IP Library Granted Patent US 8,492,073
Granted Patent B2
US 8,492,073 · App. 12/283,341 · Granted Jul 23, 2013

Method for thermal development with a conformable support

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Quick Facts
Patent No.
US 8,492,073
App. No.
12/283,341
Granted
Jul 23, 2013
Kind
B2
Abstract

The present invention provides a method and apparatus for forming a printing form from a photosensitive element to form a relief pattern. The method and apparatus thermally develop the photosensitive element by heating a composition layer of the element to cause a portion of the layer to liquefy and providing a development medium to the element to remove the liquefied composition. A conformable layer is disposed between the photosensitive element and a base support, which improves the compressibility and the contact between the photosensitive element and the development medium. The method and apparatus improve the efficiency of the removal of liquefied portions from the photosensitive element and the uniformity of the relief pattern formed.

Claims (24)

1. A method for forming a printing form from a photosensitive element having an exterior surface, a side opposite the exterior surface, and containing a composition layer capable of being partially liquefied comprising:

supplying a development medium to the exterior surface;

supporting the photosensitive element on a base member;

heating the exterior surface to a temperature sufficient to cause a portion of the layer to liquefy; and

contacting the photosensitive element with the development medium to allow at least a portion of the liquefied material of the composition layer to be removed by the development medium,

wherein a conformable material having a compression modulus between 3 and 1500 psi and a Shore A hardness of 25 or less is disposed between the base member and the side of the photosensitive element.

2. The method of claim 1 wherein the compression modulus is between 3 and 100 psi.

3. The method of claim 1 wherein the compression modulus is between 5 and 75 psi.

4. The method of claim 1 wherein the compression modulus is between 10 and 350 psi.

5. The method of claim 1 wherein the compression modulus is between 10 and 1200 psi.

6. The method of claim 1 wherein the conformable material is a layer contacting the side of the photosensitive element.

7. The method of claim 1 wherein in the conformable material is selected from the group consisting of foams and elastomeric materials.

8. The method of claim 7 wherein the foam is selected from the group of natural foams and synthetic foams.

9. The method of claim 1 wherein the conformable material is selected from the group consisting of polyethylenes, polyurethanes, polyesters, silicon rubbers, and polystyrenes.

10. The method of claim 1 wherein the compressible material is a layer having a thickness of between 0.1 and 50 mm.

11. The method of claim 1 further comprising forming a layer from one or more plys of the conformable material.

12. The method of claim 1 further comprising securing a layer of the conformable material to the base member.

13. The method of claim 1 wherein the conformable material is a layer removable from the base member.

14. The method of claim 1 wherein the conformable material forms a layer on a flexible carrier removably mounted on the base member.

15. The method of claim 1 further comprising pressing the development medium and the exterior surface into contact at a pressure sufficient for at least a portion of the liquefied material to be removed by the development medium.

16. The method of claim 1 wherein the development medium is selected from the group consisting of non-woven materials, fibrous woven materials, paper stocks, porous materials, open-cell foams, and combinations thereof.

17. The method of claim 1 wherein the heating step is selected from the group consisting of conduction, convection, radiation, and combinations thereof.

18. The method of claim 1 further comprising imagewise exposing the photosensitive element to actinic radiation prior to the heating step.

19. The method of claim 1 wherein the Shore A hardness is less than 25.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →