Method of manufacturing a resistor paste

1. A method of manufacturing a resistor paste comprising steps of:

(a) preparing a basic resistor paste comprising

(i) a conductive powder,

(ii) a first glass frit, and

(iii) a first organic medium;

(b) preparing a glass paste as a TCR driver comprising,

(iv) a second glass frit comprising manganese oxide, and

(v) a second organic medium; and

(c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.

2. The method of manufacturing a resistor paste of claim 1 , wherein the manganese oxide is 3 to 69 weight percent, based on the weight of the second glass frit.

3. The method of manufacturing a resistor paste of claim 1 , wherein the second glass frit further comprises SiO 2 , B 2 O 3 , Al 2 O 3 or a mixture thereof.

4. The method of manufacturing a resistor paste of claim 1 , wherein the second glass frit is 10 to 60 wt % based on the weight of the glass paste.

5. The method of manufacturing a resistor paste of claim 1 , wherein the glass paste further comprises a third glass frit with softening point of 700 to 950° C.

6. The method of manufacturing a resistor paste of claim 5 , wherein the third glass frit is an alkali earth-silicate glass frit comprising a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), calcium oxide (CaO), boron oxide (B 2 O 3 ), barium oxide (BaO) and a mixture thereof.

7. The method of manufacturing a resistor paste of claim 1 , wherein the conductive powder comprises ruthenium pyrochlore oxide, a ruthenium oxide, silver, palladium, copper, carbon, or a mixture thereof.

8. A method of manufacturing a thick-film chip resistor, comprising:

applying on a substrate a resistor paste prepared according to claim 1 ; and

firing the resistor paste to obtain a thick-film chip resistor.

9. A thick-film chip resistor made by the method of claim 8 .