Polishing slurry for cobalt-containing substrate

1. An aqueous slurry useful for chemical Mechanical polishing a semiconductor substrate having cobalt or cobalt alloy containing features containing Co 0 comprising:

0.4 to 1.0 wt % hydrogen peroxide oxidizing agent (α),

0.5 to 3 wt % colloidal silica particles (β), the colloidal silica particles containing primary particles, the primary particles having an average diameter of 25 to 50 nm linked together in conjoined spherical structures, the conjoined spherical structures having an average length of 40 to 80 nm,

20 ppm to 2.2 wt % adenine cobalt corrosion inhibitor,

0.5 to 2 wt % complexing agent (γ) where (γ) consists of L-aspartic acid,

and balance water having a pH of 5 to 9 wherein oxidation potential of the slurry is sufficient to oxidize at least a portion of the Co 0 to Co +3 and wherein the total concentrations remain within the following formulae as follows:

wt % (α)+wt % (β)=1 to 4 wt % for polishing the cobalt or cobalt alloy;

wt % (γ)≤2*wt % (α) for limiting static etch of the cobalt or cobalt alloy; and

wt % (β)+wt % (γ)≤3*wt % (α) for limiting static etch of the cobalt or cobalt alloy; and

wherein slope of cobalt removal rate (Å/min) is from 0 to ˜1050 (Å/min)/wt % H 2 O 2 for a cobalt blanket wafer when increasing the hydrogen peroxide (α) from 0.4 to 1.0 wt % when polishing with a polyurethane polishing pad having a Shore D hardness of 57, closed cell pores with an average diameter between 30 and 60 μm and circular grooves having a depth, width and pitch of 760, 510and 3,050 μm, respectively at a downforce of 2 psi (13.8 kPa), 93 rpm platen speed, 87 rpm carrier speed with a slurry at 200 ml/min having 35 nm or 80 nm average diameter colloidal silica particles when using a diamond conditioner at a polish time of 10 to 60 seconds.

2. The aqueous slurry of claim 1 wherein the wt % (α)+wt % (β)=1.5 to 3.5 wt %.

3. The aqueous slurry of claim 1 wherein the pH is 7 to 9.

4. The aqueous slurry of claim 1 wherein the pH is 5 to 7.

5. An aqueous slurry useful for chemical mechanical polishing a semiconductor substrate having cobalt or cobalt alloy containing features containing Co 0 comprising:

0.4 to 1.0 wt % hydrogen peroxide oxidizing agent (α),

0.75 to 2 wt % colloidal silica particles (β), the colloidal silica particles containing primary particles, the primary particles having an average diameter of 25 to 50 nm and linked together in conjoined spherical structures, the conjoined spherical structures having an average length of 40 to 80 nm,

20 ppm to 0.8 wt % adenine cobalt corrosion inhibitor,

0.75 to 1.5 wt % complexing agent (γ) where (γ)consists of L-aspartic acid,

and balance water having a pH of 5 to 9 wherein oxidation potential of the slurry is sufficient to oxidize at least a portion of the Co 0 to Co +3 and wherein the total concentrations remain within the following formulae as follows:

wt % (α)+wt % (β)=1.5 to 3 wt % for polishing the cobalt or cobalt alloy;

wt % (γ)≤1.5*wt % (α) for limiting static etch of the cobalt or cobalt alloy; and

wt % (β)+wt % (γ)≤2.5*wt % (α) for limiting static etch of the cobalt or cobalt alloy; and

wherein slope of cobalt removal rate (Å/min) is from 0 to ˜1050 (Å/min)/wt % H 2 O 2 for a cobalt blanket wafer when increasing the hydrogen peroxide (α) from 0.4 to 1.0 wt % when polishing with a polyurethane polishing pad having a Shore D hardness of 57, closed cell pores with, an average diameter between 30 and 60 μm and circular grooves having a depth, width and pitch of 760, 510and 3,050 μm, respectively at a downforce of 2 psi (13.8 kPa), 93 rpm platen speed, 87 rpm carrier speed with a slurry at 200 ml/min having 20 nm or 80 nm average diameter colloidal silica particles when using a diamond conditioner at a polish time of 10 to 60 seconds.

6. The aqueous slurry of claim 5 wherein the wt % (α) wt % (β)=2 to 3 wt %.

7. The aqueous slurry of claim 5 wherein the pH is 7 to 9.

8. The aqueous slurry of claim 5 wherein the pH is 5 to 7.