Polyimide-based polymer thick film resistor composition
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
1. A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:
(a) 35-70 wt % of a functional component selected from the group of powders consisting of carbon, carbon black, graphite, graphene, and mixtures thereof;
(b) 5-25 wt % of a non-fluorinated polyimide polymer with the structure I
wherein X is O-Ph-C(CH 3 ) 2 -Ph-O and Y is 1,3-bis(3-aminophenoxy) benzene (APB-133);
(c) 0-1 wt % of a dispersant; and
(d) 30-70 wt % of an organic solvent,
wherein the wt % are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.
2. The polyimide-based polymer thick film paste composition of claim 1 , wherein said functional component is graphite powder.
3. The polyimide-based polymer thick film paste composition of claim 1 , wherein said functional component is a mixture of graphite powder and carbon black powder.
4. A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:
(a) 35-70 wt % of a functional component that is a mixture of
i) a powder selected from the group of powders consisting of carbon, black, graphite, graphene, and mixtures thereof; and
ii) an electrical conductive metal powder wherein said metal is selected from the group consisting of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni, an alloy of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni and mixtures thereof, wherein said electrical conductive metal powder is 0.1-98 wt % of said functional component;
(b) 5-25 wt % of a non-fluorinated polyimide polymer with the structure I
wherein X is O-Ph-C(CH 3 ) 2 -Ph-O and Y is 1,3-bis(3-aminophenoxy) benzene (APB-133);
(c) 0-1 wt % of a dispersant; and
(d) 30-70 wt % of an organic solvent,
wherein the wt % of said functional component, said polyimide polymer, said dispersant and said solvent are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.
5. The polyimide-based polymer thick film paste composition of claim 4 , wherein said electrical conductive metal powder is silver powder.
6. The polyimide-based polymer thick film paste composition of claim 4 , wherein said functional component is a mixture of graphite powder, carbon black powder and silver powder.
7. The polyimide-based polymer thick film paste composition of claim 4 , wherein said electrical conductive metal powder is 50-95 wt % of said functional component.