Chemical mechanical polishing pad and polishing method
View Patent ↗The present invention concerns a chemical mechanical polishing pad having a polishing layer that possesses a consistent positive zeta potential across the entire surface. Also disclosed is a chemical mechanical polishing method using the polishing pad together with a positively charged slurry.
1. A chemical mechanical (CMP) polishing pad having a positive zeta potential for polishing a substrate chosen from at least one of a memory, a silicon disk, glass, and a semiconductor substrate, the polishing pad comprising a polishing layer having a composition and a polishing surface, wherein the composition is a reaction product of ingredients, comprising:
(a) a polyfunctional isocyanate having an average of at least two unreacted isocyanate (NCO) groups per molecule;
(b) a first curative consisting of a hydroxyl substituted quaternary ammonium;
(c) a second curative, wherein said second curative is free of quaternary ammonium; and
(d) optionally, a plurality of microelements;
wherein said first curative is present at equal to or greater than 50 mol % based on the total molar amount of the first curative and the second curative, and
wherein the stoichiometric ratio of the combined reactive hydrogen groups in the curatives of (b) and (c) to the at least two unreacted isocyanate (NCO) groups in the polyfunctional isocyanate of (a) is 0.8 to 1.1; and
wherein said positive zeta potential is consistent across the surface of the entire polishing pad, and is independent of pH over a pH range of from 2 to 12 using nitric acid or potassium hydroxide to adjust pH of deionized water.
2. The chemical mechanical polishing pad of claim 1 , wherein the first curative contains at least two hydroxyl groups per molecule.
3. The chemical mechanical polishing pad of claim 2 , wherein the first curative contains at least three hydroxyl groups per molecule.
4. The chemical mechanical polishing pad of claim 1 , wherein the second curative comprises an amine.
5. The chemical mechanical polishing pad of claim 4 , wherein the second curative contains less than 0.1 wt % of tertiary amine.
6. The chemical mechanical polishing pad of claim 4 , wherein the amine is an aromatic amine.
7. The chemical mechanical polishing pad of claim 6 , wherein the aromatic amine is 4,4′-methylenebis(2-chloroaniline) (MBOCA).
8. The chemical mechanical polishing pad of claim 1 , wherein the quaternary ammonium is tris(2-hydroxyethyl)methylammonium methylsulfate.
9. The chemical mechanical polishing pad of claim 1 , wherein the quaternary ammonium is (2,3-dihydroxypropyl)trimethylammonium chloride.
10. The chemical mechanical polishing pad of claim 1 , wherein the zeta potential is in the range of +90 to +160 mV.