IP Library Assignment 062157/0390
Patent Assignment
Reel/Frame 062157/0390

Assignment of Assignor's Interest

Recorded: 2022-12-20 Pages: 22
Assignor
DUPONT ELECTRONICS, INC.
Executed: 2022-11-01
Assignee
DU PONT CHINA LIMITED
BUILDING 304, EXPERIMENTAL STATION, 200 POWDER MILL ROAD, WILMINGTON, DELAWARE, 19803
Covered Properties (21)
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Patent: 9,649,730 →
Application: 14/824,202 →
Publication: US 2017/0043435
Photonic Sintering of a Polymer Thick Film Copper Conductor Composition
Patent: 9,637,647 →
Application: 14/862,254 →
Publication: US 2017/0044383
Photonic Sintering of a Solderable Polymer Thick Film Copper Conductor Composition
Patent: 9,637,648 →
Application: 14/862,259 →
Publication: US 2017/0044384
Polyimide-Based Polymer Thick Film Compositions
Application: 15/375,544 →
Publication: US 2017/0174838
Polyimide-Based Polymer Thick Film Resistor Composition
Application: 15/380,210 →
Publication: US 2017/0200539
Conductive Paste for Bonding
Application: 15/704,456 →
Publication: US 2018/0072923
Conductive Paste For Bonding
Application: 15/708,490 →
Publication: US 2018/0102341
Articles and Substrates Providing Improved Performance of Printable Electronics
Application: 15/805,226 →
Publication: US 2018/0132350
Hand and Foot Heaters
Application: 16/057,154 →
Publication: US 2019/0216147
Polyimide-Based Polymer Thick Film Resistor Composition
Application: 16/207,801 →
Publication: US 2019/0100676
Electrical Connections for Wearables and Other Articles
Application: 16/244,601 →
Publication: US 2019/0148900
Fine Silver Particle Dispersion
Application: 16/375,095 →
Publication: US 2020/0317935
Flexible Electrically Conductive Pastes and Devices Made Therewith
Application: 16/444,304 →
Publication: US 2019/0386403
Polymer Thick Film Dielectric Paste Composition
Application: 16/444,331 →
Publication: US 2019/0387621
Dielectric Filter and Method for Manufacturing the Same
Application: 16/674,133 →
Publication: US 2020/0144691
Method of Manufacturing an Electronic Device
Application: 16/855,605 →
Publication: US 2020/0248040
Stretchable Polymer Thick Film Carbon Black Composition for Wearable Heaters
Application: 16/871,789 →
Publication: US 2020/0407531
Printable Heaters to Heat Wearables and Other Articles
Application: 17/143,747 →
Publication: US 2021/0127457
Hand and Foot Heaters
Application: 17/225,285 →
Publication: US 2021/0219640
Method of Manufacturing an Electronic Device and Conductive Paste for the Same
Application: 17/454,098 →
Publication: US 2022/0068518
Stretchable Conductive Fluoroelastomer Paste Composition
Application: 17/519,339 →
Publication: US 2022/0056283
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2015
From: SUH, SEIGI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 037072/0058 →
Assignment of Assignor's Interest Nov 18, 2015
From: SUH, SEIGI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 037071/0627 →
Assignment of Assignor's Interest Jan 30, 2017
From: SUH, SEIGI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 041564/0783 →
Assignment of Assignor's Interest Mar 24, 2017
From: SUH, SEIGI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 042087/0372 →
Assignment of Assignor's Interest Jun 28, 2017
From: SUH, SEIGI; YANG, HAIXIN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 042852/0233 →
Assignment of Assignor's Interest Jun 18, 2018
From: WOLFE, MICHAEL STEPHEN; ROSENFELD, H DAVID; KOBREN, ROBIN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 046115/0354 →
Assignment of Assignor's Interest Mar 12, 2019
From: LAMONTIA, MARK ALLAN; MEHDIZADEH, MEHRDAD; MOSELEY, MICHAEL R.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 048576/0700 →
Assignment of Assignor's Interest Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest Nov 6, 2019
From: SUH, SEIGI
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 050940/0194 →
Assignment of Assignor's Interest Dec 20, 2019
From: TACHIBANA, YUSUKE
To: DUPONT ELECTRONICS, INC.
Reel/Frame 051344/0135 →
Assignment of Assignor's Interest Mar 10, 2020
From: LEE, HEE HYUN; SCHIEFFER, EDMUND FRANCIS, JR; TRAN, HOANG VI
To: DUPONT ELECTRONICS, INC.
Reel/Frame 052070/0297 →
Assignment of Assignor's Interest Mar 30, 2020
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 052265/0041 →
Assignment of Assignor's Interest Apr 1, 2020
From: HUI, DAVE; WOLFE, MICHAEL STEPHEN; GLICKSMAN, HOWARD DAVID; YANG, HAIXIN
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 052281/0796 →
Assignment of Assignor's Interest Apr 1, 2020
From: HINOTSU, TAKASHI; TERAGAWA, SHINGO
To: DOWA ELECTRONICS MATERIALS CO., LTD
Reel/Frame 052281/0283 →
Assignment of Assignor's Interest Apr 1, 2020
From: DOWA ELECTRONICS MATERIALS CO., LTD.
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 052281/0523 →
Assignment of Assignor's Interest Apr 1, 2020
From: MATSUURA, YUMI
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 052284/0613 →
Assignment of Assignor's Interest Aug 12, 2020
From: ROSENFELD, H DAVID; CHEN, IVAN; KAMPERT, WILLIAM GEORGE; TZENG, PING
To: DUPONT ELECTRONICS, INC.
Reel/Frame 053469/0476 →
Assignment of Assignor's Interest Sep 30, 2020
From: LEE, HEE HYUN; ARANCIO, VINCENZO
To: DUPONT ELECTRONICS, INC.
Reel/Frame 053931/0253 →
Change of Name Oct 31, 2024
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 069283/0403 →
Change of Name Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →