IP Library Granted Patent US 10,106,662
Granted Patent B2
US 10,106,662 · App. 15/229,017 · Granted Oct 23, 2018

Thermoplastic poromeric polishing pad

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Quick Facts
Patent No.
US 10,106,662
App. No.
15/229,017
Granted
Oct 23, 2018
Kind
B2
Abstract

The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI and an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4 The second thermoplastic polyurethane has by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI and an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3.

Claims (16)

1. A porous polyurethane polishing pad comprising:

a porous matrix having large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with small pores, a portion of the large pores being open to a top polishing surface, the large pores extending to the top polishing surface having a substantially vertical orientation, the porous matrix being a blend that includes two thermoplastic polymers;

a first thermoplastic polyurethane having by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI, the first thermoplastic polyurethane having an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4; and

a second thermoplastic polyurethane having by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI, the second thermoplastic polyurethane having an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3 and the second thermoplastic having a tensile modulus as measured a tensile elongation of 100% (ASTM D886) of at least twenty percent less than the first thermoplastic polyurethane and the blend of the first and second thermoplastic polyurethane having a tensile modulus as measured a tensile elongation of 100% (ASTM D886) of at least thirty percent greater than the second thermoplastic polymer.

2. The polishing pad of claim 1 wherein the porous matrix is coagulated on a water impermeable top layer and the water impermeable top layer coats a non-woven felt substrate and the non-woven felt substrate includes polymeric fibers.

3. The polishing pad of claim 1 wherein the first thermoplastic polyurethane has a tensile modulus of 8.5 to 14.5 MPa at a tensile elongation of 100% (ASTM D886).

4. The polishing pad of claim 1 wherein the second thermoplastic polyurethane has a tensile modulus of 4 to 8 MPa at a tensile elongation of 100% (ASTM D886).

5. The polishing pad of claim 1 wherein the first and second thermoplastic polymers have a distilled water contact angle of 65 degrees±5 degrees.

6. A porous polyurethane polishing pad comprising:

a porous matrix having large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with small pores, a portion of the large pores being open to a top polishing surface, the large pores extending to the top polishing surface having a substantially vertical orientation, the porous matrix being a blend that includes two thermoplastic polymers;

a first thermoplastic polyurethane having by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI, the first thermoplastic polyurethane having an Mn of 45,000 to 55,000 and a Mw of 140,000 to 160,000 and an Mw to Mn ratio of 2.8 to 3.3; and

a second thermoplastic polyurethane having by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI, the second thermoplastic polyurethane having an Mn of 65,000 to 75,000 and a Mw of 140,000 to 160,000 and an Mw to Mn ratio of 1.8 to 2.4 and the second thermoplastic having a tensile modulus as measured at a tensile elongation of 100% (ASTM D886) of at least thirty percent less than the first thermoplastic polyurethane and the blend of the first and second thermoplastic polyurethane having a tensile modulus as measured at a tensile elongation of 100% (ASTM D886) of 8.5 to 14.5 MPa and the blend of the first and second thermoplastic polyurethane having a tensile modulus at a tensile elongation of 100% (ASTM D886) at least fifty percent greater than the second thermoplastic polymer.

7. The polishing pad of claim 6 wherein the porous matrix is coagulated on a water impermeable top layer and the water impermeable top layer coats a non-woven felt substrate and the non-woven felt substrate includes polymeric fibers.

8. The polishing pad of claim 6 wherein the first thermoplastic polyurethane has a tensile modulus of 9.5 to 13.5 MPa at a tensile elongation of 100% (ASTM D886).

9. The polishing pad of claim 6 wherein the second thermoplastic polyurethane has a tensile modulus of 4.5 to 7.5 MPa at a tensile elongation of 100% (ASTM D886).

10. The polishing pad of claim 6 wherein the first and second thermoplastic polymers have a distilled water contact angle of 65 degrees±3 degrees.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2016
From: LUO, SHUIYUAN; KAWABATA, KATSUMASA; JACOB, GEORGE C.; SANFORD-CRANE, HENRY; YOSHIDA, KOICHI; KITAWAKI, SHUSUKI; TAKAHASHI, SHOGO; TAKEI, YOSUKE
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 039677/0171 →
Cited By (1)
US 12,330,261