Patent Assignment
Reel/Frame 069274/0160
Change of Name
Recorded: 2024-10-29
Pages: 9
Assignor
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
Executed: 2024-04-01
Assignee
DUPONT ELECTRONIC MATERIALS HOLDING, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Properties
(209)
Chemical Mechanical Polishing Pad with Light Stable Polymeric Endpoint Detection Window and Method of Polishing Therewith
Method of Forming Silicate Polishing Pad
Silicate Composite Polishing Pad
Hollow Polymeric-Silicate Composite
Method of manufacturing chemical mechanical polishing layers
Forming Alkaline-Earth Metal Oxide Polishing Pad
Hollow Polymeric-Alkaline Earth Metal Oxide Composite
Alkaline-Earth Metal Oxide-Polymeric Polishing Pad
Method for chemical mechanical polishing layer pretexturing
Method of manufacturing grooved chemical mechanical polishing layers
Soft And Conditionable Chemical Mechanical Polishing Pad
Polyurethane Composition for Cmp Pads and Method of Manufacturing Same
Controlled penetration subpad
Method of Manufacturing Chemical Mechanical Polishing Layers
Method of Manufacturing Chemical Mechanical Polishing Layers
Controlled-Expansion Cmp Pad Casting Method
Chemical Mechanical Plishing Pad with Window
Composite Polishing Layer Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad with Composite Polishing Layer
Patent:
9,457,449 →
Application:
14/751,364 →
Low-Defect-Porous Polishing Pad
Debris-Removal Groove for Cmp Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad Manufacturing Method
Polishing Pad
Polishing Pad and Method for Producing Same
Polishing Pad and Method for Producing Same
Polishing Pad, Manufacturing Method Therefor, and Method for Manufacturing a Semiconductor Device
Polishing Pad and Production Method Therefor, and Production Method for Semiconductor Device
Polishing Pad
Polishing Pad, Production Method for Same, and Production Method for Glass Substrate
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad
Polishing Pad and a Method for Manufacturing the Same
Polishing Pad and a Method for Manufacturing the Same
Tapered Poromeric Polishing Pad
Tapering Method for Poromeric Polishing Pad
Thermoplastic Poromeric Polishing Pad
Auto Catch Apparatus and Method of Use in Making Chemical Mechanical Polishing Pads
Method to Shape the Surface of Chemical Mechanical Polishing Pads
Patent:
9,802,293 →
Application:
15/279,645 →
Formulations for Chemical Mechanical Polishing Pads and Cmp Pads Made Therewith
Methods of Cleaning Cmp Polishing Pads
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Application:
15/924,606 →
Publication:
US US20180345449A1
Chemical Mechanical Polishing Pads Having Offset Circumferential Grooves for Improved Removal Rate and Polishing Uniformity
Uniform Cmp Polishing Method
High-Rate Cmp Polishing Method
Controlled Residence Cmp Polishing Method
Trapezoidal Cmp Groove Pattern
Biased Pulse Cmp Groove Pattern
Flanged Optical Endpoint Detection Windows and Cmp Polishing Pads Containing Them
High Removal Rate Chemical Mechanical Polishing Pads from Amine Initiated Polyol Containing Curatives
Thin Film Fluoropolymer Composite Cmp Polishing Pad
Application:
16/435,913 →
Publication:
US US20200384601A1
Chemical Mechanical Polishing Pad and Polishing Method
Patent:
10,464,188 →
Application:
16/182,133 →
Chemical Mechanical Polishing Pad and Polishing Method
Patent:
10,569,384 →
Application:
16/182,168 →
Polishing Pad with Multipurpose Composite Window
Cmp Polishing Pad with Enhanced Rate
Formulations for High Porosity Chemical Mechanical Polishing Pads with High Hardness and Cmp Pads Made Therewith
Formulations for Chemical Mechanical Polishing Pads with High Planarization Efficiency and Cmp Pads Made Therewith
Cmp Polishing Pad with Lobed Protruding Structures
Thin Film Fluopolymer Composite Cmp Polishing Method
Fluopolymer Composite Cmp Polishing Method
Low-Debris Fluopolymer Composite Cmp Polishing Pad
Cationic Fluoropolymer Composite Polishing Pad
Cationic Fluoropolymer Composite Polishing Method
Cmp Polishing Pad with Window Having Transparency at Low Wavelengths and Material Useful in Such Window
Chemical Mechanical Polishing Pad and Preparation Thereof
Chemical Mechanical Polishing Pad and Preparation Thereof
Leveraged Poromeric Polishing Pad
Application:
16/852,418 →
Publication:
US US20210323115A1
Method of Forming Leveraged Poromeric Polishing Pad
Offset Pore Poromeric Polishing Pad
Cmp Polishing Pad with Uniform Window
Cmp Polishing Pad with Polishing Elements on Supports
Cmp Polishing Pad with Protruding Structures Having Engineered Open Void Space
Application:
18/331,418 →
Publication:
US US20230311269A1
Cmp Polishing Pad with Protruding Structures Having Engineered Open Void Space
Application:
16/829,024 →
Publication:
US US20210299816A1
Formulations for High Porosity Chemical Mechanical Polishing Pads with High Hardness and Cmp Pads Made Therewith
Micro-Layer Cmp Polishing Subpad
Application:
18/490,290 →
Publication:
US US20240181596A1
Formulations for Chemical Mechanical Polishing Pads and Cmp Pads Made Therewith
Chemical Mechanical Polishing Pad and Polishing Method
Cmp Polishing Pad
Application:
18/503,445 →
Publication:
US US20240091901A1
Fluorinated Polyurea Copolymer Pad
Application:
17/472,607 →
Publication:
US US20230082181A1
Compressible Non-Reticulated Polyurea Polishing Pad
Patent:
11,548,114 →
Application:
17/472,609 →
Heterogeneous Fluoropolymer Mixture Polishing Pad
Cmp Pad Having Ultra Expanded Polymer Microspheres
Composite Pad for Chemical Mechanical Polishing
Pad for Chemical Mechanical Polishing
Application:
17/661,077 →
Publication:
US US20230347470A1
Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features
Method of Making Low Specific Gravity Polishing Pads
Cmp Pad Having Polishing Layer of Low Specific Gravity
Polishing Pad Formed from Dual Curative
Application:
18/360,947 →
Publication:
US US20250033161A1
Chemical Mechanical Polishing Pad with Fluorinated Polymer and Multimodal Groove Pattern
Polishing Pad with Endpoint Window
Application:
18/404,415 →
Publication:
US US20240253175A1
Polishing Pad with Endpoint Window
Application:
18/404,443 →
Publication:
US US20240253176A1
Dual-Layer Cmp Polishing Subpad
Application:
18/490,345 →
Publication:
US US20240181597A1
Polishing Pad with Endpoint Detection Window
Application:
18/404,519 →
Publication:
US US20240253177A1
Chemical Mechanical Polishing Pad
Application:
18/373,660 →
Publication:
US US20250100099A1
Method of Polishing Using Chemical Mechanical Polishing Pad
Application:
18/373,692 →
Publication:
US US20250100100A1
Chemical Mechanical Polishing Pad
Application:
63/605,238 →
Chemical Mechanical Polishing Pad
Application:
63/605,276 →
Transparent Polishing Pad
Polishing Pad and Method of Manufacture
Polyurethane Polishing Pad
Polishing Pad with Oscillating Path Groove Network
Polishing Pad with Flow Modifying Groove Network
Method of Forming a Polishing Pad Having Reduced Striations
Apparatus for Forming a Striation Reduced Chemical Mechanical Polishing Pad
Polishing Pad Having Grooves Configured to Promote Mixing Wakes During Polishing
Polishing Pad Having Grooves Configured to Promote Mixing Wakes During Polishing
Cmp Pad Having a Streamlined Windowpane
Cmp Polishing Pad Having Grooves Arranged to Improve Polishing Medium Utilization
Cmp Pad Having a Radially Alternating Groove Segment Configuration
Method for Forming a Porous Polishing Pad
Radial-Biased Polishing Pad
Polishing Pad Having a Window with Reduced Surface Roughness
Three-Dimensional Network for Chemical Mechanical Polishing
Method of Polishing a Substrate
Cmp Pad Having Unevenly Spaced Grooves
Patent:
7,267,610 →
Application:
11/512,994 →
Cmp Pad Having Overlaid Constant Area Spiral Grooves
Patent:
7,300,340 →
Application:
11/512,699 →
Chemical Mechanical Polishing Pad
Polishing Pad with Grooves to Reduce Slurry Consumption
Polishing Pad with Grooves to Reduce Slurry Consumption
Polishing Pad with Grooves to Retain Slurry on the Pad Texture
Patent:
7,311,590 →
Application:
11/700,346 →
Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad
Elastomer-Modified Chemical Mechanical Polishing Pad
Patent:
7,371,160 →
Application:
11/644,478 →
Layered-Filament Lattice for Chemical Mechanical Polishing
Interpenetrating Network for Chemical Mechanical Polishing
Interpenetrating Network for Chemical Mechanical Polishing
Interconnected-Multi-Element-Lattice Polishing Pad
Chemical Mechanical Polishing Pad with Controlled Wetting
Chemical Mechanical Polishing Pad Having Sealed Window
Chemical Mechanical Polishing Pad Having a Low Defect Window
Chemical Mechanical Polishing Pad Having a Low Defect Integral Window
Method of Manufacturing a Chemical Mechanical Polishing Pad
Chemical Mechanical Polishing Pad Manufacturing Assembly
Multilayer Chemical Mechanical Polishing Pad Manufacturing Process
Multi-functional polishing pad
High-Rate Polishing Method
High-Rate Groove Pattern
Mix Head Assembly for Forming Chemical Mechanical Polishing Pads
Method for Manufacturing Chemical Mechanical Polishing Pad Polishing Layers Having Reduced Gas Inclusion Defects
Dual-Pore Structure Polishing Pad
Dual-Pore Structure Polishing Pad
Creep-Resistant Polishing Pad Window
Method of Polishing a Semiconductor Device
Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
Method of Polishing a Substrate Comprising Polysilicon and at Least One of Silicon Oxide and Silicon Nitride
Method for Chemical Mechanical Polishing Tungsten
Chemical mechanical polishing composition and method
Patent:
8,545,715 →
Application:
13/647,941 →
Chemical Mechanical Polishing Composition for Polishing a Sapphire Surface and Methods of Using Same
Chemical Mechanical Polishing Composition and Method for Polishing Tungsten
Method for Chemical Mechanical Polishing Substrates Containing Ruthenium and Copper
Method of Polishing Semiconductor Substrate
Patent:
9,293,339 →
Application:
14/863,548 →
Chemical Mechanical Polishing Method
Chemical Mechanical Polishing of Tungsten Using a Method and Composition Containing Quaternary Phosphonium Compounds
Chemical Mechanical Polishing of Tungsten Using a Method and Composition Containing Quaternary Phosphonium Compounds
Patent:
10,604,678 →
Application:
16/270,725 →
Polishing Slurry for Cobalt-Containing Substrate
Method for Polishing Cobalt-Containing Substrate
Aqueous Compositions of Stabilized Aminosilane Group Containing Silica Particles
Patent:
9,803,108 →
Application:
15/297,706 →
Aqueous Compositions of Low Abrasive Silica Particles
Patent:
9,783,702 →
Application:
15/297,716 →
Aqueous Silica Slurry Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Chemical Mechanical Polishing Method for Tungsten
Chemical Mechanical Polishing Method for Cobalt
Patent:
10,170,335 →
Application:
15/710,892 →
Chemical Mechanical Polishing Method for Cobalt
Aqueous Silica Slurry and Amine Carboxylic Acid Compositions Selective for Nitride Removal in Polishing and Methods of Using Them
Aqueous Silica Slurry and Amine Carboxylic Acid Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Aqueous Silica Slurry Compositions for Use in Shallow Trench Isolation and Methods of Using Them
Aqueous Anionic Functional Silica Slurry and Amine Carboxylic Acid Compositions for Selective Nitride Removal in Polishing and Methods of Using Them
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Chemical Mechanical Polishing Composition and Method for Tungsten
Patent:
10,597,558 →
Application:
16/166,085 →
Neutral to Alkaline Chemical Mechanical Polishing Compositions and Methods for Tungsten
Neutral to Alkaline Chemical Mechanical Polishing Compositions and Methods for Tungsten
Acid Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Method of Selective Chemical Mechanical Polishing Cobalt, Zirconium Oxide, Poly-Silicon and Silicon Dioxide Films.
Chemical Mechanical Polishing Composition Containing Composite Silica Particles, Method of Making the Silica Composite Particles and Method of Polishing a Substrate
Chemical Mechanical Polishing Composition Containing Composite Silica Particles, Method of Making the Silica Composite Particles and Method of Polishing a Substrate
Surface Modified Silanized Colloidal Silica Particles
Application:
17/697,647 →
Publication:
US US20220348789A1
Chemical Mechanical Polishing Composition and Method
Application:
17/697,709 →
Publication:
US US20220348790A1
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Inhibition
Patent:
11,274,230 →
Application:
17/241,377 →
Surface Modified Silanized Colloidal Silica Particles
Application:
17/697,735 →
Publication:
US US20220356065A1
Method of Enhancing the Removal Rate of Polysilicon
Patent:
11,472,984 →
Application:
17/485,595 →
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Reduction
Polishing Composition and Method of Polishing a Substrate Having Enhanced Defect Reduction
Chemical Mechanical Polishing Composition and Method for Preventing Polishing Pad Groove Clogging
Application:
18/351,031 →
Publication:
US US20250019567A1
Functionalized Carbon Particle CMP Slurry
Functionalized Metal and Nitride CMP Slurry
Application:
18/409,615 →
Publication:
US US20260002048A1
Functionalized Carbon Particle CMP Slurry Dispersion
Application:
18/409,628 →
Publication:
US US20250223468A1
Functionalized Carbon Particle Tungsten Cmp Slurry
Application:
18/409,643 →
Publication:
US US20260226315A1
Soluble Metal Oxide Anion CMP Slurry
Barrier Polishing Fluid
Selective Barrier Metal Polishing Method
Selective Slurry for Chemical Mechanical Polishing
Polishing Composition for Semiconductor Wafers
Barrier Polishing Solution
Selective Barrier Slurry for Chemical Mechanical Polishing
Abrasive-Free Chemical Mechanical Polishing Compositions and Methods Relating Thereto
Corrosion-Resistant Barrier Polishing Solution
Multi-Component Barrier Polishing Solution
Polymeric Barrier Removal Polishing Slurry
Low-stain polishing composition
Chemical Mechanical Polishing Composition and Methods Relating Thereto
Method for Chemical Mechanical Polishing a Substrate
Chemical Mechanical Polishing Composition and Methods Relating Thereto
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 31, 2013
From: MILLER, JEFFREY BORCHERDT
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 029735/0165 →
Assignment of Assignor's Interest
Jul 18, 2014
From: PRAXAIR S. T. TECHNOLOGY, INC.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 033340/0155 →
Assignment of Assignor's Interest
Mar 30, 2015
From: HENDRON, JEFFREY JAMES; VAVALA, KENNETH; MILLER, JEFFRY BORCHERDT; CANTRELL, BRIAN T.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 035283/0273 →
Assignment of Assignor's Interest
Jul 7, 2015
From: NUNLEY, JOHN HENRY, JR.; GEIGER, ANDREW M.; BENEDICT, JEFFREY H.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 036004/0291 →
Assignment of Assignor's Interest
Aug 25, 2015
From: QIAN, BAINIAN; JAMES, DAVID B.; MURNANE, JAMES; YEH, FENGJI
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 036408/0761 →
Assignment of Assignor's Interest
Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS COMP HOLDINGS, INC.
Reel/Frame 038049/0904 →
Assignment of Assignor's Interest
Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038053/0218 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 038049 Frame: 0904. Assignor(S) Hereby Confirms the Assignment.
Mar 22, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038215/0251 →
Assignment of Assignor's Interest
Sep 8, 2016
From: MCCLAIN, GEORGE; SAIKIN, ALAN; KOLESAR, DAVID; SARAFINAS, AARON
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 039671/0316 →
Assignment of Assignor's Interest
Sep 8, 2016
From: KOLESAR, DAVID; SARAFINAS, AARON; SAIKIN, ALAN; POST, ROBERT L.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 039675/0055 →
Assignment of Assignor's Interest
Dec 2, 2016
From: QIAN, BRIAN; WANK, ANDREW; JACOB, GEORGE C.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 040493/0528 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →