The present disclosure is directed to a circuit board having a first polyimide coverlay, a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply, a third imaged metal layer, a second electrically insulating layer, a forth imaged metal layer and a second polyimide coverlay. The first polyimide coverlay, the polyimide bondply and the second polyimide coverlay are derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, and 10 to 80 mole % 4,4′-oxydianiline.
1. A circuit board, comprising in the following order:
a. a first polyimide coverlay comprising a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide;
b. a first imaged metal layer
c. a first electrically insulating layer having a first side and a second side; the first side of the first electrically insulating layer is next to the first imaged metal layer
d. a second imaged metal layer; the second side of the first electrically insulating layer is next to the second imaged metal layer;
e. a polyimide bondply comprising a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide;
f. a third imaged metal layer;
g. a second electrically insulating layer having a first side and a second side; the first side of the second electrically insulating layer is next to the third imaged metal layer
h. a fourth imaged metal layer; the second side of the second electrically insulating layer is next to the fourth imaged metal layer;
i. a second polyimide coverlay comprising a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide;
wherein the polyimide bondply is in direct contact with the second imaged metal layer and exposed areas of the second side of the first electrically insulating layer;
and in direct contact with the third imaged metal layer and exposed areas of the first side of the second electrically insulating layer;
wherein the polyimide bondply has a peel strength from 0.7 to 2 N/mm as measured in accordance with IPC-TM-650-2.4.9d, when
i) the first imaged metal layer, the first electrically insulating layer and the second imaged metal layer;
ii) the polyimide bondply; and
iii) the third imaged metal layer, the second electrically insulating layer and the fourth imaged metal layer
are laminated at a lamination temperature from 300 to 380° C. and a pressure from 150 psi (10.55 Kg/cm) to 400 psi (28.13 Kg/cm);
wherein the first polyimide coverlay is in direct contact with the first imaged metal layer and exposed areas of the first side of the first electrically insulating layer and wherein the second polyimide coverlay is in direct contact with the fourth imaged metal layer and exposed areas of the second side of the second electrically insulating layer; and
wherein the first electrically insulating layer and the second electrically insulating layer are any electrically insulating material that can withstand the lamination temperature from 320 to 380° C.
2. The circuit board of claim 1 , wherein the polyimide bondply comprises from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof.
3. The circuit board of claim 1 , wherein the first electrically insulating layer, the second electrically insulating layer or both comprise from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof.
4. The circuit board of claim 1 , wherein the first imaged metal layer, the second imaged metal layer, the third imaged metal layer and the fourth imaged metal layer are copper.
5. The circuit board of claim 1 , wherein the polyimide bondply comprises from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof;
the first electrically insulating layer, the second electrically insulating layer or both comprise from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof; and
the first imaged metal layer, the second imaged metal layer, the third imaged metal layer and the fourth imaged metal layer are copper.
6. The circuit board of claim 1 , wherein the first electrically insulating layer comprises a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide, or a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and is in direct contact with the first imaged metal layer, the second imaged metal layer and exposed areas of the polyimide bondply.
7. The circuit board of claim 1 , wherein the second electrically insulating layer comprises a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide, or a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and is in direct contact with the fourth imaged metal layer, the third imaged metal layer and exposed areas of the polyimide bondply.
8. The circuit board of claim 1 , wherein the first electrically insulating layer comprises a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide, or a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and is in direct contact with the first imaged metal layer, the second imaged metal layer and exposed areas of the polyimide bondply; and
wherein the second electrically insulating layer comprises a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide, or a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and is in direct contact with the fourth imaged metal layer, the third imaged metal layer and exposed areas of the polyimide bondply.
9. The circuit board of claim 8 , wherein the polyimide bondply comprises from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof.
10. The circuit board of claim 8 , wherein the first electrically insulating layer, the second electrically insulating layer or both comprise from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof.
11. The circuit board of claim 8 , wherein the first imaged metal layer, the second imaged metal layer, the third imaged metal layer and the fourth imaged metal layer are copper.
12. The circuit board of claim 8 , wherein the polyimide bondply comprises from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof;
the first electrically insulating layer, the second electrically insulating layer or both comprise from 1 to 55 weight percent of a thermally conductive filler, dielectric fillers or mixtures thereof; and
the first imaged metal layer, the second imaged metal layer, the third imaged metal layer and the fourth imaged metal layer are copper.
13. The circuit board of claim 8 , wherein the first polyimide coverlay, the second polyimide coverlay or both comprise a pigment and a matting agent.
14. The circuit board of claim 13 , wherein the pigment and the matting agent are both a low conductivity carbon black and the low conductivity carbon black is present in the first polyimide coverlay, the second polyimide coverlay or both in an amount from 2 to 20 weight percent.
15. The circuit board of claim 13 , wherein the matting agent is polyimide particles.
16. The circuit board of claim 8 , wherein the first polyimide coverlay, the second polyimide coverlay or both comprise a low conductivity carbon black and a matting agent.
17. The circuit board of claim 8 wherein the first electrically insulating layer, the second electrically insulating layer or both comprise a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 40 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 60 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide.
18. The circuit board of claim 8 wherein the first electrically insulating layer, the second electrically insulating layer or both comprise a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 30 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 70 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide.
19. The circuit board of claim 1 , wherein the first polyimide coverlay, the second polyimide coverlay or both comprise a pigment and a matting agent.
20. The circuit board of claim 19 , wherein the pigment and the matting agent are both a low conductivity carbon black and the low conductivity carbon black is present in the first polyimide coverlay, the second polyimide coverlay or both in an amount from 2 to 20 weight percent.
21. The circuit board of claim 19 , wherein the matting agent is polyimide particles.
22. The circuit board of claim 1 , wherein the first polyimide coverlay, the second polyimide coverlay or both comprise a low conductivity carbon black and a matting agent.
23. The circuit board of claim 1 wherein the first polyimide coverlay, the second polyimide coverlay and the polyimide bondply each comprise a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 40 to 90 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 10 to 60 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide.
24. The circuit board of claim 1 wherein the first polyimide coverlay, the second polyimide coverlay and the polyimide bondply each comprise a polyimide derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, based upon a total dianhydride content of the polyimide, 20 to 30 mole % 2,2′-bis(trifluoromethyl) benzidine, based upon a total diamine content of the polyimide, and 70 to 80 mole % 4,4′-oxydianiline, based upon the total diamine content of the polyimide.