Patent Assignment
Reel/Frame 073515/0243
Security Interest
Recorded: 2025-11-03
Pages: 143
Assignor
QNITY ELECTRONICS, INC.
Executed: 2025-11-01
Assignee
JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
383 MADISON AVENUE, NEW YORK, NEW YORK, 10179
Covered Properties
(1011)
Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Application:
15/924,606 →
Publication:
US US20180345449A1
Aromatic Underlayer
Thin Film Fluoropolymer Composite Cmp Polishing Pad
Application:
16/435,913 →
Publication:
US US20200384601A1
Resist Underlayer Compositions and Methods of Forming Patterns with Such Compositions
Application:
16/530,273 →
Publication:
US US20200348592A1
Resist Underlayer Compositions and Pattern Formation Methods Using Such Compositions
Photoresist Underlayer Compositions and Methods of Forming Electronic Devices
Application:
18/537,020 →
Publication:
US US20240264528A1
Leveraged Poromeric Polishing Pad
Application:
18/934,099 →
Publication:
US US20250058426A1
Method of Inhibiting Tarnish Formation and Corrosion
Method of Inhibiting Tarnish Formation and Corrosion
Application:
19/175,339 →
Publication:
US US20250327202A1
Polymers and Photoresist Compositions
Application:
16/731,666 →
Publication:
US US20210200084A1
Main Chain Scissionable Block Copolymers, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
63/719,740 →
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/090,638 →
Publication:
US US20240241441A1
Iodine-Containing Acid Cleavable Compounds, Polymers Derived Therefrom, and Photoresist Compositions
Application:
17/490,923 →
Publication:
US US20230103685A1
Cmp Polishing Pad with Protruding Structures Having Engineered Open Void Space
Application:
16/829,024 →
Publication:
US US20210299816A1
Photoresist Compositions and Pattern Formation Methods
Application:
17/462,216 →
Publication:
US US20220091506A1
High Refractive Index Materials
Application:
17/411,708 →
Publication:
US US20220112321A1
Micro-Layer Cmp Polishing Subpad
Application:
18/490,290 →
Publication:
US US20240181596A1
Bisbenzocyclobutene Formulations
Application:
19/199,890 →
Publication:
US US20250270366A1
Plurality of Light-Emitting Materials, Organic Electroluminescent Compound, and Organic Electroluminescent Device Comprising the Same
Polymers for Use in Electronic Devices
Application:
18/567,882 →
Publication:
US US20240279399A1
Chemical Mechanical Polishing Composition and Method
Application:
17/697,709 →
Publication:
US US20220348790A1
Photoresist Underlayer Compositions and Patterning Methods
Application:
17/124,743 →
Publication:
US US20220197141A1
Compounds and Photoresist Compositions Including the Same
Photoresist Compositions and Pattern Formation Methods
Application:
17/490,974 →
Publication:
US US20230104679A1
Photoresist Underlayer Composition
Application:
17/490,816 →
Publication:
US US20230103371A1
Surface Modified Silanized Colloidal Silica Particles
Application:
17/697,735 →
Publication:
US US20220356065A1
Photoacid Generators, Photoresist Compositions, and Pattern Formation Methods
Polymers Useful as Surface Leveling Agents
Application:
18/521,544 →
Publication:
US US20240093027A1
Photoresist Compositions and Pattern Formation Methods
Application:
17/940,682 →
Publication:
US US20230152697A1
Photoresist Topcoat Compositions and Pattern Formation Methods
Application:
18/082,025 →
Publication:
US US20230251575A1
Cmp Polishing Pad
Application:
18/909,604 →
Publication:
US US20250025983A1
Polymeric Resin for Dielectric Applications
Cmp Pad Having Ultra Expanded Polymer Microspheres
Method of Filling Through-Holes to Reduce Voids
Application:
18/162,971 →
Publication:
US US20230279577A1
Photoresist Underlayer Composition
Application:
18/076,475 →
Publication:
US US20230194990A1
Pad for Chemical Mechanical Polishing
Application:
19/088,693 →
Publication:
US US20250222556A1
Photoresist Underlayer Composition
Photoactive Compounds, Photoresist Compositions Including the Same, and Pattern Formation Methods
Photoactive Compounds, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/352,646 →
Publication:
US US20240027904A1
Photoresist Compositions and Pattern Formation Methods
Application:
18/085,098 →
Publication:
US US20230213862A1
Methods of Forming a Semiconductor Device
Application:
18/933,213 →
Publication:
US US20260215233A1
Metallization Method
Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features
Resin Composition
Method of Making Low Specific Gravity Polishing Pads
Cmp Pad Having Polishing Layer of Low Specific Gravity
Polishing Pad Formed from Dual Curative
Application:
18/360,947 →
Publication:
US US20250033161A1
Photoacid Generators, Photoresist Compositions, and Pattern Formation Methods
Application:
18/354,410 →
Publication:
US US20240027905A1
Metallization Method
Photoresist Compositions and Patterning Methods
Application:
18/989,213 →
Publication:
US US20250244664A1
Photoresist Composition and Metallization Method
Application:
18/222,666 →
Publication:
US US20250102910A1
Nickel Electroplating Compositions for Rough Nickel
Chemical Mechanical Polishing Pad with Fluorinated Polymer and Multimodal Groove Pattern
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
17/985,439 →
Publication:
US US20240184201A1
High Refractive Index Materials
Application:
18/482,295 →
Publication:
US US20240152047A1
Coated Containers and Methods of Forming Such Containers
Application:
18/107,132 →
Publication:
US US20240217702A1
Photoimagable Dielectrics
Application:
18/187,072 →
Publication:
US US20240317940A1
Polishing Pad with Endpoint Window
Application:
18/404,415 →
Publication:
US US20240253175A1
Polymer, Photoresist Compositions Including the Same, and Pattern Formation Methods
Chemical Mechanical Polishing Composition and Method for Preventing Polishing Pad Groove Clogging
Application:
18/351,031 →
Publication:
US US20250019567A1
Photoresist Compositions and Pattern Formation Methods
Application:
18/884,246 →
Publication:
US US20260079398A1
Multiblock Copolymers, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
18/481,018 →
Publication:
US US20250116933A1
Polymers, Photoresist Compositions and Methods of Forming Patterns
Application:
18/890,150 →
Publication:
US US20260079399A1
Polishing Pad with Endpoint Window
Application:
18/404,443 →
Publication:
US US20240253176A1
Dual-Layer Cmp Polishing Subpad
Application:
18/490,345 →
Publication:
US US20240181597A1
Polishing Pad with Endpoint Detection Window
Application:
18/404,519 →
Publication:
US US20240253177A1
Compounds, Monomers, Polymers, Photoresist Compositions and Pattern Formation Methods
Application:
18/324,450 →
Publication:
US US20240393689A1
Filtration Membranes and Method of Manufacture Thereof
Application:
18/758,631 →
Publication:
US US20260001043A1
Chemical Mechanical Polishing Pad
Application:
18/373,660 →
Publication:
US US20250100099A1
Method of Polishing Using Chemical Mechanical Polishing Pad
Application:
18/373,692 →
Publication:
US US20250100100A1
Chemical Mechanical Polishing Pad
Application:
18/952,544 →
Publication:
US US20250178155A1
Functionalized Metal and Nitride CMP Slurry
Application:
18/409,615 →
Publication:
US US20260002048A1
Chemical Mechanical Polishing Pad
Application:
18/952,640 →
Publication:
US US20250178156A1
Multifunctional Endpoint Detection Window
Application:
18/621,411 →
Publication:
US US20250303515A1
Multifunctional Endpoint Detection Window
Application:
18/621,430 →
Publication:
US US20250303516A1
Functionalized Carbon Particle CMP Slurry Dispersion
Application:
18/409,628 →
Publication:
US US20250223468A1
Functionalized Carbon Particle Tungsten Cmp Slurry
Application:
18/409,643 →
Publication:
US US20260226315A1
Soluble Metal Oxide Anion CMP Slurry
Polishing Pad with Endpoint Detection Window
Application:
18/621,445 →
Publication:
US US20250303517A1
Polishing Pad with Thermal Management Features
Application:
18/750,740 →
Publication:
US US20250387872A1
Polishing Pad Having Filled Non-Porous Sub-Pad
Application:
18/750,662 →
Publication:
US US20250387871A1
Underlayer Composition for Use in Manufacturing Electronic Devices
Application:
18/953,395 →
Publication:
US US20260140448A1
Pad for Chemical Mechanical Polishing
Application:
18/900,374 →
Publication:
US US20260091462A1
Pad for Chemical Mechanical Polishing
Application:
18/900,397 →
Publication:
US US20260091463A1
Electroactive Compounds, Compositions Including the Same, and Pattern Formation Methods
Application:
63/699,950 →
Photoacid Generator Compound, Photoresist Compositions Including the Same, and Pattern Formation Methods
Application:
63/738,930 →
Salts, Photoresist Compositions, and Pattern Formation Methods
Application:
63/738,955 →
Photoresist Compositions and Pattern Formation Methods
Application:
63/738,954 →
Circuit Assemblies And Related Methods
Thermally-Conductive Electromagnetic Interference (EMI) Absorbers
Application:
18/628,288 →
Publication:
US US20240276690A1
Electromagnetic Interference (Emi) Mitigation Materials and Emi Absorbing Compositions Including Carbon Nanotubes
Application:
17/962,698 →
Publication:
US US20230032553A1
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers Including Aluminum Powder
Application:
19/189,483 →
Publication:
US US20250267832A1
Electrically Insulated Conductors
Application:
18/930,199 →
Publication:
US US20250055341A1
Thermal and/or Electromagnetic Interference (Emi) Management Composites Including Silicone Carbinols
Application:
18/427,243 →
Publication:
US US20240268090A1
Electrically Insulated Conductors And Methods For Electrically Insulating Conductors
Application:
18/927,191 →
Publication:
US US20250140449A1
Rheology Controlled Metal Amalgams by Including Non-Refractory Filler Particles
Application:
19/044,846 →
Publication:
US US20250257432A1
Compressible Foamed Thermal Interface Materials and Methods of Making the Same
Non-Condensing Thermal Materials With Low Sulfur Content
Application:
18/885,167 →
Publication:
US US20250098121A1
Systems of Applying Materials to Components
Edging for materials
Patent:
1,101,702 →
Application:
29/901,768 →
Small Form-Factor Pluggable (Sfp) Transceivers
Low Dielectric, Low Loss Radomes And Materials For Low Dielectric, Low Loss Radomes
Low Dielectric, Low Loss Radome
Application:
18/527,949 →
Publication:
US US20240106111A1
Low Dielectric, Low Loss Radomes, Materials and Methods for Making Low Dielectric, Low Loss Radomes
Application:
18/603,420 →
Publication:
US US20240250416A1
Patterned Electromagnetic Interference (Emi) Mitigation Materials Including Carbon Nanotubes
Controlling Bond Line Thickness (BLT) For Metal Amalgams
Application:
19/051,389 →
Publication:
US US20250259966A1
Reducing the Spreading of Material(S) Migrating from Thermal Management and/or Electromagnetic Interference (Emi) Mitigation Materials
Application:
19/055,584 →
Publication:
US US20250266319A1
Phosphonic Acid For Enhancing Performance Of Thermal Interface Materials
Application:
19/278,947 →
Publication:
US US20260028473A1
Sliding Thermal Interface Material (Tim) Assemblies
Application:
63/743,959 →
Electromagnetic Interference (EMI) Absorbers Including Carbon Nanostructure (CNS) Filler Within Liquid Crystal Polymer (LCP) Matrix
Application:
19/226,528 →
Publication:
US US20250393181A1
Gaskets
Application:
18/268,527 →
Publication:
US US20240309949A1
Curing Agents for Fluoroelastomers
Method of Making Halo (Alkyl Vinyl) Ether Monomers and Fluorinated Polymers Made with the Halo (Alkyl Vinyl) Ether Monomer
Application:
18/860,836 →
Publication:
US US20250340684A1
Telecommunication Signal Range Enhancement Using Panel Reflectance
Application:
17/109,271 →
Publication:
US US20220173521A1
Moveable Gripper for Gripping a Container and Heating Contents of the Container Through Dynamically Controlled Thermal Contact and Heat Settings
Application:
17/313,141 →
Publication:
US US20220361294A1
Polymer Compositions Having Photoacid Generators and Photoresists
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Application:
13/326,619 →
Publication:
US US20120238045A1
Thermal Substrates
Polymer Films and Electronic Devices
Application:
18/322,816 →
Publication:
US US20230300978A1
Polymer Films and Electronic Devices
Application:
18/322,835 →
Publication:
US US20230300979A1
Metal-Clad Polymer Films and Electronic Devices
Processes for Forming Crosslinked Polymer Films
Application:
19/292,563 →
Publication:
US US20250382496A1
Thin Flexible Glass Cover with a Fragment Retention Hard Coating
Application:
17/631,527 →
Publication:
US US20220267198A1
Dicarbonyl Halides, Polymer Compositions and Films Made Therefrom
Application:
18/342,108 →
Publication:
US US20240052104A1
Process for Forming an Article
Application:
19/292,545 →
Publication:
US US20260184052A1
Articles Having Inorganic Substrates and Polymer Film Layers
Photosensitive Composition and Photoresist Dry Film Made Therefrom
Polyimide Films
Application:
17/958,675 →
Publication:
US US20230137913A1
Photocurable Conductive Black Composition and a Method for Forming a Cured Product Thereof
Application:
18/493,047 →
Publication:
US US20240150592A1
Flexible Copper-Clad Laminate and Printed Circuit Made Therefrom
Clads Having Polymer Films and Metal Layers
Application:
18/897,545 →
Publication:
US US20250109265A1
Electrolytic Copper Foil, a Method for Manufacturing the Same, and Articles Made Therefrom
Application:
18/343,029 →
Publication:
US US20240052513A1
Transparent Conductive Substrate and a Double-Side Photolithographic Method Using the Same
Application:
18/454,300 →
Publication:
US US20240077980A1
Current Collectors and Energy Storage Devices
Application:
18/897,558 →
Publication:
US US20250112246A1
Electrically Insulated Wires and Cables
Application:
18/618,103 →
Publication:
US US20240336801A1
Ultrathin Copper Foil, a Method for Manufacturing the Same, and an Article Made Therefrom
Electrically Insulated Conductors
Application:
19/080,258 →
Publication:
US US20250299849A1
Multilayer Films, Polyimide Films and Coverlay Packages
Application:
18/941,412 →
Publication:
US US20250153471A1
Electrodeposited Copper Foil with a Uniform Matte Surface
Application:
18/779,551 →
Publication:
US US20250092553A1
Electrodeposited Copper Foil with a Preffered Orientation of (200) Crystal Plane and Applications Thereof
Application:
19/071,015 →
Publication:
US US20250297396A1
Curable Composition and Insulating Film
Application:
63/730,231 →
Curable Composition and Insulating Film
Application:
63/730,236 →
Curable Composition and Insulating Film
Application:
63/730,240 →
Resin Composition and Applications Thereof
Application:
63/750,517 →
Wet Lamination of Photopolymerizable Dry Films Onto Substrates and Compositions Relating Thereto
Application:
12/179,722 →
Publication:
US US20100037799A1
Electroactive Compounds
Application:
17/597,443 →
Publication:
US US20220162222A1
Electroactive Compounds
Application:
17/594,459 →
Publication:
US US20220204521A1
Electroactive Compounds
Application:
17/783,009 →
Publication:
US US20230010535A1
Electroactive Compounds and Electroluminescent Device Comprising the Same
Application:
18/901,522 →
Publication:
US US20250176425A1
Compositions Containing Multifunctional Nanoparticles
Curable Composition Comprising a Di-Isoimide, Method of Curing, and the Cured Composition So Formed
Laminate Comprising Curable Epoxy Film Layer Comprising a Di-Isoimide and Process for Preparing Same
Printed Wiring Board Encapsulated by Adhesive Laminate Comprising a Di-Isoimide, and Process for Preparing Same
Filled Polyimide Films and Coverlays Comprising Such Films
Process for Preparing Substituted and Unsubstituted Diamino Triazine Aromatic Di-Isoimides
Dichloroamino-Functionalized Fluoropolymer and Process for Preparing
Preparation, Purification and Use of High-X Diblock Copolymers
Planarized Microelectronic Substrates
Aqueous Developable Benzocyclobutene-Based Polymer Composition and Method of Use of Such Compositions
Plating Bath and Method
Plating Bath and Method
Methods of Forming Photolithographic Patterns
Plating Bath and Method
Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
Method of Polishing a Substrate Comprising Polysilicon and at Least One of Silicon Oxide and Silicon Nitride
Photoacid Generators and Photoresists Comprising Same
Photoacid Generators and Photoresists Comprising Same
Novel Polymers and Photoresist Compositions
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Underlayer Composition and Method of Imaging Underlayer Composition
Underlayer Composition and Method of Imaging Underlayer Composition
Neutral Layer Polymers, Methods of Manufacture Thereof and Articles Comprising the Same
Neutral Layer Polymers, Methods of Manufacture Thereof and Articles Comprising the Same
Photosensitive Copolymer and Photoresist Composition
Method of Electroplating Silver Strike Over Nickel
Delivery device and method of use thereof
Cyanide-Free Silver Electroplating Solutions
Method Of Forming Open-Network Polishing Pads
Chemical Mechanical Polishing Pad with Light Stable Polymeric Endpoint Detection Window and Method of Polishing Therewith
Underlayer Composition and Method of Imaging Underlayer
Underlayer Composition and Method of Imaging Underlayer
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Photoacid Generators
Method of Forming Layered-Open-Network Polishing Pads
Base Reactive Photoacid Generators and Photoresists Comprising Same
Polymerizable Photoacid Generators
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Lactone Photoacid Generators and Resins and Photoresists Comprising Same
Method of Forming Silicate Polishing Pad
Silicate Composite Polishing Pad
Hollow Polymeric-Silicate Composite
Photoresists and Methods for Use Thereof
Gold Plating Solution
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Coating Compositions for Use with an Overcoated Photoresist
Patent:
10,481,494 →
Application:
14/635,553 →
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions for Use with an Overcoated Photoresist
Photoresist and Coated Substrate Comprising Same
Surface Active Additive and Photoresist Composition Comprising Same
Plating Bath and Method
Plating Bath and Method
Block copolymer and methods relating thereto
Photoacid Generator and Photoresist Comprising Same
Photoacid Generator and Photoresist Comprising Same
Photoresist Composition
Photoacid Generator Compound, Polymer Comprising End Groups Containing the Photoacid Generator Compound, and Method of Making
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Photoresist Overcoat Compositions and Methods of Forming Electronic Devices
Compositions and Processes for Photolithography
New Metal Plating Compositions
New Metal Plating Compositions
High Refractive Index Curable Liquid Light Emitting Diode Encapsulant Formulation
Patent:
8,258,636 →
Application:
13/109,045 →
Transparent Conductive Articles
Photolithographic Methods
Photolithographic Methods
Photolithographic Methods
Photoacid Generator, Photoresist, Coated Substrate, and Method of Forming an Electronic Device
High Temperature Resistant Silver Coated Substrates
Method of manufacturing chemical mechanical polishing layers
Method for Chemical Mechanical Polishing Tungsten
Compositions and Antireflective Coatings for Photolithography
Curable liquid composite light emitting diode encapsulant
Method of Forming Structured-Open-Network Polishing Pads
Photoacid Generator and Photoresist Comprising Same
Cycloaliphatic Monomer, Polymer Comprising the Same, and Photoresist Composition Comprising the Polymer
Topcoat Compositions and Photolithographic Methods
Acrylate Polyurethane Chemical Mechanical Polishing Layer
Copper Electroplating Solution and Method of Copper Electroplating
Patent:
9,637,833 →
Application:
13/726,251 →
Plating Bath and Method
Plating Catalyst and Method
Copper Electroplating Solution and Method of Copper Electroplating
Plating Catalyst and Method
Method of Preventing Silver Tarnishing
Photoresist Pattern Trimming Methods
Photoresist Pattern Trimming Methods
Photoresist Pattern Trimming Methods
Photosensitive Copolymer, Photoresist Comprising the Copolymer, and Articles Formed Therefrom
Diblock Copolymer Blend Composition
Thermal annealing process
Plating Bath and Method
Metal Hardmask Compositions
Metal Hardmask Compositions
Ephemeral Bonding
Ephemeral Bonding
Ephemeral Bonding
Acid Generator Compounds and Photoresists Comprising Same
Zwitterionic Photo-Destroyable Quenchers
Photoresists Comprising Amide Component
Dendritic Compounds, Photoresist Compositions and Methods of Making Electronic Devices
Polymer Comprising End Groups Containing Photoacid Generator, Photoresist Comprising the Polymer, and Method of Making a Device
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Photoresist Compositions and Methods of Forming Photolithographic Patterns
Amino Sulfonic Acid Based Polymers for Copper Electroplating
Amino Sulfonic Acid Based Polymers for Copper Electroplating
Thermal annealing process
High temperature thermal annealing process
Photoresists Comprising Ionic Compound
Method for chemical mechanical polishing layer pretexturing
Acid Generators and Photoresists Comprising Same
Method of Removing Negative Acting Photoresists
Hardmask
Acid Generators and Photoresists Comprising Same
Acid Generators and Photoresists Comprising Same
Ion Implantation Methods
Ion Implantation Methods
Forming Alkaline-Earth Metal Oxide Polishing Pad
Hollow Polymeric-Alkaline Earth Metal Oxide Composite
Alkaline-Earth Metal Oxide-Polymeric Polishing Pad
Electrolytic Copper Plating Solution and Method of Electrolytic Copper Plating
Electrolytic Copper Plating Liquid and the Electrolytic Copper Plating Method
Photoacid Generating Compound and Photoresist Composition Comprising Same, Coated Article Comprising the Photoresist and Method of Making an Article
Acid Generator Compounds and Photoresists Comprising Same
Photoresists Comprising Multiple Acid Generator Compounds
Chrome-Free Methods of Etching Organic Polymers
Patent:
8,603,352 →
Application:
13/659,937 →
Composition and method for preparing pattern on a substrate
Tin or Tin Alloy Plating Liquid
Adhesion Promoter
Adhesion Promoter
Method of manufacturing grooved chemical mechanical polishing layers
Chemical mechanical polishing composition and method
Patent:
8,545,715 →
Application:
13/647,941 →
Reaction Products of Amine Monomers and Polymers Containing Saturated Heterocyclic Moieties as Additives for Electroplating Baths
Ionic Thermal Acid Generators for Low Temperature Applications
Polymers Containing Benzimidazole Moieties as Levelers
Hardmask Surface Treatment
Photoresist Pattern Trimming Methods
Soft And Conditionable Chemical Mechanical Polishing Pad
Photoresist Composition, Coated Substrate, and Method of Forming Electronic Device
Hardmask Surface Treatment
Quinoline-Benzoxazole Derived Compounds for Electronic Films and Devices
Bis(Aryl)Acetal Compounds
Aromatic Polyacetals and Articles Comprising Them
Electroplating Baths of Silver and Tin Alloys
Directed Self-Assembly Pattern Formation Methods and Compositions
Chemical Mechanical Polishing Pad with Broad Spectrum, Endpoint Detection Window and Method of Polishing Therewith
Block copolymer composition and methods relating thereto
Block Coploymer Formulation and Methods Relating Thereto
Directed self assembly copolymer composition and related methods
Photosensitive Copolymer, Photoresist Comprising the Copolymer, and Method of Forming an Electronic Device
Sulfonamide Based Polymers for Copper Electroplating
Sulfonamide Based Polymers for Copper Electroplating
Acid Generators and Photoresists Comprising Same
Photoresists Comprising Carbamate Component
Multilayer Chemical Mechanical Polishing Pad
Broad Spectrum, Endpoint Detection Monophase Olefin Copolymer Window with Specific composition in Multilayer Chemical Mechanical Polishing Pad
Chrome-Free Methods of Etching Organic Polymers with Mixed Acid Solutions
Cured Thermoset for High Thermal Conductive Materials
Photoacid Generator, Photoresist, Coated Substrate, and Method of Forming an Electronic Device
Hot Melt Compositions with Improved Etch Resistance
Hot Melt Compositions with Improved Etch Resistance
Hot Melt Compositions with Improved Etch Resistance
Orientation Control Layer Formed on a Free Top Surface of a First Block Copolymer from a Mixture of First and Second Block Copolymers
Soft And Conditionable Chemical Mechanical Polishing Pad Stack
Soft and Conditionable Chemical Mechanical Window Polishing Pad
Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer
Gap-Fill Methods
Hardmask
Hardmask
Polyurethane Composition for Cmp Pads and Method of Manufacturing Same
Controlled penetration subpad
Electroless Metallization of Dielectrics with Alkaline Stable Pyrazine Derivative Containing Catalysts
Photoacid-Generating Copolymer and Associated Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Substituted Aryl Onium Materials
Aryl Acetate Onium Materials
Aryl Acetate Onium Materials
Chemical Mechanical Polishing Composition for Polishing a Sapphire Surface and Methods of Using Same
Method of Chemical Mechanical Polishing a Substrate
Resins for Underlayers
Ephemeral Bonding
Ephemeral Bonding
Method for Chemical Mechanical Polishing Silicon Wafers
Patent:
8,980,749 →
Application:
14/062,060 →
Photoacid-Generating Copolymer and Associated Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Methods for Annealing Block Copolymers and Articles Manufactured Therefrom
Copper Electroplating Baths Containing Compounds of Reaction Products of Amines and Polyacrylamides
Method of Treating Gold or Gold Alloy with a Surface Treatment Solution Comprising a Disulfide Compound
Additives for Electroplating Baths
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Reaction Products of Guanidine Compounds or Salts Thereof, Polyepoxides and Polyhalogens
Methods of Forming Patterns with a Mask Formed Utilizing a Brush Layer
Methods of Forming Patterns by Using a Brush Layer and Masks
Imaging Three Dimensional Substrates Using a Transfer Film
Copolymer Formulations, Methods of Manufacture Thereof and Articles Comprising the Same
Method of Controlling Block Copolymer Characteristics and Articles Manufactured Therefrom
Copolymer with Acid-Labile Group, Photoresist Composition, Coated Substrate, and Method of Forming an Electronic Device
Gap-Fill Methods
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Aromatic Resins for Underlayers
Photoresist Pattern Trimming Compositions and Methods
Topcoat Compositions and Photolithographic Methods
Photolithographic Methods
Gap-Fill Methods
Cyanide-Free Acidic Matte Silver Electroplating Compositions and Methods
Method of Manufacturing Chemical Mechanical Polishing Layers
Method of Manufacturing Chemical Mechanical Polishing Layers
Nanostructure Material Methods and Devices
Adhesion Promoter
Adhesion Promoter
Reaction Products of Heterocyclic Nitrogen Compounds Polyepoxides and Polyhalogens
Reaction Products of Heterocyclic Nitrogen Compounds Polyepoxides and Polyhalogens
Chemical Mechanical Polishing Pad with Endpoint Detection Window
Chemical Mechanical Polishing Pad with Polishing Layer and Window
Soft and Conditionable Chemical Mechanical Polishing Pad with Window
Patent:
9,064,806 →
Application:
14/228,744 →
Chemical Mechanical Polishing Pad with Endpoint Detection Window
Chemical Mechanical Polishing Pad with Clear Endpoint Detection Window
Chemical Mechanical Polishing Pad
Imaging on Substrates with Alkaline Strippable Uv Blocking Compositions and Aqueous Soluble Uv Transparent Films
Imaging on Substrates with Aqueous Alkaline Soluble Uv Blocking Compositions and Aqueous Soluble Uv Transparent Films
Methods for Manufacturing Block Copolymers and Articles Manufactured Therefrom
Methods for Manufacturing Block Copolymers and Articles Manufactured Therefrom
Plating Method
Reaction Products of Amino Acids and Epoxies
Reaction Products of Amino Acids and Epoxies
Polyurethane Polishing Pad
Chemical Mechanical Polishing Layer Formulation with Conditioning Tolerance
Chemical Mechanical Polishing Composition and Method for Polishing Tungsten
Methods for Manufacturing Block Copolymer Compositions and Articles Manufactured Therefrom
Photoresist Composition and Associated Method of Forming an Electronic Device
Photoresist Composition and Associated Method of Forming an Electronic Device
Polymer Comprising Repeat Units with Photoacid-Generating Functionality and Base-Solubility-Enhancing Functionality, and Associated Photoresist Composition and Electronic Device Forming Method
Polymer Comprising Repeat Units with Photoacid-Generating Functionality and Base-Solubility-Enhancing Functionality, and Associated Photoresist Composition and Electronic Device Forming Method
Pattern Formation Methods
Polyarylene Materials
Metallization Inhibitors for Plastisol Coated Plating Tools
Controlled-Expansion Cmp Pad Casting Method
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
Photoresist Pattern Trimming Compositions and Methods
Organic Electroluminescent Compound and Organic Electroluminescent Device Comprising the Same
Surface Treatment Solutions for Gold and Gold Alloys
Method of Releasably Attaching a Semiconductor Substrate to a Carrier
Nanostructure Material Methods and Devices
Polishing Pad Window
Chemical Mechanical Plishing Pad with Window
New Metal Plating Compositions
New Metal Plating Compositions
Nanoparticle - Polymer Resists
Acid Generator Compounds and Photoresists Comprising Same
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Pyridyl Alkylamines and Bisepoxides
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Imidazole and Bisepoxide Compounds
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Alpha Amino Acids and Bisepoxides
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Imidazole Compounds, Bisepoxides and Halobenzyl Compounds
Method for Chemical Mechanical Polishing Substrates Containing Ruthenium and Copper
Photoresist Overcoat Compositions
Fluorene Derivatives as Light Emitting Elements for Electroluminescent Devices
Polyarylene Polymers
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
High-Stability Polyurethane Polishing Pad
Controlled-Viscosity Cmp Casting Method
Coating Composition for Use with an Overcoated Photoresist
Copper Electroplating Baths Containing Compounds of Reaction Products of Amines and Quinones
Copper Electroplating Baths Containing Reaction Products of Amines, Polyacrylamides and and Bisepoxoides
Copper Electroplating Baths Containing Reaction Products of Aminex, Polyacrylamides and Bisepoxides
Copper Electroplating Baths Containing Compounds of Reaction Products of Amines, Polyacrylamides and Sultones
Copper Electroplating Baths Containing Compounds of Reaction Products of Amines, Polyacrylamides and Sultones
Controlled-Porosity Method for Forming Polishing Pad
Composite Polishing Layer Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad with Composite Polishing Layer
Patent:
9,457,449 →
Application:
14/751,364 →
Chemical Mechanical Polishing Pad Composite Polishing Layer Formulation
Method of Making Composite Polishing Layer for Chemical Mechanical Polishing Pad
Method of Making Composite Polishing Layer for Chemical Mechanical Polishing Pad
Method of Making Polishing Layer for Chemical Mechanical Polishing Pad
Method of Making Polishing Layer for Chemical Mechanical Polishing Pad
Contact Hole Formation Methods
Patent:
9,455,177 →
Application:
14/840,941 →
Bismuth Electroplating Baths and Methods of Electroplating Bismuth on a Substrate
Arylcyclobutenes
Photoresist Composition, Coated Substrate Including the Photoresist Composition, and Method of Forming Electronic Device
Pattern Trimming Methods
Copper Electroplating Baths and Electroplating Methods Capable of Electroplating Megasized Photoresist Defined Features
Photoacid-Generating Monomer, Polymer Derived Therefrom, Photoresist Composition Including the Polymer, and Method of Forming a Photoresist Relief Image Using the Photoresist Composition
Photoacid-Generating Monomer, Polymer Derived Therefrom, Photoresist Composition Including the Polymer, and Method of Forming a Photoresist Relief Image Using the Photoresist Composition
Chemical Mechanical Polishing Method
Aromatic Resins for Underlayers
Pattern Trimming Compositions and Methods
Arylcyclobutenes
Patent:
9,441,055 →
Application:
14/858,224 →
Low-Defect-Porous Polishing Pad
Method of Electroplating Copper into a via on a Substrate from an Acid Copper Electroplating Bath
Method of Polishing Semiconductor Substrate
Patent:
9,293,339 →
Application:
14/863,548 →
Thermal Acid Generators and Photoresist Pattern Trimming Compositions and Methods
Chemical Mechanical Polishing Method
Patent:
9,484,212 →
Application:
14/927,704 →
Photoacid Generator
Photoacid Generator
Arylcyclobutenes
Photoresist Composition, Coated Substrate Including the Photoresist Composition, and Method of Forming Electronic Device
Debris-Removal Groove for Cmp Polishing Pad
Polymer Composite Containing Quantum Dots
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad Manufacturing Method
Polishing Pad
Polishing Pad and Method for Producing Same
Polishing Pad and Method for Producing Same
Polishing Pad, Manufacturing Method Therefor, and Method for Manufacturing a Semiconductor Device
Polishing Pad and Production Method Therefor, and Production Method for Semiconductor Device
Polishing Pad
Polishing Pad, Production Method for Same, and Production Method for Glass Substrate
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad and a Method for Manufacturing the Same
Polishing Pad and a Method for Manufacturing the Same
Curable Resin System Containing Quantum Dots
Spiroacridine Derivatives
Indium Electroplating Compositions Containing 1,10-Phenanthroline Compounds and Methods of Electroplating Indium
Patent:
9,809,892 →
Application:
15/212,737 →
Indium Electroplating Compositions Containing Amine Compounds and Methods of Electroplating Indium
Rheology Modifiers for Encapsulating Quantum Dots
High Removal Rate Chemical Mechanical Polishing Pads and Methods of Making
Radiation-Sensitive Compositions and Patterning and Metallization Processes
Radiation-Sensitive Compositions and Patterning and Metallization Processes
Tapered Poromeric Polishing Pad
Tapering Method for Poromeric Polishing Pad
Thermoplastic Poromeric Polishing Pad
Coating Composition for Photoresist Underlayer
Polymer Composite for Encapsulating Quantum Dots
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Pyrazole Compounds and Bisepoxides
Photoacid-Generating Compound, Polymer Derived Therefrom, Photoresist Composition Including the Photoacid-Generating Compound or Polymer, and Method of Forming a Photoresist Relief Image
Auto Catch Apparatus and Method of Use in Making Chemical Mechanical Polishing Pads
High Planarization Efficiency Chemical Mechanical Polishing Pads and Methods of Making
Chemical Mechanical Polishing of Tungsten Using a Method and Composition Containing Quaternary Phosphonium Compounds
Chemical Mechanical Polishing of Tungsten Using a Method and Composition Containing Quaternary Phosphonium Compounds
Patent:
10,604,678 →
Application:
16/270,725 →
Method to Shape the Surface of Chemical Mechanical Polishing Pads
Patent:
9,802,293 →
Application:
15/279,645 →
Polishing Slurry for Cobalt-Containing Substrate
Method for Polishing Cobalt-Containing Substrate
Method Using Silicon-Containing Underlayers
Photoacid-Generating Compound and Associated Polymer, Photoresist Composition, and Method of Forming a Photoresist Relief Image
Aqueous Compositions of Stabilized Aminosilane Group Containing Silica Particles
Patent:
9,803,108 →
Application:
15/297,706 →
Aromatic Resins for Underlayers
Aqueous Compositions of Low Abrasive Silica Particles
Patent:
9,783,702 →
Application:
15/297,716 →
Topcoat Compositions Containing Fluorinated Thermal Acid Generators
Topcoat Compositions Containing Fluorinated Thermal Acid Generators
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Method for Producing Sealed Optical Semiconductor Device
Method for Producing Sealed Optical Semiconductor Device
Polyarylene Resins
Formulations for Chemical Mechanical Polishing Pads and Cmp Pads Made Therewith
Pattern-Formation Methods
Methods of Cleaning Cmp Polishing Pads
Aliphatic Polyurethane Optical Endpoint Detection Windows and Cmp Polishing Pads Containing Them
Methods of Making Chemical Mechanical Polishing Layers Having Improved Uniformity
Curable Organopolysiloxane Composition and Semiconductor Device
Methods for Making Improved Quantum Dot Resin Formulations
Polymer Composites and Films Comprising Reactive Additives Having Thiol Groups for Improved Quantum Dot Dispersion and Barrier Properties
Acid-Cleavable Monomer and Polymers Including the Same
Chemical Mechanical Polishing Pad
Quantum Dot Light Emitting Devices
Environmentally Friendly Nickel Electroplating Compositions and Methods
Pattern Formation Methods and Photoresist Pattern Overcoat Compositions
Pattern Formation Methods and Photoresist Pattern Overcoat Compositions
Aliphatic Polyurethane Optical Endpoint Detection Windows and Cmp Polishing Pads Containing Them
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Aqueous Silica Slurry Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Chemical Mechanical Polishing Pads Having Offset Circumferential Grooves for Improved Removal Rate and Polishing Uniformity
Nickel Electroplating Compositions with Cationic Polymers and Methods of Electroplating Nickel
Nickel Electroplating Compositions with Copolymers of Arginine and Bisepoxides and Methods of Electroplating Nickel
Environmentally Friendly Nickel Electroplating Compositions and Methods
Ion Exchange Resins, Purification Methods and Methods of Making Ionic Resins
Iodine-Containing Polymers for Chemically Amplified Resist Compositions
Iodine-Containing Polymers for Chemically Amplified Resist Compositions
Silicon-Containing Underlayers
Uniform Cmp Polishing Method
High-Rate Cmp Polishing Method
Controlled Residence Cmp Polishing Method
Trapezoidal Cmp Groove Pattern
Silicon-Containing Underlayers
Quantum Dot Light Emitting Devices
Chemical Mechanical Polishing Method for Tungsten
Acoustic Wave Sensors and Methods of Sensing a Gas-Phase Analyte
Method for Producing Led by One Step Film Lamination
Salts and Photoresists Comprising Same
Hydrosilylation-Curable Silicone Composition
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Copper Electroplating Compositions and Methods of Electroplating Copper on Substrates
Methods of Making Stable and Thermally Polymerizable Vinyl, Amino or Oligomeric Phenoxy Benzocyclobutene Monomers with Improved Curing Kinetics
Gap-Filling Method
Purification Methods
High Removal Rate Chemical Mechanical Polishing Pads from Amine Initiated Polyol Containing Curatives
Salts and Photoresists Comprising Same
Zwitterion Compounds and Photoresists Comprising Same
Photoresist Compositions and Pattern Formation Methods
Photoresist Compositions and Methods
Iodine-Containing Photoacid Generators and Compositions Comprising the Same
Monomers, Polymers and Lithographic Compositions Comprising Same
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Polyimide-Polyarylene Polymers
A Method of Manufacturing an Optoelectronic Device
Biased Pulse Cmp Groove Pattern
Chemical Mechanical Polishing Method for Cobalt
Patent:
10,170,335 →
Application:
15/710,892 →
Chemical Mechanical Polishing Method for Cobalt
Aqueous Silica Slurry and Amine Carboxylic Acid Compositions Selective for Nitride Removal in Polishing and Methods of Using Them
Aqueous Silica Slurry and Amine Carboxylic Acid Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Aqueous Silica Slurry Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Flanged Optical Endpoint Detection Windows and Cmp Polishing Pads Containing Them
Aqueous Anionic Functional Silica Slurry and Amine Carboxylic Acid Compositions for Selective Nitride Removal in Polishing and Methods of Using Them
Aromatic Underlayer
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Chemical Mechanical Polishing Composition and Method for Tungsten
Patent:
10,597,558 →
Application:
16/166,085 →
Neutral to Alkaline Chemical Mechanical Polishing Compositions and Methods for Tungsten
Neutral to Alkaline Chemical Mechanical Polishing Compositions and Methods for Tungsten
Photoresist Topcoat Compositions and Methods of Processing Photoresist Compositions
Photoresist Pattern Trimming Compositions and Pattern Formation Methods
Method for Forming Pattern Using Antireflective Coating Composition Including Photoacid Generator
Aromatic Underlayer
Chemical Mechanical Polishing Pad and Polishing Method
Patent:
10,464,188 →
Application:
16/182,133 →
Chemical Mechanical Polishing Pad and Polishing Method
Patent:
10,569,384 →
Application:
16/182,168 →
Methods of Generating Managese (Iii) Ions in Mixed Aqueous Acid Solutions Using Ozone
Coating Composition for Use with an Overcoated Photoresist
Polishing Pad with Multipurpose Composite Window
Acid Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Coating Compositions and Methods of Forming Electronic Devices
Photoresist Pattern Trimming Compositions and Pattern Formation Methods
Anti-Reflective Coating
Cmp Polishing Pad with Enhanced Rate
Formulations for High Porosity Chemical Mechanical Polishing Pads with High Hardness and Cmp Pads Made Therewith
Formulations for Chemical Mechanical Polishing Pads with High Planarization Efficiency and Cmp Pads Made Therewith
Cmp Polishing Pad with Lobed Protruding Structures
Thin Film Fluopolymer Composite Cmp Polishing Method
Fluopolymer Composite Cmp Polishing Method
Low-Debris Fluopolymer Composite Cmp Polishing Pad
Cationic Fluoropolymer Composite Polishing Pad
Cationic Fluoropolymer Composite Polishing Method
Press-Fit Terminal with Improved Whisker Inhibition
Gas Sensors and Methods of Sensing a Gas-Phase Analyte
Cmp Polishing Pad with Window Having Transparency at Low Wavelengths and Material Useful in Such Window
Acidic Aqueous Silver-Nickel Alloy Electroplating Compositions and Methods
Acid Aqueous Binary Silver-Bismuth Alloy Electroplating Compositions and Methods
Polymeric Resin for Dielectric Applications
Method of Selective Chemical Mechanical Polishing Cobalt, Zirconium Oxide, Poly-Silicon and Silicon Dioxide Films.
Chemical Mechanical Polishing Pad and Preparation Thereof
Chemical Mechanical Polishing Pad and Preparation Thereof
Method of Enhancing Copper Electroplating
Method of Enhancing Copper Electroplating
Method of Forming Leveraged Poromeric Polishing Pad
Offset Pore Poromeric Polishing Pad
Photosensitive Bismaleimide Composition
Chemical Mechanical Polishing Composition Containing Composite Silica Particles, Method of Making the Silica Composite Particles and Method of Polishing a Substrate
Chemical Mechanical Polishing Composition Containing Composite Silica Particles, Method of Making the Silica Composite Particles and Method of Polishing a Substrate
Photoresist Compositions and Pattern Formation Methods
Cmp Polishing Pad with Uniform Window
Photoresist Compositions and Pattern Formation Methods
Cmp Polishing Pad with Polishing Elements on Supports
Tunable Refractive Index Polymers
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Uv Curable Silicone Composition and an Encapsulant or a Sheet Film Thereof
Underlayer Compositions and Patterning Methods
Optically Clear Shear Thickening Fluids and Optical Display Device Comprising Same
Formulations for High Porosity Chemical Mechanical Polishing Pads with High Hardness and Cmp Pads Made Therewith
Coating Compositions and Methods of Forming Electronic Devices
Composition for Photoresist Underlayer
Plurality of Light-Emitting Materials, Organic Electroluminescent Compound, and Organic Electroluminescent Device Comprising the Same
Silver Electroplating Compositions and Methods for Electroplating Silver with Low Coefficients of Friction
Photoresist Compositions and Pattern Formation Methods
Adhesion Promoting Photoresist Underlayer Composition
Coated Underlayer for Overcoated Photoresist
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Patent:
11,274,230 →
Application:
17/241,377 →
Photoresist Compositions and Pattern Formation Methods
Photoacid Generators, Photoresist Compositions, and Pattern Formation Methods
Photoresist Compositions and Pattern Formation Methods
Polymers Useful as Surface Leveling Agents
Photoresist Compositions and Pattern Formation Methods
Formulations for Chemical Mechanical Polishing Pads and Cmp Pads Made Therewith
Chemical Mechanical Polishing Pad and Polishing Method
Method of Enhancing the Removal Rate of Polysilicon
Patent:
11,472,984 →
Application:
17/485,595 →
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Reduction
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Reduction
Compressible Non-Reticulated Polyurea Polishing Pad
Patent:
11,548,114 →
Application:
17/472,609 →
Heterogeneous Fluoropolymer Mixture Polishing Pad
Uv-Curing Resin Compositions for Hard Coat Applications
Composite Materials for Dielectric Applications
Composite Pad for Chemical Mechanical Polishing
Silver Electroplating Compositions and Methods for Electroplating Rough Matt Silver
Patent:
11,629,426 →
Application:
17/852,825 →
Nickel Electroplating Compositions for Rough Nickel
Barrier Polishing Fluid
Selective Barrier Metal Polishing Method
Polishing Composition for Semiconductor Wafers
Transparent Polishing Pad
Polishing Pad and Method of Manufacture
Selective Barrier Slurry for Chemical Mechanical Polishing
Method for Forming a Porous Polishing Pad
Radial-Biased Polishing Pad
Polishing Pad Having a Window with Reduced Surface Roughness
Multi-Component Barrier Polishing Solution
Curved Grooving of Polishing Pads
Patent:
7,234,224 →
Application:
11/592,910 →
Chemical Mechanical Polishing Pad
Patent:
7,169,030 →
Application:
11/442,076 →
Three-Dimensional Network for Chemical Mechanical Polishing
Three-Dimensional Network for Chemical Mechanical Polishing
Three-Dimensional Network for Chemical Mechanical Polishing
Polymeric Barrier Removal Polishing Slurry
Method of Polishing a Substrate
Cmp Pad Having Unevenly Spaced Grooves
Patent:
7,267,610 →
Application:
11/512,994 →
Cmp Pad Having Overlaid Constant Area Spiral Grooves
Patent:
7,300,340 →
Application:
11/512,699 →
Chemical Mechanical Polishing Pad
Polishing Pad with Grooves to Reduce Slurry Consumption
Polishing Pad with Grooves to Reduce Slurry Consumption
Polishing Pad with Grooves to Retain Slurry on the Pad Texture
Patent:
7,311,590 →
Application:
11/700,346 →
Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad
Elastomer-Modified Chemical Mechanical Polishing Pad
Patent:
7,371,160 →
Application:
11/644,478 →
Layered-Filament Lattice for Chemical Mechanical Polishing
Interpenetrating Network for Chemical Mechanical Polishing
Interpenetrating Network for Chemical Mechanical Polishing
Interconnected-Multi-Element-Lattice Polishing Pad
Chemical Mechanical Polishing Pad with Controlled Wetting
Low-stain polishing composition
Chemical Mechanical Polishing Composition and Methods Relating Thereto
Chemical Mechanical Polishing Pad Having Sealed Window
Chemical Mechanical Polishing Pad Having a Low Defect Window
Chemical Mechanical Polishing Pad Having a Low Defect Integral Window
Method of Manufacturing a Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad Manufacturing Assembly
Multilayer Chemical Mechanical Polishing Pad Manufacturing Process
Multi-functional polishing pad
High-Rate Polishing Method
High-Rate Groove Pattern
Mix Head Assembly for Forming Chemical Mechanical Polishing Pads
Method for Manufacturing Chemical Mechanical Polishing Pad Polishing Layers Having Reduced Gas Inclusion Defects
Method for Chemical Mechanical Polishing a Substrate
Dual-Pore Structure Polishing Pad
Dual-Pore Structure Polishing Pad
Chemical Mechanical Polishing Composition and Methods Relating Thereto
Creep-Resistant Polishing Pad Window
Tin Plating
Methods of Forming Printed Circuit Boards
Leveler Compounds
Leveler Compounds
Leveler Compounds
Leveler Compounds
Optical Dry-Films and Methods of Forming Optical Devices with Dry Films
Photoresist Compositions
Delivery Device
Optical Dry-Films and Methods of Forming Optical Devices with Dry Films
Photoresist Compositions
Gold Alloy Electrolytes
Gold Alloy Electrolytes
Photoresist Compositions Comprising Resin Blends
Silicon-Containing Polymers and Polymers and Optical Waveguides Formed Therefrom
Metallization of Dielectrics
Compositions and processes for immersion lithography
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Phenolic Polymers and Photoresists Comprising Same
Phenolic polymers and photoresists comprising same
Photosensitive Composition
Photosensitive Composition
Plating Method
Stripper for Electronics
Coating Compositions for Photoresists
Coating Compositions for Photoresists
Coating Compositions for Use with an Overcoated Photoresist
Indium Compositions
Indium compositions
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Electrochemically Deposited Indium Composites
Electrochemically deposited indium composites
Metal Plating Compositions
Metal Plating Compositions
Compositions and Processes for Immersion Lithography
Electroplating Bronze
Methods of Forming Printed Circuit Boards Having Optical Functionality
Metal Plating Compositions and Methods
Metal Plating Compositions and Methods
Photoresists comprising novolak resin blends
Acidic Gold Alloy Plating Solution
High Speed Method for Plating Palladium and Palladium Alloys
Lead-Free Tin Alloy Electroplating Compositions and Methods
Copper Plating Bath Formulation
Copper Plating Process
Compositions and Processes for Immersion Lithography
Compositions and Processes for Immersion Lithography
Compositons and Processes for Immersion Lithography
Photosensitive Compositions
Method of replenishing indium ions in indium electroplating compositions
Photoresists and Methods of Use Thereof
Photoresists and Methods for Use Thereof
Photoresists and Methods for Use Thereof
Photoresists and Methods for Use Thereof
Coating Compositions for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Method for replenishing tin and its alloying metals in electrolyte solutions
Compositions and processes for photolithography
Compositions Comprising Sulfonamide Material and Processes for Photolithography
Compositions comprising sulfonamide material and processes for photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Compositions and Processes for Photolithography
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions for Use with an Overcoated Photoresist
Photoacid Generators and Photoresists Comprising Same
Selenium Ink and Methods of Making and Using Same
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Coating Compositions Suitable for Use with an Overcoated Photoresist
Dichalcogenide Selenium Ink and Methods of Making and Using Same
Dichalcogenide Selenium Ink and Methods of Making and Using Same
Anti-Displacement Hard Gold Compositions
Selenium/group 1B ink and methods of making and using same
Selenium/Group 1B Ink and Methods of Making and Using Same
Compositions Comprising Base-Reactive Component and Processes for Photolithography
Group 3a ink and methods of making and using same
Cholate Photoacid Generators and Photoresists Comprising Same
Cholate Photoacid Generators and Photoresists Comprising Same
Sulfonyl Photoacid Generators and Photoresists Comprising Same
Sulfonyl Photoacid Generators and Photoresists Comprising Same
Photoresist Comprising Nitrogen-Containing Compound
Patent:
9,475,763 →
Application:
14/589,759 →
Photoresist Comprising Nitrogen-Containing Compound
Heat Stable Aryl Polysiloxane Compositions
Aryl (Thio)Ether Aryl Polysiloxane Composition and Methods for Making and Using Same
(Thio)Phenoxy Phenyl Silane Compostion and Method for Making Same
Phenoxyphenyl Polysiloxane Composition and Method for Making and Using Same
Optical Assembly and Method of Forming an Optical Assembly
Optical Article and Method of Forming
Curable Compositions of Resin-Linear Organosiloxane Block Copolymers
Compositions of Resin-Linear Organosiloxane Block Copolymers
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
Reactive Silicone Composition, Hotmelt Material Made Therefrom, and Curable Hotmelt Composition
Sulfur-Containing Polyorganosiloxane Compositions And Related Aspects
Flame retardant EMI shields
Shielding Strips
Patent:
7,078,614 →
Application:
11/056,428 →
Combined Board Level Shielding and Thermal Management
Emi Shielding and Thermal Management Assemblies Including Frames and Covers with Multi-Position Latching
Combined Board Level Emi Shielding and Thermal Management
Gaskets for Providing Environmental Sealing and/or Electromagnetic Interference (Emi) Shielding
Electromagnetic Interference Shielding Apparatus and Methods of Making the Same
Mounting Clips for Use with Electromagnetic Interference Shielding and Methods of Using the Same
Electromagnetic Interference Shields and Related Manufacturing Methods
Emi Shielding/Electrical Grounding Members
Fabric-Over-Foam Emi Gaskets Having Transverse Slits and Related Methods
Electromagnetic Interference (Emi) Shielding Apparatus and Related Methods
Stretched Articles Suitable for Use as EMI Absorbers
Board Level Electromagnetic Interference (Emi) Shields with Through Hole Latching Mechanisms
Profile for a Co-Extrusion
Patent:
690,272 →
Application:
29/391,277 →
Profile for a Co-Extrusion
Patent:
707,185 →
Application:
29/467,861 →
Card Guide Grounding Strips
Vent Panel
Patent:
728,773 →
Application:
29/420,326 →
Metallized Film-Over-Foam Contacts
Flame Retardant, Electrically Conductive Adhesive Materials and Related Methods
Cavity Resonance Reduction and/or Shielding Structures Including Frequency Selective Surfaces
Shielding Structures Including Frequency Selective Surfaces
Frequency Selective Structures for Emi Mitigation
Electromagnetic Interference Shielding (Emi) Apparatus Including a Frame with Drawn Latching Features
Electromagnetic Interference Shielding (Emi) Apparatus Including a Frame with Drawn Latching Features
Selectively Conductive EMI Gaskets
Electromagnetic Interference (Emi) Shielding Apparatus Including Electrically-Conductive Foam
Board Level Electromagnetic Interference (EMI) Shields With Increased Under-Shield Space
Circuit Assemblies and Related Methods
Circuit Assemblies And Related Methods
Board Level Shield Including an Integrated Heat Sink
Board Level Shields with Adjustable Covers
Soft and/or Flexible Emi Shields and Related Methods
Board Level Shields Including Foil and/or Film Covers
Board Level Shields With Virtual Grounding Capability
Board Level Shields with Virtual Grounding Capability
Absorber Assemblies Having a Dielectric Spacer, and Corresponding Methods of Assembly
Board Level Shield (Bls) Frames Including Pickup Members with Pickup Areas Rotatable in Place When Drawn
Method for Forming a Pickup Area of a Board Level Shield
Slotted Fabric Over Foam Electromagnetic Interference Gaskets
Patent:
10,212,863 →
Application:
15/928,309 →
Frames For Electromagnetic Interference (EMI) Shielding Assemblies Including Detachable Pickup Members
Frames for Electromagnetic Interference (Emi) Shielding Assemblies Including Detachable Pickup Members
Frame for Shielding Assembly
Patent:
895,623 →
Application:
29/665,695 →
Frame for a Shielding Assembly
Patent:
919,626 →
Application:
29/745,216 →
Frame for Shielding Assembly
Patent:
1,000,986 →
Application:
29/781,612 →
Frames for Shielding Assemblies and Shielding Assemblies Including the Same
Frames for Shielding Assemblies and Shielding Assemblies Including the Samo
Emi Shields Including Electrically-Conductive Foam
Thermal Interface Materials Including Memory Foam Cores
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers Including Aluminum Powder
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers Including Aluminum Powder
Common Mode Choke Including Conductors Within Dielectric Layer and Associated Methods
Thermal Interface Material with Thin Transfer Film or Metallization
Thermal Interface Materials with Thin Film or Metallization
Assemblies and Methods for Dissipating Heat from Handheld Electronic Devices
Assemblies and Methods for Dissipating Heat from Handheld Electronic Devices
Assemblies and Methods for Dissipating Heat from Handheld Electronic Devices
Memory Modules Including Compliant Multilayered Thermally-Conductive Interface Assemblies
Compliant Multilayered Thermally-Conductive Interface Assemblies
Thermal Interface Material Assemblies, and Related Methods
Thermal Interface Materials Including Thermally Reversible Gels
Materials Including Thermally Reversible Gels
Thermal Interface Materials Including Thermally Reversible Gels
Thermal Interface Materials
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources
Methods For Establishing Thermal Joints Between Heat Spreaders Or Lids And Heat Sources
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources
Methods for Establishing Thermal Joints Between Heat Spreaders or Lids and Heat Sources
Thermal Interface Material Assemblies and Related Methods
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers with Silicon Carbide
Thermally-Conductive Electromagnetic Interference (EMI) Absorbers With Silicon Carbide
Thermally-Conductive Electromagnetic Interference (EMI) Absorbers With Silicon Carbide
Multifunctional Components for Electronic Devices and Related Methods of Providing Thermal Management and Board Level Shielding
Multifunctional Components for Electronic Devices and Related Methods of Providing Thermal Management and Board Level Shielding
Thermal Interface Materials with Low Secant Modulus of Elasticity and High Thermal Conductivity
Thermal Interface Materials With Low Secant Modulus Of Elasticity And High Thermal Conductivity
Thermal Interface Materials with Low Secant Modulus of Elasticity and High Thermal Conductivity
Thermal Management and/or Emi Mitigation Materials with Custom Colored Exterior Surfaces
Devices for Absorbing Energy from Electronic Components
Devices For Absorbing Energy From Electronic Components
Methods of Applying Thermal Interface Materials to Board Level Shields
Compressible Foamed Thermal Interface Materials and Methods of Making the Same
Compressible Foamed Thermal Interface Materials and Methods of Making the Same
Thermal Interface Materials With Reinforcement For Abrasion Resistance And/Or Suitable For Use Between Sliding Components
Highly Compliant Non-Silicone Putties and Thermal Interface Materials Including the Same
Adhesive, Thermally Conductive, Electrical Insulators
Systems of Applying Materials to Components
Material Having an Edge Shape
Patent:
881,822 →
Application:
29/621,302 →
Material Having Edging
Patent:
879,046 →
Application:
29/621,364 →
Material Having Edging
Patent:
999,405 →
Application:
29/728,991 →
Material Having Edge Shape
Patent:
998,827 →
Application:
29/731,731 →
System for Applying Interface Materials
Thermal Interface Material Assemblies and Systems and Methods for Controllably Changing Surface Tack of Thermal Interface Materials
Thermal Interface Material Assemblies and Systems and Methods for Controllably Changing Surface Tack of Thermal Interface Materials
Systems And Methods Of Applying Materials To Components
Systems and Methods of Applying Materials to Components
Thermal Interface Materials with Wear-Resisting Layers and/or Suitable for Use Between Sliding Components
Shielding Enclosures
Highly Thermally-Conductive Moldable Thermoplastic Composites and Compositions
Polymer Matrices Functionalized with Carbon-Containing Species for Enhanced Thermal Conductivity
Polymer Matrices Functionalized with Liquid Crystals for Enhanced Thermal Conductivity
Thermal Interface Materials Including Electrically-Conductive Material
Thermally-Conductive Electromagnetic Interference (Emi) Absorbers Positioned or Positionable Between Board Level Shields and Heat Sinks
Thermal Management Assemblies Suitable for Use with Transceivers and Other Devices
Laser Weldable Brackets for Attachment of Heat Sinks to Board Level Shields
Board Level Shields and Systems and Methods of Applying Board Level Shielding
Thermal Transfer/Management And EMI Shielding/Mitigation Solutions For Electronic Devices
Thermal Management and/or EMI Mitigation Materials Including Coated Fillers
Thermal Management and/or EMI Mitigation Materials Including Coated Fillers
Low Dielectric, Low Loss Radomes
Patterned Electromagnetic Interference (Emi) Mitigation Materials Including Carbon Nanotubes
Blends of Perfluoroelastomers and Fluoroplastics
Perfluoroelastomer Articles Having Good Surface Properties
Perfluoroelastomer Compositions for Low Temperature Applications
Process for Producing Fluoroelastomers
Cured Perfluoroelastomer Article
Curable Fluoroelastomer Composition
Curable Fluoroelastomer Compostion
Curable Fluoroelastomer Composition
Patent:
8,338,542 →
Application:
13/531,697 →
Catalytic Process for Phospho-Halogenation of Fluorinated Alcohols
Curable Fluoroelastomer Composition
Curable Fluoroelastomer Composition
Cured Perfluoroelastomer Article
Curing Agents for Compounds
Curing Agents for Compounds
Fluoro-Rubber Composition and Bladder for Tire Fabrication
Fluorine Rubber Composition and Bladder for Tire Production
Curing Agents for Fluoroelastomers
Curable Fluoroelastomer Composition
Curable Fluoroelastomer Composition
Curing Agents for Compounds
Fluoroelastomer Compounds
Fluoroelastomer Compounds
Curable Fluoroelastomer Compositions
Method to Remove Resist, Etch Residue, and Copper Oxide from Substrates Having Copper and Low-K Dielectric Material
Methods of Cleaning Semiconductor Devices at the Back End of Line Using Amidoxime Compositions
Cleaning Composition Comprising a Chelant and Quaternary Ammonium Hydroxide Mixture
Method for Making a Photoresist Stripping Solution Comprising an Organic Sulfonic Acid and an Organic Hydrocarbon Solvent
Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material
Method and Composition for Removing Resist, Etch Residue, and Copper Oxide from Substrates Having Copper, Metal Hardmask and Low-K Dielectric Material
Cleaning Composition and Method for Cleaning a Semiconductor Device Substrate After Chemical Mechanical Polishing
Aluminum Post-Etch Residue Removal with Simultaneous Surface Passivation
Removal Composition for Selectively Removing Hard Mask and Methods Thereof
Removal Composition for Selectively Removing Hard Mask and Methods Thereof
Removal of Contaminants from Euv Masks
Methods for Forming Multilayer Structures
Bendable Circuit Board for Led Mounting and Interconnection
Self-Sanitizing Structure for Automatically Neutralizing Infectious Agents on the Structure's Commonly Touched Surfaces
Self-Sanitizing Structure for Automatically Neutralizing Infectious Agents on the Structure's Commonly Touched Surfaces
Self-Sanitizing Structure for Implementing Sanitization Patterns That Neutralize Infectious Agents on the Structure's Surfaces
Self-Sanitizing Structure for Implementing Sanitization Patterns That Neutralize Infectious Agents on the Structure's Surfaces
Panel Having Integrated Antennas for Enhancing Range of Telecommunication Signal Transmissions Inside Buildings
Moveable Gripper for Gripping a Container and Heating Contents of the Container Through Dynamically Controlled Thermal Contact and Heat Settings
Derivatized Novolak Polyhydroxystyrene from Hydroxyphenylmethylcarbinol
Derivatized Polyhydroxystyrenes (Dphs) with a Novolak Type Structure and Blocked Dphs (Bdphs) and Processes for Preparing the Same
Process for Preparing Stable Photoresist Compositions
Process for Preparing Stable Photoresist Compositions
New Propanoates and Processes for Preparing the Same
Substantially Symmetrical 3-Arm Star Block Copolymers
Polyimide Composite Coverlays and Methods and Compositions Relating Thereto
Polycyclic Polyimides and Compositions and Methods Relating Thereto
Capacitive Devices, Organic Dielectric Laminates, and Printed Wiring Boards Incorporating Such Devices, and Methods of Making Thereof
Low Temperature Cure Polyimide Compositions Resistant to Arc Tracking and Methods Relating Thereto
Flame Retardant Photoimagable Coverlay Compositions and Methods Relating Thereto
Flame Retardant Multi-Layer Photoimagable Coverlay Compositions and Methods Relating Thereto
Low Color Polyimide Compositions Useful in Optical Type Applications and Methods and Compositions Relating Thereto
Resistor Compositions for Electronic Circuitry Applications
Film Based Heating Device and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Pigmented Polyimide Films and Methods Relating Thereto
Polyimide Film and Method of Manufacture Thereof
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Light Emitting Diode Assembly and Thermal Control Blanket and Methods Relating Thereto
Polyimide Film
Three Dimensional Light Emitting Diode Systems, and Compositions and Methods Relating Thereto
Colored Polyimide Films and Methods Relating Thereto
Led Light
Patent:
687,980 →
Application:
29/412,126 →
Led Light
Patent:
685,932 →
Application:
29/412,127 →
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Matte Finish Polyimide Films and Methods Relating Thereto
Multilayer Film
Multilayer Film
Multilayer Film
Thin-Film Heating Device
Multilayer Film for Electronic Circuitry Applications
Low Haze Polymer Films and Electronic Devices
Coated Films and Electronic Devices
Polymer Films and Electronic Devices
Multilayer Polymer Film
Cover Windows for Displays
Multilayer Polymer Film
Polyimide Compositions and Polyimide Solutions
Polyimide Films and Electronic Devices
Polyimide Films and Electronic Devices
Single Layer Polymer Films and Electronic Devices
Cover Window Assembly, Related Articles and Methods
Single Layer Polymer Films and Electronic Devices
Coating Solutions and Crosslinked Polymer Films
Consolidated Polymer Film
Composite and Copper Clad Laminate Made Therefrom
Polyamic Acid Solutions, Polyimide Films and Electronic Devices
Polyimide Films and Electronic Devices
Polymer Compositions and Coating Solutions
Photoresist Compositions and Processes for Preparing the Same
Polymers for Use in Electronic Devices
Polymers for Use in Electronic Devices
Polymers For Use In Electronic Devices
Polymers for Use in Electronic Devices
Polymers for Use in Electronic Devices
Fluoropolymer Compositions and Articles Made Therefrom
PCT:
PCT/US2024/012491 ↗
Fluoroelastomer Compounds
PCT:
PCT/US2023/080464 ↗
Fluoroelastomer Compounds
PCT:
PCT/US2023/080468 ↗
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 17, 2018
From: WEIS, JONATHAN G.; CHIOU, NAN-RONG; JACOB, GEORGE C.; QIAN, BAINIAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 045564/0086 →
Assignment of Assignor's Interest
Nov 7, 2019
From: CUI, LI; YAMADA, SHINTARO; KE, IOU-SHENG; LABEAUME, PAUL J.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 050950/0185 →
Assignment of Assignor's Interest
Feb 13, 2020
From: PARK, JONG KEUN; AQAD, EMAD; SONG, YANG; WU, CHUNYI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 051929/0226 →
Assignment of Assignor's Interest
Apr 15, 2020
From: ISLAM, MOHAMMAD T.; CHIOU, NAN-RONG; GADINSKI, MATTHEW R.; PARK, YOUNGRAE
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 052407/0481 →
Assignment of Assignor's Interest
Feb 10, 2021
From: MCCORMICK, JOHN R.; BARTON, BRYAN E.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 055212/0805 →
Assignment of Assignor's Interest
May 10, 2021
From: KAITZ, JOSHUA; YANG, KE; ZHANG, KEREN; CAMERON, JAMES F.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 056183/0925 →
Assignment of Assignor's Interest
Jun 18, 2021
From: KAITZ, JOSHUA; FINCH, MICHAEL; LABEAUME, PAUL J.; YAMADA, SHINTARO
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 056581/0789 →
Assignment of Assignor's Interest
Sep 17, 2021
From: YANG, KE; AQAD, EMAD; CAMERON, JAMES F.; COLEY, SUZANNE M.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 057518/0686 →
Assignment of Assignor's Interest
Nov 4, 2021
From: AQAD, EMAD; PARK, JONG KEUN; POPERE, BHOOSHAN C.; CUI, LI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058024/0250 →
Assignment of Assignor's Interest
Dec 7, 2021
From: PATTERSON, ANASTASIA; SECKMAN, BETHANY L; WANG, DEYAN; GILMORE, CHRISTOPHER D
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 058324/0546 →
Assignment of Assignor's Interest
Mar 31, 2022
From: CHI, CHANGZAI; TETTEY, KWADWO; VANHANEHEM, MATTHEW RICHARD; THEIVANAYAGAM, MURALI GANTH
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 059461/0085 →
Assignment of Assignor's Interest
May 24, 2022
From: DEGROOT, MARTY W.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 059993/0899 →
Assignment of Assignor's Interest
May 24, 2022
From: QIAN, BAINIAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 059993/0886 →
Assignment of Assignor's Interest
Mar 1, 2023
From: DIEV, VIACHESLAV V; KONDAKOV, DENIS YURIEVICH; ZOU, YUNLONG
To: DUPONT ELECTRONICS, INC.
Reel/Frame 062837/0947 →
Assignment of Assignor's Interest
Mar 2, 2023
From: MARANGONI, TOMAS; HE, HUAN; KAITZ, JOSHUA; CUI, LI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 062860/0417 →
Assignment of Assignor's Interest
Nov 8, 2023
From: HOU, GUANHUA; BARTON, BRYAN E.; ALSBAIEE, ALAAEDDIN; WANK, ANDREW
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 065493/0546 →
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
Change of Name & Address
Jan 6, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS (SHANGHAI) LTD.
To: DUPONT TECHNOLOGY (SHANGHAI) CO., LTD.
Reel/Frame 069825/0503 →
Change of Name
Jun 27, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 071765/0928 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →