Polyimide-based polymer thick film resistor composition

1. A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:

(a) 35-70 wt % of a functional component selected from the group of powders consisting of carbon, carbon black, graphite, graphene, and mixtures thereof;

(b) 5-25 wt % of a polyimide polymer;

(c) 0-1 wt % of a dispersant; and

(d) 30-70 wt % of an organic solvent,

wherein the wt % are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.

2. The polyimide-based polymer thick film paste composition of claim 1 , wherein said functional component is graphite powder.

3. The polyimide-based polymer thick film paste composition of claim 1 , wherein said functional component is a mixture of graphite powder and carbon black powder.

4. A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:

(a) 35-70 wt % of a functional component that is a mixture of

i) a powder selected from the group of powders consisting of carbon, carbon black, graphite, graphene, and mixtures thereof; and

ii) an electrical conductive metal powder wherein said metal is selected from the group consisting of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni, an alloy of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni and mixtures thereof, wherein said electrical conductive metal powder is 0.1-98 wt % of said functional component;

(b) 5-25 wt % of a polyimide polymer;

(c) 0-1 wt % of a dispersant; and

(d) 30-70 wt % of an organic solvent,

wherein the wt % of said functional component, said polyimide polymer, said dispersant, said cross-linking agent and said solvent are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.

5. The polyimide-based polymer thick film paste composition of claim 4 , wherein said electrical conductive metal powder is silver powder.

6. The polyimide-based polymer thick film paste composition of claim 4 , wherein said functional component is a mixture of graphite powder, carbon black powder and silver powder.

7. The polyimide-based polymer thick film paste composition of claim 4 , wherein said electrical conductive metal powder is 50-95 wt % of said functional component.