IP Library › Granted Patent US 6,338,984
Granted Patent Utility
US 6,338,984 · Confirmation No. 8818

Resin-molded semicondutor device, method for manufacturing the same, and leadframe

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 Code Description Pages PDF
2020-06-11 OATH Oath or Declaration filed 262 View
2001-01-30 TRNA Transmittal of New Application 2 View
2001-01-30 ADS Application Data Sheet 2 View
2001-01-30 SPEC Specification 53 View
2001-01-30 CLM Claims 3 View
2001-01-30 ABST Abstract 1 View
2001-01-30 DRW Drawings-only black and white line drawings 15 View
2001-01-30 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,338,984
App. No.
09/771,548
Filed
2001-01-30
Granted
2002-01-15
Pub. No.
US20010007780A1
Art Unit
2814
PTA
0 days