Method for chemical mechanical polishing tungsten

1. A method for chemical mechanical polishing of a substrate, comprising:

providing a substrate, wherein the substrate comprises tungsten;

providing a chemical mechanical polishing slurry composition comprising, as initial components:

water;

0.1 to 5 wt % of an abrasive;

0.005 to 0.1 wt % of a diquaternary compound according to formula (I):

wherein each A is independently selected from N and P; wherein R 1 is selected from a saturated or unsaturated C 1 -C 15 alkyl group, a C 6 -C 15 aryl group and a C 6 -C 15 aralkyl group; wherein R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are each independently selected from selected from a hydrogen, a saturated or unsaturated C 1 -C 15 alkyl group, a C 6 -C 15 aryl group, a C 6 -C 15 aralkyl group and a C 6 -C 15 alkaryl group;

and, wherein the anion in formula (I) can be any anion or combination of anions that balance the 2+ charge on the cation in formula (I);

0.001 to 10 wt % of at least one of a phthalic acid, a phthalic anhydride, a phthalate compound and a phthalic acid derivative;

0.001 to 10 wt % potassium iodate; and,

optionally, an acid, wherein the acid is selected from the group consisting of nitric acid, sulfuric acid and hydrochloric acid;

wherein the chemical mechanical polishing composition provided has a pH of 1 to 4; wherein the chemical mechanical polishing composition exhibits a tungsten static etch rate of ≦5 Å/min and a tungsten removal rate of ≧100 Å/min;

wherein the chemical mechanical polishing composition contains <0.001 wt % per-oxy oxidizer; and, wherein the chemical mechanical polishing composition does not contain corrosion inhibitor agent;

providing a chemical mechanical polishing pad with a polishing surface;

creating dynamic contact at an interface between the polishing surface of the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and

dispensing the chemical mechanical polishing slurry composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate;

wherein the substrate is polished; and, wherein some of the tungsten is removed from the substrate.

2. The method of claim 1 , wherein the chemical mechanical polishing composition exhibits a tungsten removal rate of ≧300 Å/min.

3. The method of 1 , wherein the substrate further comprises tetraethylorthosilicate; wherein at least some of the tetraethylorthosilicate is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to tetraethylorthosilicate removal rate selectivity of 5:1 to 1:5.

4. The method of claim 1 , wherein the substrate further comprises Si 3 N 4 ; wherein at least some of the Si 3 N 4 is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to Si 3 N 4 removal rate selectivity of 2:1 to 1:2.

5. A method for chemical mechanical polishing of a substrate, comprising:

providing a substrate, wherein the substrate comprises tungsten;

providing a chemical mechanical polishing slurry composition, consisting of, as initial components:

water,

1.5 to 3.5 wt % of abrasive, wherein the abrasive is a colloidal silica abrasive having an average particle size of 10 to 100 nm;

0.01 to 0.1 wt % of a diquaternary compound according to formula (I):

wherein each A is a N; wherein each A is a N; whrein R 1 is a —(CH 2 ) 4 — group;

wherein R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are each a —(CH 2 ) 3 CH 3 group; an wherein the anion in formula (I) can be any anion or conbination of anions that balanc the 2+ charge on the cation in formula (I);

0.01 to 1 wt % of ammonium hydrogen phthalate;

0.01 to 1 wt % potassium iodate; and,

optionally, an acid, wherein the acid is selected from the group consisting of nitric acid sulfuric acid and hydrochloric acid;

wherein the chemical mechanical polishing composition provided has a pH of 2 to 3; wherein the chemical mechanical polishing composition exhibits a tungsten static etch rate of less than or equal to 5 Å/min and a tungsten removal rate of greater than or equal to 100 Å/min; and, wherein the chemical mechanical polishing composition contains <0.001 wt % per-oxy oxidizer;

providing a chemical mechanical polishing pad with a polishing surface;

creating dynamic contact at an interface between the polishing surface of the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and

dispensing the chemical mechanical polishing slurry composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate;

wherein the substrate is polished; and, wherein some of the tungsten is removed from the substrate.

6. The method of claim 5 , wherein the chemical mechanical polishing composition facilitates a titanium removal rate of ≧300 Å/min with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad.

7. The method of claim 6 , wherein the substrate further comprises tetraethylorthosilicate; wherein at least some of the tetraethylorthosilicate is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to tetraethylorthosilicate removal rate selectivity of 5:1 to 1:5 with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad.

8. The method of claim 6 , wherein the substrate further comprises Si 3 N 4 ; wherein at least some of the Si 3 N 4 is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to Si 3 N 4 removal rate selectivity of 2:1 to 1:2 with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad.

9. The method of claim 5 , wherein the chemical mechanical polishing slurry composition provided, consists of, as initial components:

water;

1.5 to 3.5 wt % of the abrasive, wherein the abrasive is a colloidal silica abrasive having an average particle size of 25 to 75 nm;

0.01 to 0.03 wt % of the diquaternary compound according to formula (I); wherein each A is a N; wherein R 1 is a —(CH) 4 — group; wherein R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are each a —(CH 2 ) 3 CH 3 group;

0.05 to 0.5 wt % of ammonium hydrogen phthalate; and,

0.1 to 0.5 wt % potassium iodate;

optionally, an acid, wherein the acid is selected from the group consisting of nitric acid, sulfuric acid a hydrochloric acid.

10. The method of claim 9 , wherein the chemical mechanical polishing composition facilitates a tungsten removal rate of ≧300 Å/min with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad; and wherein the substrate further comprises Si 3 N 4 ; wherein at least some of the Si 3 N 4 is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to Si 3 N 4 removal rate selectivity of 2:1 to 1:2 with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pd that comprises a polyurethane impregnated nonwoven polishing ad.

11. The method of claim 9 , wherein the chemical mechanical polishing composition exhibits a tungsten removal rate of ≧300 Å/min.

12. The method of claim 9 , wherein the substrate further comprises tetraethylorthosilicate; wherein at least some of the tetraethylorthosilicate is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to tetraethylorthosilicate removal rate selectivity of 5:1 to 1:5.

13. The method of claim 9 , wherein the substrate further comprises Si 3 N 4 ; wherein at least some of the Si 3 N 4 is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to Si 3 N 4 removal rate selectivity of 2:1 to 1:2.

14. The method of claim 9 , wherein the chemical mechanical polishing composition facilitates a titanium removal rate of ≧300 Å/min with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polish pad.

15. The method of claim 14 , wherein the substrate further comprises tetraethylorthosilicate; wherein at least some of the tetraethylorthosilicate is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to tetraethylorthosilicate removal rate selectivity of 5:1 to 1:5 with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad.

16. The method of claim 14 , wherein the substrate further comprises Si 3 N 4 ; wherein at least some of the Si 3 N 4 is removed from the substrate; and, wherein the chemical mechanical polishing composition exhibits a tungsten removal rate to Si 3 N 4 removal rate selectivity of 2:1 to 1:2 with a platen speed of 133 revolutions per minute, a carrier speed of 111 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 13.8 kPa on a 200 mm polishing machine using a chemical mechanical polishing pad that comprises a polyurethane impregnated nonwoven polishing pad.