IP Library Granted Patent US 11,679,531
Granted Patent B2
US 11,679,531 · App. 17/500,669 · Granted Jun 20, 2023

Chemical mechanical polishing pad and preparation thereof

Inventors: Bainian Qian (Newark, DE); Robert M. Blomquist (River Edge, NJ); Lyla M. El-Sayed (Boonton, NJ); Michael E. Mills (Bear, DE); Kancharla-Arun Reddy (Wilmington, DE); Bradley K. Taylor (West Chester, PA); Shijing Xia (Hockessin, DE)
Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc.; DuPont Electronics, Inc.
B29C35/0805B29C48/002B29C48/0011B29C2035/0827B29K2009/06B29K2096/04B29K2105/0038B29K2105/0085B29K2995/007B29L2031/736
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Quick Facts
Patent No.
US 11,679,531
App. No.
17/500,669
Granted
Jun 20, 2023
Kind
B2
Abstract

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.

Claims (14)

1. A process for making an extruded sheet to be used as a polishing layer in a chemical mechanical polishing pad suitable for polishing at least one of a semiconductor substrate, an optical substrate and a magnetic substrate, the process comprising:

(a) compounding a photopolymerizable composition comprising a block copolymer, a UV curable acrylate, and a photoinitiator in an extruder, wherein the photopolymerizable composition does not contain any organic solvent;

(b) extruding the compounded mixture of step (a) onto a support through a sheet die;

(c) passing the product of step (b) through a plurality of calendar rolls;

(d) exposing the product of step (c) to a source of UV light;

wherein said block copolymer is present at an amount of greater than 50 wt %, based on the total weight of an extruded sheet, and wherein after the UV curing in step (d), the extruded sheet having a Shore D hardness in the range of 40 to 70.

2. The process of claim 1 , further comprising an embossing step between steps (c) and (d) to create a pattern on the product of step (c).

3. The process of claim 1 , wherein said block copolymer is a triblock copolymer.

4. The process of claim 3 , wherein said triblock copolymer is a styrenic block copolymer.

5. The process of claim 4 , wherein said styrenic block copolymer is one or more members selected from the group consisting of a styrene-butadiene-styrene (SBS) block copolymer, a styrene-isoprene-styrene (SIS) block copolymer, a styrene-ethylene-butene-styrene (SEBS) block copolymer, a styrene-ethylene-propylene-styrene (SEPS) block copolymer, and mixtures thereof.

6. The process of claim 1 , wherein said block copolymer is present at an amount of greater than 65%.

7. The process of claim 1 , wherein said acrylate is one or more members selected from the group consisting of 1,3-butylene glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, and mixtures thereof.

8. The process of claim 1 , wherein the extruded sheet has a Shore D hardness in the range of 45 to 55.

9. The process of claim 1 , wherein said photopolymerizable composition further comprises a plasticizer.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2022
From: QIAN, BAINIAN; BLOMQUIST, ROBERT M; EL-SAYED, LYLA M; MILLS, MICHAEL E; REDDY, KANCHARLA-ARUN; TAYLOR, BRADLEY K; XIA, SHIJING
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.; DUPONT ELECTRONICS, INC.
Reel/Frame 058751/0614 →
Cited By (1)
US 12,220,784