IP Library Granted Patent US 7,338,622
Granted Patent B2
US 7,338,622 · App. 10/728,335 · Granted Mar 4, 2008

Thick film compositions for use in electroluminescent applications

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Quick Facts
Patent No.
US 7,338,622
App. No.
10/728,335
Granted
Mar 4, 2008
Kind
B2
Abstract

The present invention relates to a thick film composition comprising: a) functional component; b) PVDF/HFP polymer resin, a copolymer of PVDF/HFP polymer resin, or mixtures thereof; dissolved in c) organic solvent, with the provisos that the PVDF/HFP resin has i) a melt viscosity of 0.2-0.7 kPoise and ii) a DSC melt temperature in the range of 85-98° C.

Claims (19)

1. A thick film composition comprising:

a) functional component;

b) PVDF/HFP polymer resin, a copolymer of PVDF/HFP polymer resin, or mixtures thereof; dissolved in

c) organic solvent.

with the provisos that the PVDF/HFP resin has i) a melt viscosity of 0.2-0.7 kPoise and ii) a DSC melt temperature in the range of 85-98° C.

2. The composition of claim 1 wherein said functional component is selected from silver, carbon, graphite or mixtures thereof.

3. The composition of claim 1 wherein said functional component is selected from phosphor, phosphor-containing particles, or mixtures thereof.

4. The composition of claim 1 wherein said functional component is selected from BaTiO 3 , TiO 2 , or mixtures thereof.

5. The composition of claim 1 wherein the PVDF/HFP resin contains 12-16 mole % of hexafluoropropylene (HFP) in the total resin composition.

6. The composition of claim 1 further comprising an adhesion promoter.

7. The composition of claim 1 further comprising a flow additive.

8. The composition of claim 1 wherein the organic solvent is selected from the group consisting of carbitol acetate.

9. An electroluminescent panel utilizing the composition of any one of claims 1 - 8 .

10. A method of forming an electroluminescent panel comprising:

(a) providing a substrate;

(b) depositing at least one layer of a phosphor-containing thick film composition onto said substrate;

(c) depositing a least one layer of a dielectric thick film composition onto the layer of (b); and

(d) depositing at least one layer of a conductive thick film composition onto the layer of (c);

wherein at least one layer of (b), (c) or (d) contains a PVDF/HFP polymer resin, copolymer of a PVDF/HFP polymer resin, or mixtures thereof which has i) a melt viscosity of 0.2-0.7 kPoise and ii) a DSC melt temperature in the range of 85-98° C.

Assignments (4)
CHANGE OF NAME Recorded Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062173/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2004
From: DORFMAN, JAY ROBERT
To: E.I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014651/0977 →