METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND CONDUCTIVE PASTE FOR THE SAME
The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.
1 . A method of manufacturing an electronic device comprising the steps of:
preparing a substrate comprising an electrically conductive layer;
applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof;
mounting an electrical component on the applied conductive paste; and
heating the conductive paste to bond the electrically conductive layer and the electrical component.
2 . The method of claim 1 , wherein particle diameter (D50) of the metal powder is 0.01 to 3 μm.
3 . The method of claim 1 , wherein the metal powder is selected from the group consisting of silver, copper, gold, nickel, palladium, platinum, rhodium, aluminum, an alloy thereof and a mixture thereof.
4 . The method of claim 1 , wherein the allyl ether copolymer is a copolymer of a poly carboxylic acid and an ally ether.
5 . The method of claim 1 , wherein the allyl ether copolymer has one of the following structures:
wherein p is 5 to 60, wherein z is 4 to 80 and wherein R is hydrogen or alkyl; or
wherein n is 1 to 78, wherein m is 5 to 100, and wherein R is hydrogen or alkyl.
6 . The method of claim 1 , wherein the polyhydroxy fatty acid has the following structure:
wherein q is 1 to 10, and wherein x+y is 5 to 30.
7 . The method of claim 1 , wherein the polyhydroxy fatty acid comprises polyhydroxystearic acid.
8 . The method of claim 1 , wherein the conductive paste further comprises 0.01 to 1.0 parts by weight of a cellulose, a resin or a mixture thereof.
9 . The method of claim 1 , wherein the electrically conductive layer is a metal layer.
10 . The method of claim 1 , wherein the electrical component is selected from the group consisting of a semiconductor chip, an integrated circuit (IC) chip, a chip resistor, a chip capacitor, a chip inductor, a sensor chip, and a combination thereof.
11 . The method of claim 1 , wherein the electrical component comprises a metallization layer, and wherein the metallization layer is selected from the group consisting of copper, silver, gold, nickel, palladium, platinum, an alloy thereof and a mixture thereof.
12 . The method of claim 1 , wherein the heating temperature to bond the electronic component and the conductive layer is 140 to 400° C.
13 . A conductive paste for bonding, comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.01 to 5 parts by weight of a dispersant, wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof.
14 . The conductive paste of claim 13 , wherein the particle diameter (D50) of the metal powder is 0.01 to 3 μm.
15 . The conductive paste of claim 13 , wherein the metal powder is selected from the group consisting of silver, copper, gold, nickel, palladium, platinum, rhodium, aluminum, an alloy thereof and a mixture thereof.
16 . The conductive paste of claim 13 , wherein the allyl ether copolymer is a copolymer of a poly carboxylic acid and an ally ether.
17 . The conductive paste of claim 13 , wherein the allyl ether copolymer has one of the following structures:
wherein p is 5 to 60, wherein z is 4 to 80 and wherein R is hydrogen or alkyl; or
wherein n is 1 to 78, wherein m is 5 to 100, and wherein R is hydrogen or alkyl.
18 . The conductive paste of claim 13 , wherein the polyhydroxy fatty acid has the following structure:
wherein q is 1 to 10, and wherein x+y is 5 to 30.
19 . The conductive paste of claim 13 , wherein the polyhydroxy fatty acid comprises polyhydroxystearic acid.
20 . The conductive paste of claim 13 , wherein the conductive paste further comprises 0.01 to 1.0 parts by weight of a cellulose, a resin or a mixture thereof.