Chemical mechanical polishing composition and methods relating thereto

1. A method for chemical mechanical polishing of a substrate, comprising:

providing a substrate, wherein the substrate comprises a barrier material in the presence of at least one of an interconnect metal and a low-k dielectric material;

providing a chemical mechanical polishing composition, wherein the chemical mechanical polishing composition comprises water; 1 to 40 wt % abrasive having an average particle size of ≦100 nm; 0 to 10 wt % oxidizer; 0.001 to 5 wt % quaternary compound; a material having a formula (I):

wherein R is selected from C 2 -C 20 alkyl, C 2 -C 20 aryl, C 2 -C 20 aralkyl and C 2 -C 20 alkaryl; wherein x is an integer from 0 to 20; wherein y is an integer from 0 to 20; wherein x+y≧1; wherein the chemical mechanical polishing composition has a pH≦5;

providing a chemical mechanical polishing pad;

creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and

dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate;

wherein at least some of the barrier material is removed from the substrate.

2. The method of claim 1 , wherein the substrate comprises tantalum nitride in the presence of copper and a low-k dielectric, carbon-doped oxide film.

3. The method of claim 2 , wherein the chemical mechanical polishing composition exhibits a tantalum nitride to copper removal rate selectivity of ≧2 and wherein the chemical mechanical polishing composition exhibits a tantalum nitride to low-k dielectric, carbon-doped oxide film removal rate selectivity of ≧3.

4. The method of claim 1 , wherein substrate comprises tantalum nitride in the presence of copper and a low-k dielectric, carbon-doped oxide film; wherein the abrasive is a colloidal silica; and wherein the chemical mechanical polishing composition exhibits a tantalum nitride removal rate of ≧800 Å/min with a platen speed of 93 revolutions per minute, a carrier speed of 87 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 1.5 psi on a 200 mm polishing machine where the chemical mechanical polishing pad comprises a polyurethane polishing layer containing polymeric hollow core microparticles and a polyurethane impregnated non-woven subpad.

5. A method for chemical mechanical polishing of a substrate, comprising:

providing a substrate, wherein the substrate comprises a barrier material in the presence of at least one of an interconnect metal and a low-k dielectric material;

providing a chemical mechanical polishing composition, wherein the chemical mechanical polishing composition comprises water; 1 to 5 wt % colloidal silica abrasive having an average particle size of 20 to 30 nm; 0.05 to 0.8 wt % oxidizer; 0 to 10 wt % inhibitor; 0.001 to 5 wt % quaternary compound selected from tetraethyl ammonium hydroxide, tetrapropyl ammonium hydroxide, tetraisopropyl ammonium hydroxide, tetracyclopropyl ammonium hydroxide, tetrabutyl ammonium hydroxide, tetraisobutyl ammonium hydroxide, tetratertbutyl ammonium hydroxide, tetrasecbutyl ammonium hydroxide, tetracyclobutyl ammonium hydroxide, tetrapentyl ammonium hydroxide, tetracyclopentyl ammonium hydroxide, tetrahexyl ammonium hydroxide, tetracyclohexyl ammonium hydroxide, and mixtures thereof; 0.01 to 0.1 wt % of a material having a formula (I):

wherein R is a C 8 -C 20 alkyl derived from a natural source selected from soy, tallow, coconut, palm oil and castor oil; wherein x is an integer from 0 to 20; wherein y is an integer from 0 to 20; wherein x+y≧1; wherein the chemical mechanical polishing composition has a pH≦5;

providing a chemical mechanical polishing pad;

creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate; and

dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate;

wherein at least some of the barrier material is removed from the substrate.

6. The method of claim 5 , wherein the substrate comprises tantalum nitride in the presence of copper and a low-k dielectric, carbon-doped oxide film.

7. The method of claim 6 , wherein the chemical mechanical polishing composition exhibits a tantalum nitride to copper removal rate selectivity of ≧2 and wherein the chemical mechanical polishing composition exhibits a tantalum nitride to low-k dielectric, carbon-doped oxide film removal rate selectivity of ≧3.

8. The method of claim 5 , wherein the chemical mechanical polishing composition exhibits a tantalum nitride removal rate of ≧800 Å/min with a platen speed of 93 revolutions per minute, a carrier speed of 87 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 1.5 psi on a 200 mm polishing machine wherein the chemical mechanical polishing pad comprises a polyurethane polishing layer containing polymeric hollow core microparticles and a polyurethane impregnated non-woven subpad.

9. The method of claim 6 , wherein the chemical mechanical polishing composition exhibits a tantalum nitride removal rate of ≧800 Å/min with a platen speed of 93 revolutions per minute, a carrier speed of 87 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 1.5 psi on a 200 mm polishing machine where the chemical mechanical polishing pad comprises a polyurethane polishing layer containing polymeric hollow core microparticles and a polyurethane impregnated non-woven subpad.

10. The method of claim 7 , wherein the chemical mechanical polishing composition exhibits a tantalum nitride removal rate of ≧800 Å/min with a platen speed of 93 revolutions per minute, a carrier speed of 87 revolutions per minute, a chemical mechanical polishing composition flow rate of 200 ml/min, and a nominal down force of 1.5 psi on a 200 mm polishing machine where the chemical mechanical polishing pad comprises a polyurethane polishing layer containing polymeric hollow core microparticles and a polyurethane impregnated non-woven subpad.