Patent Assignment
Reel/Frame 070567/0231
Change of Name
Recorded: 2025-03-20
Pages: 6
Assignor
DU PONT CHINA LIMITED
Executed: 2023-12-12
Assignee
CELANESE MERCURY HOLDINGS INC.
BUILDING 304, EXPERIMENTAL STATION, 200 POWDER MILL ROAD, WILMINGTON, DELAWARE, 19803
Covered Properties
(96)
Thick-Film Conductor Paste for Automotive Glass
Thick Film Conductor Compositions for Use in Membrane Switch Applications
Thick Film Compositions for Use in Electroluminescent Applications
Ink Jet Printable Thick Film Compositions and Processes
Composition of Conductive Paste
Aqueous Developable Photoimageable Compositions for Use in Photo-Patterning Methods
Thick Film Conductor Case Compositions for Ltcc Tape
Thick Film Conductor Paste Compositions for Ltcc Tape in Microwave Applications
Thick Film Conductor Compositions and the Use Thereof in Ltcc Circuits and Devices
Thick Film Paste via Fill Composition for Use in Ltcc Applications
Lead Free Glass(Es), Thick Film Paste(S), Tape Composition(S) and Low Temperature Cofired Ceramic Devices Made Therefrom
Thick Film Conductor Composition(S) and Processing Technology Thereof for Use in Multilayer Electronic Circuits and Devices
Process for Making Highly Dispersible Spherical Silver Powder Particles and Silver Particles Formed Therefrom
Conductor Paste for Ceramic Substrate and Electric Circuit
Conductive Paste for Solid Electorlytic Capacitor Electrode and Process for Producing Solid Electolytic Capacitor Electrode Using the Same
Device chip carriers, modules, and methods of forming thereof
Conductive Composition for Black Bus Electrode, and Front Panel of Plasma Display Panel
Thick Film Conductor Paste Composition for Ltcc Tape in Microwave Applications
Elecrically Conductive Adhesive
Non-Lead Resistor Composition
Preparation of Silver Spheres by the Reduction of Silver Polyamine Complexes
High Conductivity Polymer Thick Film Silver Conductor Composition for Use in Rfid and Other Applications
Photosensitive Paste and Process for Production of Pattern Using the Same
Method for Producing Dispersed, Crystalline, Stable to Oxidation Copper Particles
Lead-Free Resistive Composition
Resistor Compositions Using a Cu-Containing Glass Frit
Co-Processable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices
Electrode and Method for Manufacturing the Same
Nickel-Gold Plateable Thick Film Silver Paste
Non-Lead Resistor Composition
Conductor Paste for Ceramic Substrate and Electric Circuit
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Uv-Curable Polymer Thick Film Dielectric Compositions with Excellent Adhesion to Ito
Polymer Thick Film Silver Electrode Composition for Use as a Plating Link
Mixed-Metal System Conductors for Ltcc (Low-Temperature Co-Fired Ceramic)
Silver-Palladium Alloy Containing Conductor Paste for Ceramic Substrate and Electric Circuit
Method of Manufacturing High Frequency Receiving and/or Transmitting Devices from Low Temperature Co Fired Ceramic Materials and Devices Made Therefrom
Method of Making Non-Hollow, Non-Fragmented Spherical Metal or Metal Alloy Particles
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Electrode and Method for Manufacturing the Same
Method for Forming Front Electrode of Pdp
Electrode and Method for Manufacturing the Same
Ink Jettable Silver/Silver Chloride Compositions
Polymer Thick Film Solder Alloy/Metal Conductor Compositions
Low Temperature Fireable Thick Film Silver Paste
Low Temperature Co-Fired Ceramic Structure for High Frequency Applications and Process for Making Same
Method of Manufacturing a Resistor Paste
Method of Manufacturing Copper Electrode
Photonic Sintering of Polymer Thick Film Conductor Compositions
Lamination of Polymer Thick Film Conductor Compositions
Electrically Conductive Paste Composition
Polymer Thick Film Solder Alloy Conductor Composition
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Non-Firing Type Electrode
Low Temperature Co-Fired Ceramic (Ltcc) System in a Package (Sip) Configurations for Microwave/Millimeter Wave Packaging Applications
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Polymer Thick Film Positive Temperature Coefficient Carbon Composition
Photonic Sintering of Polymer Thick Film Copper Conductor Compositions
Uv-Curable Thermoformable Dielectric for Thermoformable Circuits
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Stretchable Polymer Thick Film Silver Conductor for Highly Permeable Substrates
Conductive Metal Composition
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Lamination of Polymer Thick Film Conductor Compositions
Method of Manufacturing Non-Firing Type Electrode
Mixed-Metal System Conductors for Use in Low-Temperature Co-Fired Ceramic Circuits and Devices
Flexible White Reflective Dielectric for Electronic Circuits
Heat-Curable Polymer Paste
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Photonic Sintering of a Polymer Thick Film Copper Conductor Composition
Photonic Sintering of a Solderable Polymer Thick Film Copper Conductor Composition
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Flexible White Reflective Dielectric for Electronic Circuits
Polyimide-Based Polymer Thick Film Compositions
Polyimide-Based Polymer Thick Film Resistor Composition
Chip Resistor
Electronic Component
Conductive Paste for Bonding
Conductive Paste For Bonding
Articles and Substrates Providing Improved Performance of Printable Electronics
Hand and Foot Heaters
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Polyimide-Based Polymer Thick Film Resistor Composition
Fine Silver Particle Dispersion
Flexible Electrically Conductive Pastes and Devices Made Therewith
Polymer Thick Film Dielectric Paste Composition
Dielectric Filter and Method for Manufacturing the Same
Method of Manufacturing an Electronic Device
Stretchable Polymer Thick Film Carbon Black Composition for Wearable Heaters
Stretchable Conductive Fluoroelastomer Paste Composition
Conductive Paste
Application:
63/580,781 →
Sintering Methods
Application:
63/609,899 →
Semiconductor Device and Methods of Manufacturing a Semiconductor Device
Application:
63/612,389 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2009
From: MATSUNO, HISASHI; BARKER, MICHAEL F.
To: DUPONT KABUSHIKI KAISHA (DKK)
Reel/Frame 023583/0141 →
Assignment of Assignor's Interest
Dec 1, 2009
From: DUPONT KABUSHIKI KAISHA (DKK)
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 023583/0151 →
Assignment of Assignor's Interest
Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest
Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →