IP Library › Granted Patent US 6,677,674
Granted Patent Utility
US 6,677,674 · Confirmation No. 7685

SEMICONDUCTOR PACKAGE HAVING TWO CHIPS INTERNALLY CONNECTED TOGETHER WITH BUMP ELECTRODES AND BOTH CHIPS EXTERNALLY CONNECTED TO LEAD FRAME WITH BOND WIRES

Inventor: Koichi Nagoa
Patented Case View Patent ↗ View Publication ↗
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2020-06-11 OATH Oath or Declaration filed 262 View
2003-11-24 IFEE Issue Fee Payment (PTO-85B) 2 View
2002-06-12 TRNA Transmittal of New Application 1 View
2002-06-12 ADS Application Data Sheet 2 View
2002-06-12 SPEC Specification 15 View
2002-06-12 CLM Claims 3 View
2002-06-12 ABST Abstract 1 View
2002-06-12 DRW Drawings-only black and white line drawings 8 View
2002-06-12 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,677,674
App. No.
10/170,136
Filed
2002-06-12
Granted
2004-01-13
Pub. No.
US20020192855A1
Art Unit
2813
PTA
-92 days