Patent Assignment
Reel/Frame 049583/0269
Assignment of Assignor's Interest
Recorded: 2019-06-25
Pages: 162
Assignor
E. I. DU PONT DE NEMOURS AND COMPANY
Executed: 2019-06-17
Assignee
DUPONT ELECTRONICS, INC.
974 CENTRE ROAD, WILMINGTON, DELAWARE, 19805
Covered Properties
(523)
Perfluoropolyvinyl Modified Aryl Intermediates and Monomers
Perfluoropolyvinyl Modified Aryl Intermediates/Monomers
Aryl Compounds Modified with Perfluorovinyl Ethers
Barrier Films for Plastic Substrates Fabricated by Atomic Layer Deposition
Non-Lead Resistor Composition
Non-Lead Resistor Composition
Non-Lead Resistor Composition
Compositions Containing Multifunctional Nanoparticles
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
Conductive Paste Composition Containing Lithium, and Articles Made Therefrom
Laminated Polymer Film and Solar Module Made Thereof
Thick-Film Conductive Compositions with Nano-Sized Zinc Additive
Conductive Paste Composition Containing Lithium, and Articles Made Therefrom
Thick-Film Pastes Containing Lead- and Tellurium-Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead- and Tellurium-Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead- and Tellurium-Oxides, and Their Use in the Manufacture of Semiconductor Devices
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
High Resolution, Solvent Resistant, Thin Elastomeric Printing Plates
Conductive Paste Composition with Synthetic Clay Additive and Its Use in the Manufacture of Semiconductor Devices
Lead-Free Conductive Paste Composition and Semiconductor Devices Made Therewith
Lead-Free Conductive Paste Composition and Semiconductor Devices Made Therewith
Curable Composition Comprising a Di-Isoimide, Method of Curing, and the Cured Composition So Formed
Laminate Comprising Curable Epoxy Film Layer Comprising a Di-Isoimide and Process for Preparing Same
Printed Wiring Board Encapsulated by Adhesive Laminate Comprising a Di-Isoimide, and Process for Preparing Same
Filled Polyimide Films and Coverlays Comprising Such Films
Moisture Barrier for Potovoltaic Cells
Process for Preparing Substituted and Unsubstituted Diamino Triazine Aromatic Di-Isoimides
Thin-Film Transparent Conductive Structure and Devices Made Therewith
Method for Preparing Consolidated Multi-Layer Article Using Curable Epoxy Composition with Quaternary Ammonium Bicarbonate Curing Catalyst
Preparation, Purification and Use of High-X Diblock Copolymers
Conductive Paste Composition and Semiconductor Devices Made Therefrom
Conductive Paste Composition and Semiconductor Devices Made Therefrom
Process for Forming an Electrically Conductive Structure on a Substrate
Conductive Paste Composition and Semiconductor Devices Made Therewith
Conductive Paste Composition and Semiconductor Devices Made Therewith
Conductive Paste Composition and Semiconductor Devices Made Therewith
Conductive Paste Composition and Semiconductor Devices Made Therewith
Conductive Paste Composition and Semiconductor Devices Made Therewith
Articles Containing a Heat Source and a Heat Spreader to Conduct Heat Away from the Heat Source
Application:
15/602,579 →
Publication:
US US20170373360A1
Catalytic Manufacture of Vinyl Fluoride
Patent:
6,262,321 →
Application:
09/308,402 →
Electrically Conductive Adhesives Comprising Blend Elastomers
Electrically Conductive Adhesives Comprising Fluoroelastomers
Copper-Containing Conductive Pastes and Electrodes Made Therefrom
Copper-Containing Conductive Pastes and Electrodes Made Therefrom
Solar Cells with Copper Electrodes
Electrically Conductive Adhesives
Electrically Conductive Adhesives
Coated Copper Particles and Use Thereof
Back Sheet for Solar Cell Module and Solar Cell Module Made Thereof
Application:
15/878,826 →
Publication:
US US20180212089A1
Semi-Automated Reworkability Process for De-Bonding a Display
Method of chemically mechanically polishing substrates
Application:
10/975,501 →
Publication:
US US20050159085A1
Thick Film Conductor Composition for Use in Biosensors
Patent:
6,599,408 →
Application:
09/722,971 →
Thick Film Compositions for Use in Electroluminescent Applications
Tape Composition and Process for Internally Constrained Sintering of Low Temperature Co-Fired Ceramic
Tape Composition and Process for Internally Constrained Sintering of Low Temperature Co-Fired Ceramic
Thick-Film Conductor Paste for Automotive Glass
Lead Free Glass(Es), Thick Film Paste(S), Tape Composition(S) and Low Temperature Cofired Ceramic Devices Made Therefrom
Thick Film Conductor Compositions for Use in Membrane Switch Applications
Composition of Conductive Paste
Ink Jet Printable Thick Film Compositions and Processes
Aqueous Developable Photoimageable Compositions for Use in Photo-Patterning Methods
High Conductivity Polymer Thick Film Silver Conductor Composition for Use in Rfid and Other Applications
Thick Film Conductor Compositions and the Use Thereof in Ltcc Circuits and Devices
Thick Film Conductor Case Compositions for Ltcc Tape
Thick Film Paste via Fill Composition for Use in Ltcc Applications
Methods for Forming Multilayer Structures
Process for Making Highly Dispersible Spherical Silver Powder Particles and Silver Particles Formed Therefrom
Electroconductive Thick Film Composition(S), Electrode(S), and Semiconductor Device(S) Formed Therefrom
Electroconductive Thick Film Composition(S), Electrode(S), and Semiconductor Device(S) Formed Therefrom
Thick Film Conductor Paste Composition for Ltcc Tape in Microwave Applications
Thick Film Conductor Paste Compositions for Ltcc Tape in Microwave Applications
Thick Film Conductor Composition(S) and Processing Technology Thereof for Use in Multilayer Electronic Circuits and Devices
Paste for Solar Cell Electrodes, Method for the Manufacture of Solar Cell Electrodes, and the Solar Cell
Paste for Solar Cell Electrode and Solar Cell
Paste for Solar Cell Electrode and Solar Cell
Device chip carriers, modules, and methods of forming thereof
Paste for Back Contact-Type Solar Cell
Paste for Back Contact-Type Solar Cell
Conductor Paste for Ceramic Substrate and Electric Circuit
Silver-Palladium Alloy Containing Conductor Paste for Ceramic Substrate and Electric Circuit
Conductor Paste for Ceramic Substrate and Electric Circuit
Conductive Paste for Solid Electorlytic Capacitor Electrode and Process for Producing Solid Electolytic Capacitor Electrode Using the Same
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices
Bendable Circuit Board for Led Mounting and Interconnection
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices: Flux Materials
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices: Mg-Containing Additive
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices: Mg-Containing Additive
Lead-Free Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices: Mg-Containing Additive
Lead-Free Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices: Flux Materials
Conductive Composition for Black Bus Electrode, and Front Panel of Plasma Display Panel
Elecrically Conductive Adhesive
Conductive Paste and Grid Electrode for Silicon Solar Cells
Conductive Paste and Grid Electrode for Silicon Solar Cells
Conductive Paste and Grid Electrode for Silicon Solar Cells
Resistor Compositions Using a Cu-Containing Glass Frit
Solar Cell Electrode
Solar Cell Electrode
Solar Cell Electrode
Solar Cell Electrodes
Lead-Free Resistive Composition
Co-Processable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices - Organic Medium Components
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices - Organic Medium Components
Conductive Compositions and Processes for Use in the Manufacture of Semiconductor Devices - Organic Medium Components
Silver Composition for Micro-Deposition Direct Writing Silver Conductor Lines on Photovoltaic Wafers
Methods Using Silver Compositions for Micro-Deposition Direct Writing Silver Conductor Lines on Photovoltaic Wafers
Devices Containing Silver Compositions Deposited by Micro-Deposition Direct Writing Silver Conductor Lines
Aluminum Pastes and Use Thereof in the Production of Silicon Solar Cells
Glass Compositions Used in Conductors for Photovoltaic Cells
Conductive Paste for Solar Cell Electrode
Mixed-Metal System Conductors for Use in Low-Temperature Co-Fired Ceramic Circuits and Devices
Mixed-Metal System Conductors for Ltcc (Low-Temperature Co-Fired Ceramic)
Preparation of Silver Spheres by the Reduction of Silver Polyamine Complexes
Multi-Element Metal Powders for Silicon Solar Cells
Nickel-Gold Plateable Thick Film Silver Paste
Photosensitive Paste and Process for Production of Pattern Using the Same
Method for Producing Dispersed, Crystalline, Stable to Oxidation Copper Particles
Solar Cell Electrode
Glass Compositions Used in Conductors for Photovoltaic Cells
Process of Forming a Grid Electrode on the Front-Side of a Silicon Wafer
Process of Forming a Grid Electrode on the Front-Side of a Silicon Wafer
Electrode and Method for Manufacturing the Same
Uv-Curable Polymer Thick Film Dielectric Compositions with Excellent Adhesion to Ito
Ink Jettable Silver/Silver Chloride Compositions
Aluminum Pastes and Use Thereof in the Production of Passivated Emitter and Rear Contact Silicon Solar Cells
Application:
14/624,816 →
Publication:
US US20170077324A9
Aluminum Pastes and Use Thereof in the Production of Passivated Emitter and Rear Contact Silicon Solar Cells
Polymer Thick Film Silver Electrode Composition for Use as a Plating Link
Process for the Formation of a Silver Back Electrode of a Passivated Emitter and Rear Contact Silicon Solar Cell
Method of Manufacturing High Frequency Receiving and/or Transmitting Devices from Low Temperature Co Fired Ceramic Materials and Devices Made Therefrom
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Etching Composition and Its Use in a Method of Making a Photovoltaic Cell
Photovoltaic Devices with Base Metal Buss Bars
Processes and Compositions for Forming Photovoltaic Devices with Base Metal Buss Bars
Process for the Production of a Mwt Silicon Solar Cell
Silver Particles and a Process for Making Them
Method of Making Non-Hollow, Non-Fragmented Spherical Metal or Metal Alloy Particles
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Electrode and Method for Manufacturing the Same
Low Temperature Co-Fired Ceramic Structure for High Frequency Applications and Process for Making Same
Electrode and Method for Manufacturing the Same
Thick-Film Pastes Containing Lead-Tellurium-Lithium-Titanium-Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead-Tellurium-Boron-Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead-Tellurium-Boron-Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead-Tellurium-Lithium- Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead-Tellurium-Lithium- Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick-Film Pastes Containing Lead-Tellurium-Lithium- Oxides, and Their Use in the Manufacture of Semiconductor Devices
Thick Film Paste Containing Bismuth-Tellurium-Oxide and Its Use in the Manufacture of Semiconductor Devices
Thick Film Paste Containing Bismuth-Tellurium-Oxide and Its Use in the Manufacture of Semiconductor Devices
Low Temperature Fireable Thick Film Silver Paste
Thick Film Paste Containing Bismuth-Tellurium-Oxide and Its Use in the Manufacture of Semiconductor Devices
Thick Film Paste Containing Lead-Tellurium-Lithium-Titanium-Oxide and Its Use in the Manufacture of Semiconductor Devices
Method of Manufacturing Solar Cell Electrode and Conductive Paste
Method of Manufacturing a Resistor Paste
Solderable Polymer Thick Film Conductive Electrode Composition for Use in Thin-Film Photovoltaic Cells and Other Applications
Solderable Polymer Thick Film Conductive Electrode Composition for Use in Thin-Film Photovoltaic Cells and Other Applications
Thick Film Paste and Use Thereof
Thick Film Paste and Use Thereof
CONDUCTIVE COMPOSITIONS CONTAINING Li2RuO3 AND ION-EXCHANGED Li2RuO3 AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES
Process of Forming an Aluminum P-Doped Surface Region of a Semiconductor Substrate
Process of Forming an Aluminum P-Doped Surface Region of an N-Doped Semiconductor Substrate
Conductive Compositions Containing Rhodium and Pb-Te-O and Their Use in the Manufacture of Semiconductor Devices
Thick Film Silver Paste and Its Use in the Manufacture of Semiconductor Devices
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Solar Cell and Manufacturing Method of the Same
Electrically Conductive Paste Composition
Conductive Metal Ink
Method for Manufacturing a Photovoltaic Cell with a Locally Diffused Rear Side
Polymer Thick Film Solder Alloy Conductor Composition
Low Temperature Co-Fired Ceramic (Ltcc) System in a Package (Sip) Configurations for Microwave/Millimeter Wave Packaging Applications
Thick-Film Paste Containing Lead-Vanadium-Based Oxide and Its Use in the Manufacture of Semiconductor Devices
Polymer Thick Film Solder Alloy/Metal Conductor Compositions
Method of Manufacturing Copper Electrode
Method of Manufacturing Thick-Film Electrode
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Thick-Film Electrode
Method of Manufacturing Solar Cell Electrode
Glass Composition and Its Use in Conductive Silver Paste
Use of a Conductive Composition Containing Lead-Tellurium-Based Oxide in the Manufacture of Semiconductor Devices with Lightly Doped Emitters
Photonic Sintering of Polymer Thick Film Conductor Compositions
Conductive Metal Composition
Lamination of Polymer Thick Film Conductor Compositions
Lamination of Polymer Thick Film Conductor Compositions
Thick Film Silver Paste and Its Use in the Manufacture of Semiconductor Devices
Conductive Silver Paste for a Metal-Wrap-Through Silicon Solar Cell
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Photonic Sintering of Polymer Thick Film Copper Conductor Compositions
Moisture Barrier Layer Dielectric for Thermoformable Circuits
Moisture Barrier Layer Dielectric for Thermoformable Circuits
Conductive Silver Paste for a Metal-Wrap-Through Silicon Solar Cell
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Non-Firing Type Electrode
Solar Cell Comprising a P-Doped Silicon Wafer and an Aluminum Electrode
Method of Manufacturing a Solar Cell
Heat-Curable Polymer Paste
Conductive Paste Used for Solar Cell Electrodes
Conductive Paste Used for Solar Cell Electrodes and Method of Manufacturing the Solar Cell Electrodes
Thermally Conductive Dielectric for Thermoformable Circuits
Polymer Thick Film Positive Temperature Coefficient Carbon Composition
Uv-Curable Thermoformable Dielectric for Thermoformable Circuits
Method for Manufacturing an Interdigitated Back Contact Solar Cell
Thick-Film Paste Containing Lead-Tungsten-Based Oxide and Its Use in the Manufacture of Semiconductor Devices
Flexible White Reflective Dielectric for Electronic Circuits
Flexible White Reflective Dielectric for Electronic Circuits
Method of Fabricating Electromagnetic Bandgap (Ebg) Structures for Microwave/Millimeterwave Applications Using Laser Processing of Unfired Low Temperature Co-Fired Ceramic (Ltcc) Tape
Stretchable Polymer Thick Film Silver Conductor for Highly Permeable Substrates
Aluminum-Tin Paste and Its Use in Manufacturing Solderable Electrical Conductors
Thermoformable Polymer Thick Film Transparent Conductor and Its Use in Capacitive Switch Circuits
Thermoformable Polymer Thick Film Transparent Conductor with Haptic Response and Its Use in Capacitive Switch Circuits
High K Dielectric Composition for Thermoformable Capacitive Circuits
Solar Cell Electrode
Printable Compositions Useful in Electronic Applications and Methods Relating Thereto
Conductor for a Solar Cell
Polymer Thick Film Silver Conductor with Inverted Cure Profile Behavior
Flowable Compositions with Low Temperature Curing to Form Thermally Conductive Pathways in Electronics Type Applications and Methods Relating Thereto
Method and Devices for High Temperature Thick Film Pastes
Application:
14/972,840 →
Publication:
US US20160183328A1
Thermoformable Polymer Thick Film Transparent Conductor and Its Use in Capacitive Switch Circuits
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Method of Manufacturing Electrical Device
Electronic Component
Terminal Electrode of Electronic Component
Application:
15/133,307 →
Publication:
US US20160322163A1
Back-Contact Solar Cell and Method for Manufacturing the Same
Electric Component
Application:
14/992,427 →
Publication:
US US20170200556A1
Chip Resistor
Conductive Paste for Bonding
Conductive Paste For Bonding
Conductive Paste Composition and Semiconductor Devices Made Therewith
Photonic Sintering of a Polymer Thick Film Copper Conductor Composition
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Photonic Sintering of a Solderable Polymer Thick Film Copper Conductor Composition
Method for Manufacturing Back Contact Solar Cells
Patent:
9,306,088 →
Application:
14/857,142 →
Polyimide-Based Polymer Thick Film Compositions
Polyimide-Based Polymer Thick Film Resistor Composition
Conductive Paste Composition and Semiconductor Devices Made Therewith
Conductive Paste Composition and Semiconductor Devices Made Therewith
Electrical Connections And their Use in Wearables and Other Applications
Application:
16/032,644 →
Publication:
US US20180323524A1
Electrical Connections And their Use in Wearables and Other Applications
Application:
15/695,413 →
Publication:
US US20180090861A1
Electrical Connections for Wearables and Other Articles
Application:
15/825,278 →
Publication:
US US20180153227A1
Conductive Paste Composition and Semiconductor Devices Made Therewith
Articles and Substrates Providing Improved Performance of Printable Electronics
Fine Silver Particle Dispersion
Printable Heaters for Wearables
Application:
15/935,769 →
Publication:
US US20180289082A1
Conductive Paste Composition and Semiconductor Devices Made Therewith
Printable Heaters to Heat Wearables and Other Articles
Application:
15/971,056 →
Publication:
US US20180368213A1
Bendable Electrical Conductor in a Thermoformed Article
Application:
15/969,144 →
Publication:
US US20180358145A1
Printable Heaters for Wearables and Other Articles
Application:
15/915,470 →
Publication:
US US20190274376A1
Hand and Foot Heaters
Hand and Foot Heaters
Application:
62/618,309 →
Stretchable Conductive Fluoroelastomer Paste Composition
Application:
62/746,269 →
Substantially Symmetrical 3-Arm Star Block Copolymers
Catalytic Polymerization Process
Method of Producing Stabilized Organic Pigment Particles and Device Therefor
Binding Agents Modified with Nanoparticles, for Coatings, and Use Thereof
Patent:
6,750,270 →
Application:
10/031,303 →
Process for Making Vinyl Fluoride Interpolymers and Dispersions Thereof
Fluoropolymer Coating Compositions Containing Adhesive Polymers and Substrate Coating Process
Fluoropolymer Coating Compositions Containing Adhesive Polymers and Substrate Coating Process
Fluoropolymer Coated Films Useful for Photovoltaic Modules
Fluoropolymer Coated Films Useful for Photovoltaic Modules
Fluoropolymer Coated Films Useful for Photovoltaic Module
Fluoropolymer Coated Films Useful for Photovoltaic Modules
Process for Forming Fluoropolymer Coated Film
Fluoropolymer Coated Film, Process for Forming the Same, and Fluoropolymer Liquid Composition
Crosslinkable Vinyl Fluoride Copolymers
Crosslinkable Vinyl Fluoride Copolymer Coated Film and Process for Making Same
Photopolymerizable Recording Element and Process for Preparing Flexographic Printing Forms
Patent:
6,673,509 →
Application:
09/511,833 →
Method for Mounting Multiple Printing Elements Onto a Cylindrical Element
Patent:
6,117,615 →
Application:
09/362,470 →
Ink Receptor Sheet and It's Process of Use
Process for Preparing a Flexographic Printing Plate
Process for Preparing a Flexographic Printing Plate
Process for Coating on Printing Cylinders
Apparatus and Process for Forming a Printing Form Having a Cylindrical Support
Process and Apparatus Having an Adjustable Heater
Apparatus and Process for Positioning a Cylindrically-Shaped Printing Element
Apparatus and Process for Exposing a Printing Form Having a Cylindrical Support
Exposure Apparatus and a Method for Exposing a Photosensitive Element and a Method for Preparing a Printing Form from the Photosensitive Element
Exposure Apparatus and a Method for Exposing a Photosensitive Element and a Method for Preparing a Printing Form from the Photosensitive Element
Exposure Apparatus and a Method for Controlling Radiation from a Lamp for Exposing a Photosensitive Element
Polyimide Composite Coverlays and Methods and Compositions Relating Thereto
High Modulus Polyimide Compositions Useful as Dielectric Substrates for Electronics Applications, and Methods Relating Thereto
Polyimide Film, Method of Manufacture, and Metal Interconnect Board with Polyimide Film Substrate
Low Temperature Polyimide Adhesive Compositions and Methods Relating Thereto
Low Temperature Polyimide Adhesive Compositions and Methods Relating Thereto
Low Temperature Polyimide Adhesive Compositions and Methods Relating Thereto
Low-Temperature Curable Photosensitive Compositions
Low-Temperature Curable Photosensitive Compositions
Polyimide Based Compositions Comprising Doped Polyaniline and Methods and Compositions Relating Thereto
Polyimide Based Substrate Comprising Doped Polyaniline
Laminate Type Materials for Flexible Circuits or Similar-Type Assemblies and Methods Relating Thereto
Polyimide Substrates Having Enhanced Flatness, Isotropy and Thermal Dimensional Stability, and Methods and Compositions Relating Thereto
High Temperature Polymeric Materials Containing Corona Resistant Composite Filler, and Methods Relating Thereto
Dielectric Substrates Comprising a Polymide Core Layer and a High Temperature Fluoropolymer Bonding Layer, and Methods Relating Thereto
Multilayer Substrates Having at Least Two Dissimilar Polyimide Layers, Useful for Electronics-Type Applications, and Compositions Relating Thereto
Polycyclic Polyimides and Compositions and Methods Relating Thereto
Polycyclic Polyimides and Compositions and Methods Relating Thereto
Capacitive Devices, Organic Dielectric Laminates, and Printed Wiring Boards Incorporating Such Devices, and Methods of Making Thereof
Low Temperature Cure Polyimide Compositions Resistant to Arc Tracking and Methods Relating Thereto
Flame Retardant Photoimagable Coverlay Compositions and Methods Relating Thereto
Flame Retardant Multi-Layer Photoimagable Coverlay Compositions and Methods Relating Thereto
Low Color Polyimide Compositions Useful in Optical Type Applications and Methods and Compositions Relating Thereto
Resistor Compositions for Electronic Circuitry Applications
Film Based Heating Device and Methods Relating Thereto
Thin Film Transistor Compositions, and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Pigmented Polyimide Films and Methods Relating Thereto
Polyimide Film and Method of Manufacture Thereof
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Light Emitting Diode Assembly and Thermal Control Blanket and Methods Relating Thereto
Light Emitting Diode Assembly and Thermal Control Blanket and Methods Relating Thereto
Polyimide Film
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Application:
13/326,619 →
Publication:
US US20120238045A1
Colored Polyimide Films and Methods Relating Thereto
Led Light
Patent:
687,980 →
Application:
29/412,126 →
Led Light
Patent:
685,932 →
Application:
29/412,127 →
Circuit Board
Circuit Board
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Multilayer Film
Multilayer Film
Multilayer Film
Thin-Film Heating Device
Thermally Conductive Polymer Composition
Application:
15/891,822 →
Publication:
US US20180230290A1
Heating Elements and Heating Devices
Application:
16/142,504 →
Publication:
US US20190098703A1
Low Haze Polymer Films and Electronic Devices
Application:
62/749,277 →
Low Haze Polyimide Film
Application:
62/640,874 →
Thermal Substrates
Application:
62/743,241 →
Particles Dispersed W/Polymer Dispersant Having Liquid Soluble and Cross-Linkable Insoluble Segments
Patent:
6,262,152 →
Application:
09/342,808 →
Phosporylated Polymer Dispersants for Inks
Patent:
6,433,117 →
Application:
09/366,573 →
Aqueous Ink Jet Inks for Postal Metering
Patent:
6,176,908 →
Application:
09/399,260 →
Self-Dispersing Pigment and Process of Making and Use of Same
Smear Resistant Inkjet Inks
Inkjet Inks with Increased Optical Density
Inkjet Ink
Inkjet Ink Set and Method of Using Same
Inkjet inks containing crosslinked polyurethanes
Additive for High Optical Density Inkjet Ink
Ink Jet Ink
Inkjet Ink Set for Improved Color Reproduction
Pigmented Inkjet Ink and Ink Set
Inkjet Inks Containing Crosslinked Polyurethanes
Smear Resistant Inkjet Inks
Inkjet Ink Set
Inkjet Ink Set
Inkjet Ink
Inkjet Ink Set
Inkjet Ink and Ink Set
Inkjet Ink Set
Disperse Dye Black Ink
Ink Jet Ink
Inkjet ink
Inkjet Ink
Black Inkjet Ink
Urea-Terminated Polyurethane Dispersants
Inkjet Inks Containing Crosslinked Polyurethanes
Fabric pretreatment for inkjet printing
Pearlescent Slurry Concentrate for Acrylic Sheet
Amphoteric Dispersants and Their Use in Inkjet Inks
Inkjet Ink, Ink Set and Method of Using Same
Ink Jet Inks Having Improved Corrosion Resistance for Use in Ink Jet Print Heads Comprising Nickel or Nickel Alloys
Ab Block Copolymer Dispersants Having an Ink Vehicle Soluble Block
Fixer Inks for Use with Ink Jet Inks
Amphoteric Dispersants and Their Use in Inkjet Inks
Amphoteric Poyurethane Dispersants and Their Use in Inkjet Inks
Urea-Terminated Polyurethane Dispersants
Aqueous Inkjet Ink Comprising a Bleed Control Agent
Pigmented Inkjet Ink Comprising a Bleed Control Agent
Magenta Inkjet Ink, and Process of Making and Using Same
Fixer Inks for Use with Ink Jet Inks
Inkjet Ink with Polyurethane Additive Derived from Alkoxy Aromatic Diols Inks
Crosslinking Pigment Dispersion on Diblock Polymeric Dispersants
Crosslinked Pigment Dispersion Based on Structured Vinyl Polymeric Dispersants
Inkjet Ink with Self-Dispersed Pigments and Hydroxyl Terminated Polyurethane Ink Additives
Aqueous Ink-Jet Inks for Improved Adhesion to Print Substrates
Self-Dispersing Pigment Dispersions and Ink Jet Inks Containing Them
Method of Preparing Cross-Linked Colorant Dispersions
Aqueous Ink Jet Ink Comprising a Crosslinking Pigment Dispersion Based on Diblock Polymeric Dispersants
Method of Printing Using Ink Jet Inks Comprising a Crosslinking Pigment Dispersion Based on Diblock Polymeric Dispersants
Ink-Jet Ink Comprising Cross-Linked Pigment Dispersion Based on Polyurethane Dispersants
Ink-Jet Ink Comprising Cross-Linked Pigment Dispersion and a Polymeric Binder
Cross-Linked Pigment Dispersion Based on Polyurethane Dispersants
Method of Preparing Encapsulated Pigment Dispersions with Monomers Which Have a Lower Critical Solution Temperature
Aqueous Ink-Jet Inks Containing Alternating Polyurethanes as Binders
Method of Preparing Aqueous Pigment Dispersions
Inkjet Inks and Ink Sets
Ink Jet Ink Comprising Encapsulated Pigment Dispersions with Minimal Free Polymer
Aqueous Pigment Dispersions with Components to Interact with Cellulose
Pigmented Cyan Inkjet Ink
Aqueous Ink-Jet Inks Containing Mixtures of Anionic and Non-Ionic Polymeric Binders
Aqueous Ink-Jet Inks Containing Branched Polyurethanes as Binders
Aqueous Pigment Dispersions Based on Polyurethane Dispersants Having Components to Interact with Cellulose
Aqueous Inkjet Inks Containing Polyurethane Binders with Components to Interact with Cellulose
Aqueous Inkjet Inks Containing Polymeric Binders with Components to Interact with Cellulose
Aqueous Pigment Dispersions and Inkjet Inks
Method of Preparing a Pigment Press Cake and Uses Thereof
Aqueous Ink-Jet Inks Containing Random Polyurethanes as Binders
Aqueous Pigment Dispersions with Components to Interact with Cellulose
Aqueous Ink-Jet Inks Containing Two or More Binders
Pigmented Inkjet Ink Comprising Dispersed Polyurethane and Olefin Ionic Copolymer
Aqueous Ink-Jet Ink Comprising an Antifoaming Agent
Application:
15/314,570 →
Publication:
US US20170114238A1
Aqueous Ink-Jet Inks Containing Amphoteric Polyurethane as Binder
Carbon Black Pigment for Improved Durability
Application:
15/532,345 →
Publication:
US US20170362453A1
Aqueous Inkjet Ink Containing Polymeric Binders
Application:
15/532,318 →
Publication:
US US20170267886A1
Inkjet Ink Set for Printing on Offset Media
Application:
15/532,327 →
Publication:
US US20170342290A1
Ink Fluid Set for Printing on Offset Media
Application:
62/599,994 →
Aqueous Ink-Jet Ink Containing Polyurethane Binder for Printing on Textile
Cationic Modified Self-Dispersing Pigment Dispersions
Cationic Modified Self-Dispersing Pigment Dispersions and Inkjet Inks Thereof
Aqueous Ink-Jet Ink Containing Low Boiling Point Compositions
Aqueous Inks Containing Solvent Dyes
Inks with Enhanced Substrate Binding Characteristics
Patent:
6,306,994 →
Application:
09/312,225 →
Method for Forming a Cylindrical Photosensitive Element
Patent:
6,425,327 →
Application:
09/372,475 →
Method and Apparatus for Thermal Processing a Photosensitive Element
Patent:
6,797,454 →
Application:
10/069,426 →
Process for Making a Flexographic Printing Plate and a Photosensitive Element for Use in the Process
Process for Preparing a Flexographic Printing Plate from a Photopolymerizable Element
Method for Thermal Development Using Apparatus Having a Removable Support Member
Apparatus for Thermal Development Having a Removable Support Member
Method and Apparatus for Thermal Development with Development Medium Remover
Method for Thermal Development of a Photosensitive Element Using a Development Medium Having a Support
Method and Apparatus for Thermal Development Having a Textured Support Surface
Method for Thermal Development with Supporting Surface for a Development Medium
Apparatus for Thermal Development with Supporting Surface for a Development Medium
Method and Apparatus for Thermal Development with Vapor Treatment
Printing Cylinder Sleeve Assembly
Patent:
6,401,613 →
Application:
09/618,959 →
Method for Mounting Cylindrically-Shaped Printing Forms
Method for Printing a Material Onto a Substrate
Method for Printing a Pattern on a Substrate
Method for Preparing a Printing Form Using Vibrational Energy
Method of making a photopolymer sleeve blank having an integral UV transparent cushion layer for flexographic printing
Application:
11/124,400 →
Publication:
US US20050277062A1
Photosensitive Element Having Reinforcing Particles and Method for Preparing a Printing Form from the Element
Photosensitive Element Having Reinforcing Particles and Method for Preparing a Printing Form from the Element
Device and Method for Preparing Relief Printing Form
Method for Preparing Relief Printing Form
Apparatus for Preparing Relief Printing Form
Method for Thermal Development with a Conformable Support
Method and Apparatus for Thermal Treatment of Printing Surface in Relief Printing
Method and an Apparatus Having a Compressible Collar for Thermally Treating a Photosensitive Precursor
Method and an Apparatus Having a Compressible Collar for Thermally Treating a Photosensitive Precursor
Method for Preparing a Printing Form from a Photopolymerizable Element
Method for Thermal Treatment of Relief Surface for a Relief Printing Form
Method and Apparatus for Tensioning a Printing Form
Method and Apparatus for Tensioning a Printing Form
Method for Preparing a Relief Printing Form
Method and Apparatus for Securing Printing Forms on a Mountable Surface
Polymeric Gravure Printing Form and Process for Preparing the Same with Curable Composition Having a Multifunctional Urethane
Polymeric Gravure Printing Form and Process for Preparing the Same with Curable Composition Having a Multifunctional Urethane
Method for Rebalancing a Multicomponent Solvent Solution
Method for Making a Cylindrically-Shaped Element for Use in Printing
Printing Form and Process for Preparing the Printing Form with Curable Composition Having Solvent-Free Epoxy Resin
Printing Form and Process for Preparing the Printing Form with Curable Composition Having Solvent-Free Epoxy Resin
Printing Form Precursor Having Elastomeric Cap Layer and a Method of Preparing a Printing Form from the Precursor
Printing Form Precursor Having Elastomeric Cap Layer and a Method of Preparing a Printing Form from the Precursor
Printing Form Precursor Having Indicia and a Method for Preparing a Printing Form from the Precursor
Method for Preparing a Relief Printing Form
Fluorinated Aryl Epoxide Compounds
Composite Printing Form Precursor and Method for Preparing a Printing Form Precursor for Treatment
Composite Printing Form Precursor and Method for Preparing a Printing Form Precursor for Treatment
Printing Form Precursor, a Process for Making the Precursor, and a Method for Preparing a Printing Form from the Precursor
Flexographic Printing Form Having Microcell Patterns on Surface
Application:
62/676,473 →
Melt-Processible, Thermoplastic Random Copolyimides Having Recoverable Crystallinity and Associated Processes
Melt-Processible, Thermoplastic Random Copolyimides Having Recoverable Crystallinity and Associated Processes
Patent:
6,469,126 →
Application:
09/741,943 →
Photoresists, Polymers and Processes for Microlithography
Photoresists, Polymers and Processes for Microlithography
Patent:
6,593,058 →
Application:
09/806,096 →
Composite Photosensitive Element
Patent:
6,268,109 →
Application:
09/415,971 →
Real-Time Processing of a Synchronous or Isochronous Data Stream in the Presence of Gaps in the Data Stream Due to Queue Underflow or Overflow
Polymers for Photoresist Compositions for Microlithography
Wet Lamination of Photopolymerizable Dry Films Onto Substrates and Compositions Relating Thereto
Application:
12/179,722 →
Publication:
US US20100037799A1
Thermal Imaging Process and Products Using Image Rigidification
Patent:
6,294,308 →
Application:
09/419,680 →
Fire Resistant Back-Sheet for Photovoltaic Module
Back Contact Photovoltaic Module with Integrated Circuitry
Integrated Back-Sheet Assembly for Photovoltaic Module
Integrated Back-Sheets for Back-Contact Solar Cell Modules
Application:
15/127,466 →
Publication:
US US20170133537A1
Vinyl Fluoride Polymerization and Aqueous Dispersion of Vinyl Fluoride Polymer
Liquid Fluoropolymer Coating Composition and Fluoropolymer Coated Film
Wallpaper
Transparent Fluoropolymer Films
Application:
62/675,924 →
Photoresist Compositions and Processes for Preparing the Same
Low-Polydispersity Photoimageable Acrylic Polymers, Photoresists and Processes for Microlithography
Synthesis of Trithiocarbonate Raft Agents and Intermediates Thereof
Photoroesists Comprising Polymers Derived from Fluoroalcohol-Substituted Polycyclic Monomers
Image Sensor Made from Organic Semiconductors
Patent:
6,300,612 →
Application:
09/241,657 →
Organic Diodes with Switchable Photosensitivity Useful in Photodetectors
Patent:
6,303,943 →
Application:
09/241,660 →
Polymers for Use in Electronic Devices
Application:
62/715,422 →
Low-Color Polymers for Use in Electronic Devices
Application:
62/653,591 →
Low-Color Polymers for Use in Electronic Devices
Application:
62/659,322 →
Polymers for Use in Electronic Devices
Application:
62/672,272 →
Polymers for Use in Electronic Devices
Application:
62/715,889 →
Polymers for Use in Electronic Devices
Application:
62/715,904 →
Polyimide-Based Polymer Thick Film Resistor Composition
Conductive Paste Composition and Semiconductor Devices Made Therewith
Electrical Connections for Wearables and Other Articles
Conductive Paste for Bonding and Manufacturing Method of Electric Device Using Thereof
Application:
16/173,393 →
Publication:
US US20190131029A1
Conductive Paste and Electrical Component
Application:
62/756,856 →
Solar Cell
Application:
62/797,611 →
Solar Cell
Application:
62/797,636 →
Stretchable Printed Heaters for Wearables and Other Articles
Application:
16/166,726 →
Publication:
US US20200128627A1
Phototherapy Garment for Treating Neonatal Jaundice and Other Medical Conditions
Application:
62/795,879 →
Thermally Conductive Material Comprising Ionic Liquid and Electrical Devices Made Therewith
Application:
62/755,808 →
Multilayer Polyimide Film
Application:
62/760,523 →
Multilayer Polyamide Imide-Polyimide Film
Application:
62/760,506 →
Multilayer Polyimide Film
Application:
62/760,499 →
Multilayer Polyimide Film
Application:
62/760,488 →
Multilayer Polyimide Film
Application:
62/760,478 →
Textile Printing Fluid Set Containing a Pretreatment and a Mixture of Pigment and Disperse Dye
Application:
62/781,917 →
Flexographic Printing Form Precursor and a Method for Making the Precursor
Application:
62/778,007 →
Low Haze Polyimide Film
Polyimide Films and Electronic Devices
Application:
62/809,090 →
Method of Manufacturing an Electronic Device and Conductive Paste for the Same
Application:
16/288,040 →
Publication:
US US20190272930A1
Puncture-Resistant Sheet Heater and Structures Made Therewith
Application:
62/822,404 →
Self-Limiting Sheet Heater and Structures Made Therewith
Application:
62/822,414 →
Thick Film Silver Paste Containing Copper and Lead-Tellurium-Oxide and Its Use in the Manufacture of Semiconductor Devices
Apparatus for Thermal Development with a Conformable Support
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 28, 2013
From: DRYSDALE, NEVILLE EVERTON
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 031691/0263 →
Assignment of Assignor's Interest
Nov 28, 2013
From: DRYSDALE, NEVILLE EVERTON
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 031691/0270 →
Assignment of Assignor's Interest
Nov 28, 2013
From: DRYSDALE, NEVILLE EVERTON
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 031691/0107 →
Assignment of Assignor's Interest
May 15, 2014
From: BLANCHET, GRACIELA BEATRIZ; JAYCOX, GARY DELMAR; TASSI, NANCY G.
To: E. I. DUPONT DE NEMOURS AND COMPANY
Reel/Frame 032896/0528 →
Assignment of Assignor's Interest
Mar 30, 2021
From: DUPONT ELECTRONICS, INC.
To: SOLAR PASTE, LLC
Reel/Frame 055766/0478 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →
Change of Name
Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →