Patent Assignment
Reel/Frame 062201/0889
Assignment of Assignor's Interest
Recorded: 2022-12-20
Pages: 23
Assignor
DUPONT ELECTRONICS, INC.
Executed: 2022-11-01
Assignee
DU PONT CHINA LIMITED
BUILDING 304, EXPERIMENTAL STATION, 200 POWDER MILL ROAD, WILMINGTON, DELAWARE, 19803
Covered Properties
(50)
Method of Making Non-Hollow, Non-Fragmented Spherical Metal or Metal Alloy Particles
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Electrode and Method for Manufacturing the Same
Electrode and Method for Manufacturing the Same
Polymer Thick Film Solder Alloy/Metal Conductor Compositions
Conductive Metal Ink
Low Temperature Fireable Thick Film Silver Paste
Low Temperature Co-Fired Ceramic Structure for High Frequency Applications and Process for Making Same
Method of Manufacturing a Resistor Paste
Thick Film Paste and Use Thereof
Method of Manufacturing Copper Electrode
Photonic Sintering of Polymer Thick Film Conductor Compositions
Lamination of Polymer Thick Film Conductor Compositions
Electrically Conductive Paste Composition
Polymer Thick Film Solder Alloy Conductor Composition
Moisture Barrier Layer Dielectric for Thermoformable Circuits
Method of Manufacturing Non-Firing Type Electrode
Method of Manufacturing Non-Firing Type Electrode
Low Temperature Co-Fired Ceramic (Ltcc) System in a Package (Sip) Configurations for Microwave/Millimeter Wave Packaging Applications
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Polymer Thick Film Positive Temperature Coefficient Carbon Composition
Photonic Sintering of Polymer Thick Film Copper Conductor Compositions
Moisture Barrier Layer Dielectric for Thermoformable Circuits
Uv-Curable Thermoformable Dielectric for Thermoformable Circuits
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Stretchable Polymer Thick Film Silver Conductor for Highly Permeable Substrates
Conductive Metal Composition
Thick Film Resistive Heater Compositions Comprising Ag & RUO2, and Methods of Making Same
Thermoformable Polymer Thick Film Silver Conductor and Its Use in Capacitive Switch Circuits
Lamination of Polymer Thick Film Conductor Compositions
Method of Manufacturing Non-Firing Type Electrode
Thermoformable Polymer Thick Film Transparent Conductor and Its Use in Capacitive Switch Circuits
Method of Fabricating Electromagnetic Bandgap (Ebg) Structures for Microwave/Millimeterwave Applications Using Laser Processing of Unfired Low Temperature Co-Fired Ceramic (Ltcc) Tape
High K Dielectric Composition for Thermoformable Capacitive Circuits
Flexible White Reflective Dielectric for Electronic Circuits
Thermally Conductive Dielectric for Thermoformable Circuits
Heat-Curable Polymer Paste
Thermoformable Polymer Thick Film Transparent Conductor and Its Use in Capacitive Switch Circuits
Thermoformable Polymer Thick Film Transparent Conductor with Haptic Response and Its Use in Capacitive Switch Circuits
Printable Compositions Useful in Electronic Applications and Methods Relating Thereto
Polymer Thick Film Silver Conductor with Inverted Cure Profile Behavior
Flowable Compositions with Low Temperature Curing to Form Thermally Conductive Pathways in Electronics Type Applications and Methods Relating Thereto
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Copper Paste Composition and Its Use in a Method for Forming Copper Conductors on Substrates
Flexible White Reflective Dielectric for Electronic Circuits
Chip Resistor
Electronic Component
Thick Film Paste and Use Thereof
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Stretchable Polymer Thick Film Compositions for Thermoplastic Substrates and Wearables Electronics
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 3, 2012
From: KIRK, DANIEL; HUI, DAVE; SWEET, MARTIN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028489/0322 →
Assignment of Assignor's Interest
Jul 13, 2012
From: HANG, KENNETH WARREN; PYADA, HENA; SAWHILL, HOWARD T.; SKURSKI, MICHAEL A.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028549/0330 →
Assignment of Assignor's Interest
Jul 13, 2012
From: OGATA, YUKO
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028549/0317 →
Assignment of Assignor's Interest
Jul 23, 2012
From: LABRANCHE, MARC H.; HANG, KENNETH WARREN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028608/0761 →
Assignment of Assignor's Interest
Jul 25, 2012
From: GORDON, SCOTT E.; HUGHES, ELIZABETH D.; MALERBI, JOAO CARLOS; NAIR, DEEPUKUMAR M.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028639/0331 →
Assignment of Assignor's Interest
Jul 31, 2012
From: GLICKSMAN, HOWARD DAVID; PLISCOTT, ADELE AMELIA
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028692/0843 →
Assignment of Assignor's Interest
Aug 1, 2012
From: GLICKSMAN, HOWARD DAVID; PLISCOTT, ADELE AMELIA
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 028699/0170 →
Assignment of Assignor's Interest
Sep 28, 2012
From: ARANCIO, VINCE; DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029042/0695 →
Assignment of Assignor's Interest
Oct 31, 2012
From: KUROKI, MASAKATSU
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029216/0019 →
Assignment of Assignor's Interest
Dec 22, 2012
From: BIDWELL, LARRY ALAN; CRUMPTON, JOHN C.; CHAMP, MICHAEL J.; DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029523/0434 →
Assignment of Assignor's Interest
Dec 22, 2012
From: DORFMAN, JAY ROBERT
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029523/0436 →
Assignment of Assignor's Interest
Jan 10, 2013
From: OGIWARA, TOSHIAKI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029608/0340 →
Assignment of Assignor's Interest
Sep 16, 2014
From: KONNO, TAKUYA; NAKAJIMA, NAOTO
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 033750/0413 →
Confirmatory License
Jun 18, 2015
From: UNIVERSITY OF MARYLAND, COLLEGE PARK
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 035945/0453 →
Assignment of Assignor's Interest
Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest
Jan 8, 2023
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062305/0242 →
Corrective Assignment to Correct the Application Number from 13/651,558 to 13/361,558 Previously Recorded on Reel 062201 Frame 0889. Assignor(S) Hereby Confirms the Assignment.
Jun 13, 2023
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 064066/0728 →
Change of Name
Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
Nunc Pro Tunc Assignment
Jan 31, 2026
From: CELANESE SPECIALTY PRODUCTS, INC.
To: MICROMAX (US) HOLDINGS LLC
Reel/Frame 073651/0583 →
Nunc Pro Tunc Assignment
Jan 31, 2026
From: CELANESE POLYMERS HOLDING, INC.
To: CELANESE SPECIALTY PRODUCTS, INC.
Reel/Frame 073651/0573 →
Nunc Pro Tunc Assignment
Jan 31, 2026
From: CELANESE MERCURY HOLDINGS INC.
To: CELANESE POLYMERS HOLDING, INC.
Reel/Frame 073651/0503 →