POLISHING PAD WITH ENDPOINT DETECTION WINDOW
A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.
1 . A polishing pad for chemical mechanical polishing comprising
a polishing layer having a top polishing surface and comprising a polishing material,
a sub-pad layer comprising a sub-pad material wherein the sub-pad layer is located opposite from the top polishing surface, the sub-pad layer having a bottom sub-pad surface defining a bottom surface of the pad, and
a window extending through the polishing pad for transmitting a signal wave through the polishing pad, wherein the window has a top portion that forms a seal with the polishing layer, the top portion comprising a first window material, and a bottom portion that extends from an interface with the top portion of the window toward the bottom surface of the pad and that comprises an elastomeric material wherein there is a gap between side edges of the bottom portion and the sub-pad material.
2 . The polishing pad of claim 1 wherein a portion of the polishing layer in contact with the side edges of the top portion of the window forms a peripheral region that is recessed from the top polishing surface.
3 . The polishing pad of claim 1 wherein the bottom portion of the window has dimensions in a plane parallel to the top polishing surface and the gap has a dimension of 4 to 6% of the dimensions of the dimensions of the bottom portion of the window in the plane parallel to the top polishing surface.
4 . The polishing pad of claim 1 wherein the interface of the bottom portion with the top portion is coplanar with a bottom edge of the polishing layer.
5 . The polishing pad of claim 1 wherein the interface of the bottom portion with the top portion is above a plane defined by a bottom edge of the polishing layer.
6 . The polishing pad of claim 1 wherein the elastomeric material is selected from polyurethanes, polyolefins, polyamides, poly acrylates, styrenic block copolymers, and silicone elastomers.
7 . The polishing pad of claim 1 wherein the polishing layer comprises a polymer matrix with closed cell porosity.
8 . The polishing pad of claim 1 wherein the top portion and the bottom portion are optically transparent.
9 . The polishing pad of claim 1 wherein the bottom surface of the bottom portion of the window contacts an encapsulating layer that has an exterior surface co-planar with the bottom sub-pad surface.
10 . The polishing pad of claim 10 wherein the encapsulating layer contacts interior edges of the sub-pad layer.