 , wherein the constricted side of the lead forms an angle of 75° to 105° relative to an injection direction of resin.
9. The semiconductor device according to claim 7 , wherein the support plate is a radiator plate, and
the semiconductor device further comprises frame insulating tape between a top surface of the radiator plate and undersides of ends of the leads.
10. The semiconductor device according to claim 9 , wherein the leads protrude inward out of an inner frame of the insulating tape.
11. The semiconductor device according to claim 7 , wherein the end of the lead having the constricted side has a width smaller than a thickness of the end of the lead.
12. The semiconductor device according to claim 7 , wherein another lead is adjacent to the constricted side of the lead.
13. A semiconductor device, comprising:
a semiconductor chip having a plurality of electrodes;
a support plate on which the semiconductor chip is mounted;
a plurality of leads around the semiconductor chip, the plurality of leads protruding toward the semiconductor chip;
a plurality of wires for connecting the electrodes of the semiconductor chip and the leads; and
a molding resin member for integrally molding the semiconductor chip, the support plate, the wires, and joints of the leads and the wires,
wherein the lead has an end laterally constricted at a side along a longitudinal direction of the lead, having a narrowing width, and is flat between a laterally constricted portion and a bonding portion connected to the wire.
14. The semiconductor device according to claim 13 , wherein the wire connected to the lead having the laterally constricted end is connected to the lead over the laterally constricted portion.
15. A semiconductor device, comprising:
a semiconductor chip having a plurality of electrodes;
a support plate on which the semiconductor chip is mounted;
a plurality of leads around the semiconductor chip, the plurality of leads protruding toward the semiconductor chip;
a plurality of wires for connecting the electrodes of the semiconductor chip and the leads; and
a molding resin member for integrally molding the semiconductor chip, the support plate, the wires, and joints of the leads and the wires,
wherein the lead has an end extending toward the semiconductor chip, having a bonding portion connected to the wire and a constricted portion closer to the semiconductor chip than the bonding portion, and being flat between the constricted portion and the bonding portion, and
a longitudinal side of the lead is constricted at the constricted portion.
16. The semiconductor device according to claim 15 , wherein the constricted side of the lead forms an angle of 75° to 105° relative to an injection direction of resin.
17. The semiconductor device according to claim 15 , wherein the support plate is a radiator plate, and
the semiconductor device further comprises frame insulating tape between a top surface of the radiator plate and undersides of ends of the leads.
18. The semiconductor device according to claim 17 , wherein the leads protrude inward out of an inner frame of the insulating tape.
19. The semiconductor device according to claim 15 , wherein the end of the lead having the constricted side has a width smaller than a thickness of the end of the lead.
20. The semiconductor device according to claim 15 , wherein another lead is adjacent to the constricted side of the lead.