IP Library Granted Patent US 7,998,371
Granted Patent B2
US 7,998,371 · App. 12/839,653 · Granted Aug 16, 2011

Conductive compositions and processes for use in the manufacture of semiconductor devices: Mg-containing additive

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Quick Facts
Patent No.
US 7,998,371
App. No.
12/839,653
Granted
Aug 16, 2011
Kind
B2
Abstract

Described herein are a silicon semiconductor device and a conductive silver paste for use in the front side of a solar cell device.

Claims (46)

1. A thick film composition comprising:

a) an electrically conductive material selected from the group consisting of silver metal, silver oxide, silver salts and mixtures thereof;

b) glass frit comprising 0.1-8 wt % SiO 2 , 8-25 wt % B 2 O 3 , 0-15 wt % BiF 3 and 28-85 wt % Bi 2 O 3 , based on the wt % of the total glass composition;

c) a Mg-containing additive, wherein the Mg-containing additive-is selected from the group consisting of metal oxides of Mg, any compounds that can generate metal oxides of Mg upon firing and mixtures thereof, wherein said Mg-containing additive is 0.1 wt % to 10 wt % of the total composition; and

d) an organic medium, wherein said electrically conductive material, said glass frit and said Mg-containing additive are all dispersed in said organic medium.

2. The composition of claim 1 , wherein the Mg-containing additive is MgO.

3. The composition of claim 1 , wherein the thick film composition further comprises an additional additive selected from the group consisting of: (a) a metal wherein said metal is selected from Zn, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu and Cr; (b) a metal oxide of one or more of the metals selected from Zn, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu and Cr; (c) any compounds that can generate the metal oxides of (b) upon firing; and (d) mixtures thereof.

4. The composition of claim 1 , wherein the glass frit further comprises one or more components selected from the group consisting of P 2 O 5 , GeO 2 , and V 2 O 5 .

5. The composition of claim 1 , wherein the glass frit further comprises one or more of Al 2 O 3 , CeO 2 , SnO 2 , and CaO, and wherein, based on weight percent total glass composition, the amount of Al 2 O 3 , CeO 2 , SnO 2 , and CaO is less than 6 wt %.

6. The composition of claim 5 , wherein, based on weight percent total glass composition, the amount of Al 2 O 3 , CeO 2 , SnO 2 , and CaO is less than 1.5 wt %.

7. The composition of claim 1 , wherein, based on weight percent total glass composition, the amount of BiF 3 and Bi 2 O 3 is less than 83 wt %.

8. The composition of claim 7 , wherein, based on weight percent total glass composition, the amount of BiF 3 and Bi 2 O 3 is less than 72 wt %.

9. The composition of claim 7 , wherein the glass frit further comprises Na 2 O, Li 2 O, and Ag 2 O, wherein, based on weight percent total glass composition, the amount of (Bi 2 O 3 +BiF 3 )/(Na 2 O+Li 2 O+Ag 2 O) is greater than 14.

10. The composition of claim 1 , wherein the glass frit further comprises Na 2 O, Li 2 O, and Ag 2 O, wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 5 wt %.

11. The composition of claim 10 , wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 2.0 wt %.

12. The composition of claim 1 , wherein the glass frit further comprises one or both of Al 2 O 3 and B 2 O 3 , wherein, based on weight percent total glass composition, the amount of SiO 2 , Al 2 O 3 , and B 2 O 3 is less than 31 wt %.

13. A structure comprising:

(i) a thick film composition comprising:

a) an electrically conductive material selected from the group consisting of silver metal, silver oxide, silver salts and mixtures thereof;

b) glass frit comprising 0.1-8 wt % SiO 2 , 8-25 wt % B 2 O 3 , 0-15 wt % BiF 3 and 28-85 wt % Bi 2 O 3 , based on the wt % of the total glass composition;

c) a Mg-containing additive, wherein the Mg-containing additive-is selected from the group consisting of metal oxides of Mg, any compounds that can generate metal oxides of Mg upon firing and mixtures thereof, wherein said Mg-containing additive is 0.1 wt % to 10 wt % of the total composition; and

d) an organic medium, wherein said electrically conductive material, said glass frit and said Mg-containing additive are all dispersed in said organic medium;

(ii) one or more substrates; and

(iii) one or more insulating films,

wherein, upon firing, the organic medium is removed and the glass frit and silver powder are sintered, and wherein the structure is a semiconductor device.

14. The structure of claim 13 , wherein the Mg-containing additive is MgO.

15. The structure of claim 13 , wherein, upon firing, the one or more insulating films are penetrated by components of the thick film composition.

16. The structure of claim 13 , wherein the semiconductor device is a solar cell.

17. The structure of claim 16 , wherein the insulating film comprises one or more components selected from: titanium oxide, silicon nitride, SiNx:H, silicon oxide, and silicon oxide/titanium oxide.

18. The structure of claim 17 , wherein, upon firing, the one or more insulating films is penetrated by components of the thick film composition.

19. The structure of claim 13 , wherein the thick film composition further comprises an additional additive selected from the group consisting of: (a) a metal wherein said metal is selected from Zn, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu and Cr; (b) a metal oxide of one or more of the metals selected from Zn, Gd, Ce, Zr, Ti, Mn, Sn, Ru, Co, Fe, Cu and Cr; (c) any compounds that can generate the metal oxides of (b) upon firing; and (d) mixtures thereof.

20. The structure of claim 13 , wherein the glass frit further comprises one or more components selected from the group consisting of P 2 O 5 , GeO 2 , and V 2 O 5 .

21. The structure of claim 13 , wherein the one or more insulating films comprise one or more components selected from: titanium oxide, silicon nitride, SiNx:H, silicon oxide, and silicon oxide/titanium oxide.

22. The structure of claim 13 , wherein the glass frit further comprises one or more of Al 2 O 3 , CeO 2 , SnO 2 , and CaO, wherein, based on weight percent total glass composition, the amount of Al 2 O 3 , CeO 2 , SnO 2 , and CaO is less than 6 wt %.

23. The structure of claim 22 , wherein, based on weight percent total glass composition, the amount of Al 2 O 3 , CeO 2 , SnO 2 , and CaO is less than 1.5 wt %.

24. The structure of claim 22 , wherein the glass frit further comprises one or more of Na 2 O, Li 2 O, and Ag 2 O, wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 5 wt %.

25. The structure of claim 22 , wherein the glass frit further comprises one or both of Al 2 O 3 and B 2 O 3 , wherein, based on weight percent total glass composition, the amount of SiO 2 , Al 2 O 3 , and B 2 O 3 is less than 31 wt %.

26. The structure of claim 13 , wherein based on weight percent total glass composition, the amount of BiF 3 and Bi 2 O 3 is less than 83 wt %.

27. The structure of claim 26 , wherein, based on weight percent total glass composition, the amount of BiF 3 and Bi 2 O 3 is less than 72 wt %.

28. The structure of claim 26 , wherein the glass frit further comprises one or more of Al 2 O 3 , CeO 2 , SnO 2 , and CaO, wherein, based on weight percent total glass composition, the amount of Al 2 O 3 , CeO 2 , SnO 2 , and CaO is less than 6 wt %.

29. The structure of claim 26 , wherein the glass frit further comprises one or more of Na 2 O, Li 2 O, and Ag 2 O, wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 5 wt %.

30. The structure of claim 13 , wherein the glass frit further comprises one or more of Na 2 O, Li 2 O, and Ag 2 O, wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 5 wt %.

31. The structure of claim 30 , wherein, based on weight percent total glass composition, the amount of Na 2 O, Li 2 O, and Ag 2 O is less than 2.0 wt %.

32. The structure of claim 30 , wherein, based on weight percent total glass composition, the amount of (Bi 2 O 3 +BiF 3 )/(Na 2 O+Li 2 O+Ag 2 O) is greater than 14.

33. The structure of claim 30 , wherein the glass frit further comprises one or both of Al 2 O 3 and B 2 O 3 , wherein, based on weight percent total glass composition, the amount of SiO 2 , Al 2 O 3 , and B 2 O 3 is less than 31 wt %.

34. The structure of claim 13 , wherein the glass frit further comprises one or both of Al 2 O 3 and B 2 O 3 , wherein, based on weight percent total glass composition, the amount of SiO 2 , Al 2 O 3 , and B 2 O 3 is less than 31 wt %.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2021
From: DUPONT ELECTRONICS, INC.
To: SOLAR PASTE, LLC
Reel/Frame 055766/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →