Granted Patent B2

US 12,220,784 · App. 17/500,630 · Granted Feb 11, 2025

Inventors: Bainian Qian (Newark, DE); Robert M. Blomquist (River Edge, NJ); Lyla M. El-Sayed (Boonton, NJ); Michael E. Mills (Bear, DE); Kancharla-Arun Reddy (Wilmington, DE); Bradley K. Taylor (West Chester, PA); Shijing Xia (Hockessin, DE)

Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.

B24B37/22B24B37/24B24B37/26B24D3/28H01L21/30625

Abstract

Claims (8)

1. A chemical mechanical polishing pad suitable for polishing at least one of a semiconductor substrate, an optical substrate and a magnetic substrate, the polishing pad having a polishing layer, the polishing layer being cured from an extruded sheet, the extruded sheet comprising a photopolymerizable composition comprising a styrenic block copolymer, a UV curable acrylate, polybutadiene oil and a photoinitiator, wherein said styrenic block copolymer is one or more members selected from the group consisting of a styrene-butadiene styrene (SBS) block copolymer, a styrene-isoprene-styrene (SIS) block copolymer, a styrene-ethylene-butene-styrene (SEBS) block copolymer a styrene-ethylene-propylene-styrene (SEPS) block copolymer, and mixtures thereof and the styrenic block copolymer is present at an amount of greater than 50 wt %, based on the total weight of the extruded sheet, and wherein upon UV curing, the extruded sheet having a Shore D hardness in the range of 40 to 70.

2. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition further comprising an oil.

3. The chemical mechanical polishing pad of claim 1 , wherein said styrenic block copolymer is a triblock copolymer.

4. The chemical mechanical polishing pad of claim 1 , wherein said styrenic block copolymer is present at an amount of greater than 65%.

5. The chemical mechanical polishing pad of claim 1 , wherein said acrylate is one or more members selected from the group consisting of 1,3-butylene glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, and mixtures thereof.

6. The chemical mechanical polishing pad of claim 1 , wherein the extruded sheet after UV curing having a Shore D hardness in the range of 45 to 55.

7. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition does not contain any organic solvent.

8. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition further comprising a plasticizer.

Assignments (4)

Continuity (1)

References Cited (11)