IP Library Granted Patent US 11,072,715
Granted Patent B2
US 11,072,715 · App. 16/375,095 · Granted Jul 27, 2021

Fine silver particle dispersion

Inventors: Dave Hui (Bristol South Gloucestershire, GB); Michael Stephen Wolfe (Wilmington, DE); Howard David Glicksman (Durham, NC); Haixin Yang (Durham, NC); Takashi Hinotsu (Tokyo, JP); Shingo Teragawa (Tokyo, JP)
Assignee: E I DU PONT DE NEMOURS AND COMPANY
C09D5/24C09D101/28C08K3/40C08K9/04C08K2003/0806C08K2201/001C08K2201/003
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,072,715
App. No.
16/375,095
Granted
Jul 27, 2021
Kind
B2
Abstract

This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.

Claims (18)

1. A conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprises:

(1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger,

(2) 4.5 to 34.5% by weight of a solvent, and

(3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.

2. The conductive paste of claim 1 , wherein the fine silver particles are coated with an organic protective material.

3. The conductive paste of claim 2 , wherein the organic protective material is an amine with carbon number of from 8 to 12.

4. The conductive paste of claim 1 , wherein a boiling point of the solvent is 150 to 350° C.

5. The conductive paste of claim 1 , wherein the solvent is selected from the group consisting of diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol monobutyl ether acetate, terpineol, and any mixture thereof.

6. The conductive paste of claim 1 , wherein the ethyl cellulose has a weight average molecular weight of 30,000 to 105,000.

7. The conductive paste of claim 1 , wherein the ethyl cellulose has a weight average molecular weight of 50,000 to 90,000.

8. The conductive paste of claim 1 , wherein the fine silver particle dispersion comprises 0.3 to 0.9% by weight of the ethyl cellulose.

9. The conductive paste of claim 1 , wherein the fine silver particle dispersion comprises 0.6 to 0.9% by weight of the ethyl cellulose.

10. The conductive paste of claim 1 , wherein the fine silver particles have an average primary particle diameter of 25 to 110 nm.

11. The conductive paste of claim 1 , wherein the fine silver particle dispersion comprises 70 to 87% by weight of the fine silver particles.

12. The conductive paste of claim 1 , wherein the fine silver particles comprise 15% by number or less of silver particles having a primary particle diameter of 100 nm or larger.

13. The conductive paste of claim 1 , wherein an amount of a substance having a weight average molecular weight of 150,000 or more in the fine silver particle dispersion is 0.09% by weight or less.

14. The conductive paste of claim 1 , wherein the fine silver particle dispersion comprises 11.1 to 31.5% by weight of the solvent.

15. The conductive paste of claim 1 , wherein an amount of a substance having a weight average molecular weight of 150,000 or more in the fine silver particle dispersion is 0.05% by weight or less.

Assignments (6)
CHANGE OF NAME Recorded Mar 20, 2025
From: DU PONT CHINA LIMITED
To: CELANESE MERCURY HOLDINGS INC.
Reel/Frame 070567/0231 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2022
From: DUPONT ELECTRONICS, INC.
To: DU PONT CHINA LIMITED
Reel/Frame 062157/0390 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: HINOTSU, TAKASHI; TERAGAWA, SHINGO
To: DOWA ELECTRONICS MATERIALS CO., LTD
Reel/Frame 052281/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: DOWA ELECTRONICS MATERIALS CO., LTD.
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 052281/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: HUI, DAVE; WOLFE, MICHAEL STEPHEN; GLICKSMAN, HOWARD DAVID; YANG, HAIXIN
To: E I DU PONT DE NEMOURS AND COMPANY
Reel/Frame 052281/0796 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2020
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 052265/0041 →