Method of polishing a substrate

1. A chemical mechanical planarization method comprising:

providing a chemical mechanical polishing machine;

providing a semiconductor substrate;

providing a polishing solution;

providing a chemical mechanical polishing pad comprising,

a permeable substrate having a thickness of 2-100 mils; and

a polishing layer comprising a polymeric matrix having microspheres dispersed therein, wherein the polymeric matrix is formed of a water-based polymer blend, wherein the polishing layer is applied on the permeable substrate, wherein the polymeric matrix comprises a blend of 3:1 to 1:3 (by weight) of an aqueous urethane dispersion and an acrylic dispersion, wherein the microspheres are gas filled, wherein the polymeric matrix contains at least 0.3 volume percent microspheres, wherein the microspheres have a weight average diameter of 10-100 μm, wherein the polishing layer has grooves formed therein;

mounting the chemical mechanical polishing pad in the chemical mechanical polishing machine;

mounting the semiconductor substrate in the chemical mechanical polishing machine;

dispensing the polishing solution onto the chemical mechanical polishing pad and into a gap between the semiconductor wafer and the chemical mechanical polishing pad; and,

creating dynamic contact between the chemical mechanical polishing pad and the semiconductor wafer, wherein a surface of the semiconductor substrate is polished and made planar; and,

wherein the chemical mechanical polishing pad exhibits improved defectivity.

2. The method of claim 1 , wherein the polymeric matrix penetrates and binds to the permeable substrate.

3. The method of claim 1 , wherein the permeable substrate is a woven or a non-woven web.

4. The method of claim 1 , wherein the polymeric matrix comprises a blend of 3:1 (by weight) of an aqueous urethane dispersion and an acrylic dispersion.

5. A chemical mechanical planarization method comprising:

providing a chemical mechanical polishing machine;

providing a copper sheet wafer;

providing a polishing solution;

providing a chemical mechanical polishing pad comprising,

a permeable substrate having a thickness of 2-100 mils; and

a polishing layer comprising a polymeric matrix having microspheres dispersed therein, wherein the polymeric matrix is formed of a water-based polymer blend, wherein the polishing layer is applied on the permeable substrate, wherein the polymeric matrix comprises a blend of 3:1 to 1:3 (by weight) of an aqueous urethane dispersion and an acrylic dispersion, wherein the microspheres are gas filled, wherein the polymeric matrix contains at least 0.3 volume percent microspheres, wherein the microspheres have a weight average diameter of 10-100 μm, wherein the polishing layer has grooves formed therein;

mounting the chemical mechanical polishing pad in the chemical mechanical polishing machine;

mounting the copper sheet wafer in the chemical mechanical polishing machine;

dispensing the polishing solution onto the chemical mechanical polishing pad and into a gap between the copper sheet wafer and the chemical mechanical polishing pad; and,

creating dynamic contact between the chemical mechanical polishing pad and the copper sheet wafer, wherein a surface of the copper sheet wafer is polished and made planar; and,

wherein the chemical mechanical polishing pad exhibits improved defectivity, where the chemical mechanical polishing pad creates less than 300 total defects on the surface of the copper sheet wafer when the chemical mechanical polishing pad is used to polish the copper sheet wafer on the chemical mechanical polishing machine, under downforce conditions of 1.5 psi, a polishing solution flow rate of 150 cc/min, a platen speed of 120 RPM and a carrier speed of 114 RPM.

6. The method of claim 5 , wherein the wherein the polymeric matrix comprises a blend of 3:1 (by weight) of an aqueous urethane dispersion and an acrylic dispersion.