Method of manufacturing chemical mechanical polishing layers
View Patent ↗A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided, comprising: providing a liquid prepolymer material; providing a plurality of hollow microspheres; exposing the plurality of hollow microspheres to a carbon dioxide atmosphere for an exposure period to form a plurality of treated hollow microspheres; combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture; allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and, deriving at least one polishing layer from the cured material; wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.
1. A method of making a polishing layer for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate, comprising:
providing a liquid prepolymer material, wherein the liquid prepolymer material reacts to form a material comprising a poly(urethane);
providing a plurality of thermally expandable hollow microspheres; wherein each thermally expandable hollow microsphere in the plurality of thermally expandable hollow microspheres has a poly(vinylidene dichloride)/polyacrylonitrile copolymer shell; and, wherein the poly(vinylidene dichloride)/polyacrylonitrile copolymer shell encapsulates an isobutane;
exposing the plurality of thermally expandable hollow microspheres to a carbon dioxide atmosphere for an exposure period of >3 hours to form a plurality of treated hollow microspheres;
combining the liquid prepolymer material with the plurality of treated hollow microspheres to form a curable mixture;
allowing the curable mixture to undergo a reaction to form a cured material, wherein the reaction is allowed to begin ≦24 hours after the formation of the plurality of treated hollow microspheres; and,
deriving at least one polishing layer from the cured material;
wherein the at least one polishing layer has a polishing surface adapted for polishing the substrate.
2. The method of claim 1 , wherein the plurality of thermally expandable hollow microspheres is exposed to the carbon dioxide atmosphere by fluidizing the plurality of thermally expandable hollow microspheres using a gas for an exposure period of ≧5 hours to form the plurality of treated hollow microspheres, wherein the gas is ≧30 vol % CO 2 .
3. The method of claim 1 , further comprising:
providing a mold; and,
transferring the curable mixture into the mold;
wherein the curable mixture undergoes the reaction to form the cured material in the mold.
4. The method of claim 3 , further comprising:
skiving the cured material to form the at least one polishing layer.
5. The method of claim 4 , wherein the at least one polishing layer is a plurality of polishing layers.
6. The method of claim 5 , wherein the plurality of thermally expandable hollow microspheres is exposed to the carbon dioxide atmosphere by fluidizing the plurality of thermally expandable hollow microspheres using a gas for an exposure period of ≧5 hours to form the plurality of treated hollow microspheres, wherein the gas is ≧30 vol % CO 2 .
7. The method of claim 6 , wherein the reaction is allowed to begin ≦1 hour after the formation of the plurality of treated hollow microspheres.