IP Library Assignment 013014/0305
Patent Assignment
Reel/Frame 013014/0305

Assignment of Assignor's Interest

Recorded: 2002-08-22 Pages: 4
Assignors
MORIYAMA, HIDEKI
Executed: 2002-08-07
UHARA, KENJI
Executed: 2002-08-07
DUNBAR, MEREDITH L.
Executed: 2002-08-01
EDMAN, JAMES R.
Executed: 2002-07-31
Assignees
E. I. DU PONT DE NEMOURS AND COMPANY
LEGAL PATENTS, BARLEY MILL PLAZA 25, WILMINGTON, DELAWARE, 19880
DUPONT-TORAY COMPANY, LTD.
LEGAL PATENTS, 5-6, NIHONBASHI HONCHO 1-CHOME, CHUO-KU, TOKYO 103, JAPAN
Covered Property (1)
Laminate Type Materials for Flexible Circuits or Similar-Type Assemblies and Methods Relating Thereto
Patent: 6,916,544 →
Application: 10/150,233 →
Publication: US 2003/0215654
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →