Conductive paste composition with synthetic clay additive and its use in the manufacture of semiconductor devices
View Patent ↗A conductive paste composition contains a source of an electrically conductive metal, a fusible material, a synthetic clay additive, and an optional etchant additive, dispersed in an organic medium. An article such as a photovoltaic cell is formed by a process having the steps of deposition of the paste composition on a semiconductor substrate by a process such as screen printing and firing the paste to remove the organic medium and sinter the metal and fusible material. The synthetic clay additive aids in establishing a low resistance electrical contact between the front side metallization and underlying semiconductor substrate during firing.
1. A paste composition comprising in admixture:
a) about 70 to 96% by weight based on solids of electrically conductive silver metal powder;
b) about 0.1 to 15% by weight based on solids of a fusible material;
c) about 0.1 to 2% by weight based on solids of a nanoscale synthetic clay additive;
d) 0 to about 15% by weight based on solids of one or more etchant additives; and
e) an organic medium.
2. The paste composition of claim 1 , wherein the electrically conductive silver metal powder is present in an amount of about 80 to 95% by weight based on solids.
3. The paste composition of claim 1 , wherein the fusible material is present in an amount of about 2 to 8% by weight based on solids.
4. The paste composition of claim 1 , wherein the synthetic clay additive is a synthetic smectite.
5. The paste composition of claim 4 , wherein the synthetic clay additive is a layered hydrous magnesium lithium silicate comprising particles of a compound having the empirical chemical formula:
Na + 0.7 [(Si 8 Mg 5.5 Li 0.3 )O 20 (OH) 4 ] −0.7 ,
and in which at least a portion of the hydroxyl groups are substituted by fluorine.
6. The paste composition of claim 4 , wherein the synthetic clay additive is a layered hydrous magnesium lithium silicate comprising particles of a compound having the empirical chemical formula:
Na + 0.7 [(Si 8 Mg 5.5 Li 0.3 )O 20 (OH) 4 ] −0.7 ,
the particles of the silicate having surfaces that are modified by inclusion thereon of an alkali metal pyrophosphate.
7. The paste composition of claim 4 , wherein the synthetic clay additive is a layered hydrous magnesium lithium silicate comprising particles of a compound having the empirical formula:
Na + 0.7 [(Si 8 Mg 5.5 Li 0.3 )O 20 (OH) 4 ] −0.7 .
8. The paste composition of claim 1 , wherein the synthetic clay additive comprises particles having an average diameter in the range of 10 to 40 nm and an average thickness in the range of 0.5 to 2.0 nm.
9. The paste composition of claim 1 , wherein the synthetic clay additive is present in an amount of about 0.1 to 1% by weight based on solids.
10. The paste composition of claim 1 , wherein the etchant additive comprises at least one of a metal, a metal oxide, a precursor compound, or a mixture thereof, and wherein: (a) the metal is at least one of Zn, Li, Ag, Mg, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu, or Cr, or an alloy or mixture thereof; (b) the metal oxide is an oxide of one or more of the metals of (a); and (c) the precursor compound is a substance adapted to react to form a metal of (a) or a metal oxide of (b) upon firing.
11. The paste composition of claim 10 , wherein the etchant additive comprises at least one of zinc oxide, zinc metal, lithium carbonate, lithium oxide, lithium phosphate, or a mixture thereof.