IP Library Assignment 042087/0372
Patent Assignment
Reel/Frame 042087/0372

Assignment of Assignor's Interest

Recorded: 2017-03-24 Pages: 2
Assignor
SUH, SEIGI
Executed: 2017-03-23
Assignee
E. I. DU PONT DE NEMOURS AND COMPANY
CHESTNUT RUN PLAZA, 974 CENTRE ROAD, P.O. BOX 2915, WILMINGTON, DELAWARE, 19805
Covered Property (1)
Paste and Process for Forming a Solderable Polyimide-Based Polymer Thick Film Conductor
Patent: 9,649,730 →
Application: 14/824,202 →
Publication: US 2017/0043435
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Assignment of Assignor's Interest Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062157/0390 →
Change of Name Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →