IP Library Granted Patent US 10,259,099
Granted Patent B2
US 10,259,099 · App. 15/229,009 · Granted Apr 16, 2019

Tapering method for poromeric polishing pad

Inventors: Koichi Yoshida (Kyoto, JP); Kazutaka Miyamoto (Mie, JP); Katsumasa Kawabata (Kyoto, JP); Henry Sanford-Crane (Elkton, MD); Hui Bin Huang (Monroeville, NJ); George C. Jacob (Newark, DE); Shuiyuan Luo (Newark, DE)
Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
B24B37/24B24B37/26B24D18/0009
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Quick Facts
Patent No.
US 10,259,099
App. No.
15/229,009
Granted
Apr 16, 2019
Kind
B2
Abstract

The method forms a porous polyurethane polishing pad by coagulating thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. Heating a press to temperature below or above the softening onset temperature of the thermoplastic polyurethane forms a series of pillows. Plastic deforming side walls of the pillow structures forms downwardly sloped side walls. The downwardly sloped side walls extend from all sides of the pillow structures. The large pores open to the downwardly sloped sidewalls are less vertical than the large pores open to the top polishing surface and are offset 10 to 60 degrees from the vertical direction.

Claims (18)

1. A method of forming a porous polyurethane polishing pad comprising:

coagulating a thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with small pores, a portion of the large pores being open to a top polishing surface, the large pores extending to the top polishing surface having a substantially vertical orientation and the thermoplastic polyurethane having a softening onset temperature;

heating a press to a temperature 10K below to 10K above the softening onset temperature of the thermoplastic polyurethane, the softening onset temperature being defined by an initial TMA change in slope and pressing the heated press against the thermoplastic polyurethane to form a series of pillow structures formed from the porous matrix that include the large pores and the small pores;

plastic deforming side walls of the pillow structures to form downwardly sloped side walls, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls; and

melting and solidifying the thermoplastic polyurethane at the bottom of the sloped sidewalls to close the majority of the large and small pores and form groove channels.

2. The method of claim 1 wherein the plastic deforming sidewalls and the melting and solidifying steps form a grid of interconnecting grooves.

3. The method of claim 1 wherein the plastic deforming sidewalls forms downwardly sloped side walls having an initial taper region of 5 to 30 from the polishing surface leading into the downwardly sloped side walls.

4. The method of claim 1 wherein a heated plate press initiates the plastic deforming sidewalls and the melting and solidifying of the thermoplastic polyurethane at the bottom of the sloped sidewalls.

5. The method of claim 1 wherein a majority of the small pores in the plastically deformed sidewalls remain open a distance of at least 100 μm as measured from a top of the sidewalls at the polishing surface to the groove channels.

6. A method of forming a porous polyurethane polishing pad comprising:

coagulating a thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with small pores, a portion of the large pores being open to a top polishing surface, the large pores extending to the top polishing surface having a substantially vertical orientation and the thermoplastic polyurethane having a softening onset temperature;

heating a press to a temperature 5K below to 5K above the softening onset temperature of the thermoplastic polyurethane, the softening onset temperature being defined by an initial TMA change in slope and pressing the heated press against the thermoplastic polyurethane to form a series of pillow structures formed from the porous matrix that include the large pores and the small pores;

plastic deforming side walls of the pillow structures to form downwardly sloped side walls, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls; and

melting and solidifying the thermoplastic polyurethane at the bottom of the sloped sidewalls to close the majority of the large and small pores and form groove channels.

7. The method of claim 6 wherein the plastic deforming sidewalls and the melting and solidifying steps form a grid of interconnecting grooves.

8. The method of claim 6 wherein the plastic deforming sidewalls forms downwardly sloped side walls having an initial taper region of 5 to 30 from the polishing surface leading into the downwardly sloped side walls.

9. The method of claim 6 wherein a heated press initiates the plastic deforming sidewalls and the melting and solidifying of the thermoplastic polyurethane at the bottom of the sloped sidewalls.

10. The method of claim 6 wherein a majority of the small pores in the plastically deformed sidewalls remain open a distance of at least 100 μm as measured from a top of the sidewalls at the polishing surface to the groove channels.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2016
From: YOSHIDA, KOICHI; MIYAMOTO, KAZUTAKA; KAWABATA, KATSUMASA; SANFORD-CRANE, HENRY; HUANG, HUI BIN; JACOB, GEORGE C.; LUO, SHUIYUAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 039813/0060 →
Continuity (1)
Related Publication 20180036860A1 · Feb 8, 2018
Cited By (1)
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