IP Library Granted Patent US 11,667,061
Granted Patent B2
US 11,667,061 · App. 16/852,420 · Granted Jun 6, 2023

Method of forming leveraged poromeric polishing pad

Inventors: Wei-Wen Tsai (Philadelphia, PA); Katsumasa Kawabata (Kyoto, JP); Hui Bin Huang (Monroeville, NJ); Akane Uehara (Kyoto, JP); Yosuke Takei (Shimane, JP)
Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
B29C39/18B24B37/24B29C39/14B29C43/003B29C43/305C08J5/18B29K2075/00B29L2031/736C08J2375/04
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Quick Facts
Patent No.
US 11,667,061
App. No.
16/852,420
Granted
Jun 6, 2023
Kind
B2
Abstract

The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.

Claims (21)

1. A method of forming a porous polyurethane polishing pad comprising:

feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web with compression into the web sheet to prevent the liquid polyurethane from leaking opposite of a web direction;

coagulating liquid polyurethane onto the web sheet to form a two-layer substrate, the two-layer substrate being a porous body on the web sheet, the porous body having a porous matrix, wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with tertiary pores, a portion of the large pores being open to a top polishing surface;

pulling the two layer substrate over a touch roll to compress the porous body and pull the porous body forming to deform the porous matrix in a shear zone, after passing the shear zone, at least a portion of the large pores extending to the top polishing surface have a lower and upper sections with a vertical orientation, vertical direction being a direction orthogonal to the web sheet and spring-arm sections connecting the lower and upper sections, the spring-arm sections all being in the web direction and having an angle from an upward vertical between 15 and 90 degrees wherein the spring-arm sections combine to increase compressibility and contact area of the polishing pad;

curing the two layer substrate to cure the porous body and lock the porous body with the spring-arm-sections connecting the lower and upper sections; and

forming the cured porous body into the polishing pad, the polishing pad containing the spring-arm-sections connecting the lower and upper sections.

2. The method of claim 1 including the additional steps of buffing the porous body to increase size of large pores open at a polishing surface of the polishing pad and embossing the porous body to create a groove pattern.

3. The method of claim 2 wherein the shear zone elongates the large pores in a non-vertical direction to decrease a diameter of the spring-arm sections.

4. The method of claim 2 wherein the shear zone forms the spring-arm sections having an angle between 25 and 80 degrees as measured from an upward vertical direction.

5. The method of claim 1 wherein the back blade pushes the web against a rotating roll to apply back tension with the web and a knife blade regulates thickness of the porous body without applying significant back tensioning of the porous body.

6. A method of forming a porous polyurethane polishing pad comprising:

feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web with compression into the web sheet to prevent the liquid polyurethane from leaking opposite of a web direction;

coagulating liquid polyurethane onto the web sheet to form a two-layer substrate, the two-layer substrate being a porous body on the web sheet, the porous body having a porous matrix, wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with tertiary pores, a portion of the large pores being open to a top polishing surface;

pulling the two layer substrate over a touch roll to compress the porous body and pull the porous body forming to deform the porous matrix in a shear zone, after passing the shear zone, at least a portion of the large pores extending to the top polishing surface have a lower and upper sections with a vertical orientation, vertical direction being a direction orthogonal to the web sheet and spring-arm sections connecting the lower and upper sections, the spring-arm sections all being in the web direction and having an angle from an upward vertical between 15 and 90 degrees wherein the spring-arm sections combine to increase compressibility and contact area of the polishing pad;

forming middle-sized pores having a vertical orientation adjacent the spring-arm sections of the large pores and small pores between the middle-sized pores;

curing the two layer substrate to cure the porous body and lock the porous body with the spring-arm-sections connecting the lower and upper sections; and

forming the cured porous body into the polishing pad, the polishing pad containing the spring-arm-sections connecting the lower and upper sections.

7. The method of claim 6 including the additional steps of buffing the porous body to increase size of large pores open at a polishing surface of the polishing pad and embossing the porous body to create a groove pattern.

8. The method of claim 7 wherein the shear zone elongates the large pores in a non-vertical direction to decrease a diameter of the spring-arm sections.

9. The method of claim 7 wherein the shear zone forms the spring-arm sections having an angle between 25 and 80 degrees as measured from an upward vertical direction.

10. The method of claim 6 wherein the back blade pushes the web against a rotating roll to apply back tension with the web and a knife blade regulates thickness of the porous body without applying significant back tensioning of the porous body.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2020
From: TSAI, WEI-WEN; KAWABATA, KATSUMASA; HUANG, HUI BIN; UEHARA, AKANE; TAKEI, YOSUKE
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 052788/0299 →