IP Library Granted Patent US 7,169,330
Granted Patent B2
US 7,169,330 · App. 10/786,489 · Granted Jan 30, 2007

Composition of conductive paste

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Quick Facts
Patent No.
US 7,169,330
App. No.
10/786,489
Granted
Jan 30, 2007
Kind
B2
Abstract

A conductor composition comprising an electrically conductive powder, an organic solvent soluble, polyimide resin and solvent wherein the ratio of conductive powder to organic resin is from 80:20 to 99:1 and wherein polyimide resin comprises chemical units selected from and mixtures of these units and wherein in unit (2) the range of the mole ratio m to n is from 90:10 to 10:90 and A represents diamine compounds which bond the structures of unit (2) into units of the resin.

Claims (3)

1. A conductor composition comprising an electrically conductive powder, an organic solvent soluble, polyimide resin and solvent wherein the ratio of conductive powder to organic resin is from 80:20 to 99:1 and wherein polyimide resin comprises chemical units selected from:

and mixtures of these units and wherein in unit (2) the range of the mole ratio m to n is from 90 to 10 to 10 to 90 and “A” represents a diamine compounds which bond the structures chemically into polyimide units of the resin.

2. The conductor composition of claim 1 , wherein “A” is selected from 2,2-bis[4-(amino phenoxy)phenyl]propane, diamino siloxane compounds and mixtures of these.

Assignments (4)
CHANGE OF NAME Recorded Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2004
From: OGIWARA, TOSHIAKI
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014727/0894 →