Patent Assignment
Reel/Frame 062173/0299
Assignment of Assignor's Interest
Recorded: 2022-12-20
Pages: 23
Assignor
DUPONT ELECTRONICS, INC.
Executed: 2022-11-01
Assignee
DU PONT CHINA LIMITED
BUILDING 304, EXPERIMENTAL STATION, 200 POWDER MILL ROAD, WILMINGTON, DELAWARE, 19803
Covered Properties
(49)
Tape Composition and Process for Internally Constrained Sintering of Low Temperature Co-Fired Ceramic
Thick-Film Conductor Paste for Automotive Glass
Thick Film Conductor Compositions for Use in Membrane Switch Applications
Thick Film Compositions for Use in Electroluminescent Applications
Ink Jet Printable Thick Film Compositions and Processes
Composition of Conductive Paste
Printing Apparatus, Printing Method, Computer-Readable Storage Medium, and Printing System
Aqueous Developable Photoimageable Compositions for Use in Photo-Patterning Methods
Thick Film Conductor Case Compositions for Ltcc Tape
Thick Film Conductor Paste Compositions for Ltcc Tape in Microwave Applications
Thick Film Conductor Compositions and the Use Thereof in Ltcc Circuits and Devices
Thick Film Paste via Fill Composition for Use in Ltcc Applications
Lead Free Glass(Es), Thick Film Paste(S), Tape Composition(S) and Low Temperature Cofired Ceramic Devices Made Therefrom
Thick Film Conductor Composition(S) and Processing Technology Thereof for Use in Multilayer Electronic Circuits and Devices
Process for Making Highly Dispersible Spherical Silver Powder Particles and Silver Particles Formed Therefrom
Conductor Paste for Ceramic Substrate and Electric Circuit
Conductive Paste for Solid Electorlytic Capacitor Electrode and Process for Producing Solid Electolytic Capacitor Electrode Using the Same
Device chip carriers, modules, and methods of forming thereof
Conductive Composition for Black Bus Electrode, and Front Panel of Plasma Display Panel
Thick Film Conductor Paste Composition for Ltcc Tape in Microwave Applications
Elecrically Conductive Adhesive
Non-Lead Resistor Composition
Preparation of Silver Spheres by the Reduction of Silver Polyamine Complexes
High Conductivity Polymer Thick Film Silver Conductor Composition for Use in Rfid and Other Applications
Photosensitive Paste and Process for Production of Pattern Using the Same
Method for Producing Dispersed, Crystalline, Stable to Oxidation Copper Particles
Lead-Free Resistive Composition
Resistor Compositions Using a Cu-Containing Glass Frit
Co-Processable Photoimageable Silver and Carbon Nanotube Compositions and Method for Field Emission Devices
Electrode and Method for Manufacturing the Same
Nickel-Gold Plateable Thick Film Silver Paste
Non-Lead Resistor Composition
Conductor Paste for Ceramic Substrate and Electric Circuit
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Uv-Curable Polymer Thick Film Dielectric Compositions with Excellent Adhesion to Ito
Silver Particles and a Process for Making Them
Polymer Thick Film Silver Electrode Composition for Use as a Plating Link
Mixed-Metal System Conductors for Ltcc (Low-Temperature Co-Fired Ceramic)
Silver-Palladium Alloy Containing Conductor Paste for Ceramic Substrate and Electric Circuit
Method of Manufacturing High Frequency Receiving and/or Transmitting Devices from Low Temperature Co Fired Ceramic Materials and Devices Made Therefrom
Non-Lead Resistor Composition
Polymer Thick Film Encapsulant and Enhanced Stability Ptc Carbon System
Method for Forming Front Electrode of Pdp
Ink Jettable Silver/Silver Chloride Compositions
Thin-Film Transparent Conductive Structure and Devices Made Therewith
Copper-Containing Conductive Pastes and Electrodes Made Therefrom
Electrically Conductive Adhesives
Electrically Conductive Adhesives
Coated Copper Particles and Use Thereof
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.