Polycyclic polyimides and compositions and methods relating thereto
View Patent ↗The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.
1. A polyimide composition derived from a diamine component and a dianhydride component wherein the diamine component comprises from 3 to 25 mole percent of a diamine represented by the following formula,
where R is —CH 3 , —CH 2 —CH 3 , —CH 2 —CH 2 —CH 3 , —(CH 2 ) 3 —CH 3 , —(CH 2 ) 4 —CH 3 , —CX 3 , —CH 2 —CX 3 , —CH 2 —CH 2 —CX 3 , —(CH 2 ) 3 —CX 3 , —(CH 2 ) 4 —CX 3 where X is equal to F, Cl, or Br, —C 6 H 5 and ortho or para C 6 H 5 —CH 3
wherein k is either 1 or 2,
wherein the diamine component comprises from between 75 and 97 mole percent of a diamine represented by the following formula,
NH 2 —X 1 —NH 2
wherein X 1 stands for a divalent aliphatic group, a divalent aromatic group, or a divalent siloxane containing aliphatic or aromatic group,
and wherein the dianhydride component is selected from the group consisting of a dianhydride, a diacid-diester, a diacid halide ester, or a tetra-carboxylic acid.
2. A composition in accordance with claim 1 wherein the polyimide component has a glass transition temperature between and including 550 and 330° C.