IP Library Granted Patent US 8,348,724
Granted Patent B2
US 8,348,724 · App. 12/600,201 · Granted Jan 8, 2013

Polishing pad manufacturing method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,348,724
App. No.
12/600,201
Granted
Jan 8, 2013
Kind
B2
Abstract

A method for manufacturing a polishing pad prevents slurry leaks and provides a pad that can be used to provide high optical detection accuracy. The method for manufacturing a polishing pad includes forming a groove for injecting a light-transmitting region forming material on the back surface of a polishing layer; injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and buffing the front surface of the polishing layer to expose the light-transmitting region on the front surface.

Claims (5)

1. A method for manufacturing a polishing pad, comprising the steps of:

forming a groove for injecting a light-transmitting region forming material, on a back surface of a polishing layer;

injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and

buffing a front surface of the polishing layer to expose the light-transmitting region on the front surface.

2. The method of claim 1 , wherein after the buffing, the light-transmitting region has a thickness that is 20 to 90% of the thickness of the polishing layer.

Assignments (5)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038053/0218 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2009
From: DOURA, MASATO; HIROSE, JUNJI; NAKAMURA, KENJI; FUKUDA, TAKESHI; SATO, AKINORI
To: TOYO TIRE & RUBBER CO., LTD.
Reel/Frame 023608/0844 →