Method of manufacturing copper electrode
View Patent ↗A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.
1. A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising:
(i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), magnesium oxide (MgO) and a mixture thereof;
(ii) 5 to 30 parts by weight of a boron powder; and
(iii) 0.1 to 10 parts by weight of a glass frit; dispersed in
(iv) an organic vehicle; and firing the conductive paste in air.
2. The method of claim 1 , wherein the metal oxide coating the copper powder is 0.1 to 8 weight percent based on the weight of the copper powder.
3. The method of claim 1 , wherein the average particle diameter of the copper powder is 0.08 to 10 μm.
4. The method of claim 1 , wherein the average particle diameter of the boron powder is 0.1 to 5 μm.
5. The method of claim 1 , wherein the conductive paste further comprises 0.5 to 10 parts by weight of an additional inorganic powder selected from the group consisting of silica powder, indium tin oxide powder, zinc oxide powder, alumina powder, and mixture thereof.
6. The method of claim 1 further comprising the step of, between the step of applying and the step of firing, exposing the conductive paste layer on a substrate to light, wherein the organic vehicle comprises a photo-polymerization compound and a photo-polymerization initiator.
7. The method of claim 6 further comprising the step of, between the step of exposing and the step of firing, developing the exposed conductive paste layer.
8. A conductive paste comprising:
(i) 100 parts by weight of a copper powder comprising copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO 2 ), zinc oxide (ZnO), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), magnesium oxide (MgO) and a mixture thereof;
(ii) 5 to 30 parts by weight of a boron powder; and
(iii) 0.1 to 10 parts by weight of a glass frit; dispersed in
(iv) an organic vehicle; and firing the conductive paste in air.
9. The conductive paste of claim 8 , wherein the metal oxide coating the copper powder is 0.1 to 8 weight percent based on the weight of the copper powder.
10. The conductive paste of claim 8 , wherein the organic vehicle comprises a photo-polymerization compound and a photo-polymerization initiator.