CONDUCTIVE PASTE FOR BONDING AND MANUFACTURING METHOD OF ELECTRIC DEVICE USING THEREOF
The invention relates to a method of manufacturing an electronic device. The method comprises the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component. The invention also provides the conductive paste.
1 . A method of manufacturing an electronic device comprising the steps of:
preparing a substrate comprising an electrically conductive layer;
applying a conductive paste on the electrically conductive layer; wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid;
mounting an electrical component on the applied conductive paste; and
heating the conductive paste to bond the electrically conductive layer and the electrical component.
2 . The method of claim 1 , wherein the branched higher fatty is selected from the group consisting of n-butyloctanoic acid (C12), n-methyltridecanoic acid (C14), n-methyltetradecanoate acid (C15), isopalmitic acid (C16), isostearic acid (C18), n-methylnonadecanoic acid (C19), isoarachic acid (C20) and a mixture thereof.
3 . The method of claim 1 , wherein the branched higher fatty is selected from the group consisting of isopalmitic acid (C16), isostearic acid (C18), isoarachic acid (C20) and a mixture thereof.
4 . The method of claim 1 , wherein the branched higher fatty is represented with formula (I),
wherein R 1 and R 2 are independently hydrocarbons of carbon number 4 to 10 and the total carbon number is 12 or more.
5 . The method of claim 1 , wherein the particle diameter (D50) of the metal powder is 0.01 to 2 μm.
6 . The method of claim 1 , wherein the conductive paste further comprises 0.01 to 4 parts by weight of a polymer.
7 . The method of claim 1 , wherein the heating temperature to bond the electronic component and the conductive layer is 160 to 400° C.
8 . The method of claim 1 , wherein the electrical component is selected from the group consisting of a semiconductor chip, an integrated circuit (IC) chip, a chip resistor, a chip capacitor, a chip inductor, a sensor chip, and a combination thereof.
9 . The method of claim 1 , wherein the electrical component comprises a metallization layer selected from the group consisting of copper, silver, gold, nickel, palladium, platinum, alloy thereof and a mixture thereof.
10 . A conductive paste for bonding, comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid.
11 . The conductive paste of claim 10 , wherein the branched higher fatty is selected from the group consisting of n-butyloctanoic acid (C12), n-methyltridecanoic acid (C14), n-methyltetradecanoate acid (C15), isopalmitic acid (C16), isostearic acid (C18), n-methylnonadecanoic acid (C19), isoarachic acid (C20) and a mixture thereof.
12 . The conductive paste of claim 10 , wherein the branched higher fatty is selected from the group consisting of isopalmitic acid (C16), isostearic acid (C18), isoarachic acid (C20) and a mixture thereof.
13 . The conductive paste of claim 10 , wherein the branched higher fatty is represented with formula (I),
wherein R 1 and R 2 are independently hydrocarbons of carbon number of 4 to 10 and the total carbon number is 12 or more.
14 . The conductive paste of claim 10 , wherein the particle diameter (D50) of the metal powder is 0.01 to 2 μm.
15 . The conductive paste of claim 10 , wherein the conductive paste further comprises 0.01 to 4 parts by weight of a polymer.