Cationic fluoropolymer composite polishing pad

1. A polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the polymer-polymer composite polishing pad comprising the following:

a polishing layer having a polishing surface for polishing or planarizing the substrate;

a polymeric matrix forming the polishing layer, the polymer matrix being a first polymer, the first polymer being hydrophilic as measured with distilled water at a pH of 7 at a surface roughness of 10 μm rms after soaking in distilled water for five minutes and the first polymer not being a fluoropolymer;

cationic fluoropolymer particles embedded in the polymeric matrix, the cationic fluoropolymer particles having nitrogen-containing end groups, the nitrogen-containing end groups concentrating at the surface of the cationic fluoropolymer particles, the cationic fluoropolymer particles having a cationic zeta potential as measured in distilled water at a pH of 7 and wherein the cationic fluoropolymer particles can increase polishing removal rate of substrate on a patterned wafer when polishing with slurries containing anionic colloidal silica.

2. The polymer-polymer composite of claim 1 wherein the cationic fluoropolymer embedded in the polymeric matrix covers represents to 2 to 30 volume percent of the polymer-polymer composite polishing pad.

3. The polymer-polymer composite of claim 1 wherein the cationic fluoropolymer particles attract negatively charged abrasive particles at a pH of 7 at the polishing surface.

4. The polymer-polymer composite of claim 1 wherein the cationic fluoropolymer particles cover less than all of the polishing surface.

5. The polymer-polymer composite of claim 1 wherein slicing the polishing pad below the polishing layer and parallel to the polishing layer leaves one end of the cationic fluoropolymer particles anchored in the polymeric matrix while the other end can plastically deform at least 100% in elongation.

6. A polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the polymer-polymer composite polishing pad comprising the following:

a polishing layer having a polishing surface for polishing or planarizing the substrate;

a polymeric matrix forming the polishing layer, the polymer matrix being a first polymer, the first polymer being hydrophilic as measured with distilled water at a pH of 7 at a surface roughness of 10 μm rms after soaking in distilled water for five minutes and the first polymer not being a fluoropolymer;

cationic polyvinylfluoride particles embedded in the polymeric matrix, the cationic polyvinylfluoride particles having nitrogen-containing end groups, the nitrogen-containing end groups concentrating at the surface of the cationic polyvinylfluoride particles, the cationic polyvinylfluoride particles having a cationic zeta potential as measured in distilled water at a pH of 7 and wherein the cationic polyvinylfluoride particles can increase rate when polishing with slurries containing anionic colloidal silica.

7. The polymer-polymer composite of claim 6 wherein the cationic polyvinylfluoride embedded in the polymeric matrix covers represents to 2 to 30 volume percent of the polymer-polymer composite polishing pad.

8. The polymer-polymer composite of claim 6 wherein the cationic polyvinylfluoride particles attract of negatively charged abrasive particles at a pH of 7 at the polishing surface.

9. The polymer-polymer composite of claim 6 wherein cationic polyvinylfluoride particles cover less than all of the polishing surface.

10. The polymer-polymer composite of claim 6 wherein slicing the polishing pad below the polishing layer and parallel to the polishing layer leaves one end of the cationic polyvinylfluoride particles anchored in the polymeric matrix while the other end can plastically deform at least 100% in elongation.