Polymer thick film solder alloy/metal conductor compositions

1. A polymer thick film conductor composition comprising:

(a) 35 to 94 wt % solder alloy powder selected from the group consisting of (i) a tin, silver, and copper alloy powder, (ii) a tin and bismuth alloy powder, and (iii) mixtures thereof, said alloy powder consisting of particles possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.20 to 1.3 m 2 /g;

(b) 1 to 30 wt % metal selected from the group consisting of silver, copper, gold, aluminum and mixtures thereof, said metal consisting of particles possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.10 to 2.3 m 2 /g; and

(c) 5 to 35 wt % organic medium comprising:

(1) a resin that is a vinyl co-polymer resin of vinylidene chloride and acrylonitrile or a phenoxy resin; dissolved in

(2) organic solvent comprising a dibasic ester or glycol ether;

with the proviso that if said resin is a phenoxy resin said metal is silver, wherein said solder alloy powder and said metal are dispersed in said organic medium and wherein the wt % are based on the total weight of the polymer thick film conductor composition.

2. The composition of claim 1 , wherein said metal is silver, copper, or a mixture thereof.

3. The composition of claim 2 , wherein said metal is silver.

4. The composition of claim 1 , wherein said solder alloy powder is a tin, silver, and copper alloy that contains at least 90% tin by weight and wherein said organic medium contains 16 to 30% vinyl co-polymer or phenoxy resin by weight.

5. The composition of claim 1 , wherein said solder alloy powder is a tin and bismuth alloy that contains at least 40% tin by weight, and wherein said organic medium contains 16 to 25% vinyl co-polymer resin by weight.

6. The composition of claim 1 , wherein the boiling point of the organic solvent is in the range of 180° C. to 250° C.

7. The composition of claim 1 , said composition comprising 60 to 75 wt % solder ahoy powder and 15 to 30 wt % metal.

8. The composition of claim 7 , wherein said metal is silver, copper, or a mixture thereof.

9. The composition of claim 8 , wherein said metal is silver.

10. The composition of claim 7 , wherein said solder alloy powder is a tin, silver, and copper alloy that contains at least 90% tin by weight and wherein said organic medium contains 16 to 30% vinyl co-polymer or phenoxy resin by weight.

11. The composition of clam 7 , wherein said solder alloy powder is a tin and bismuth alloy that contains at least 40% tin by weight, and wherein said organic medium contains 16 to 25% vinyl co-polymer resin by weight.

12. An electrical circuit comprising an electrode formed from the composition of any of claims 1 - 11 , wherein the composition has been dried to form the electrode.

13. A method of forming an electrode in an electrical circuit, comprising:

a) preparing the polymer thick film conductor composition of claim 1 ;

b) applying the polymer thick film conductor composition onto a substrate; and

c) drying the polymer thick film conductor composition to form the electrode.

14. An electrical circuit comprising an electrode formed by the method of claim 13 .