Chemical mechanical polishing pad

1. A chemical mechanical polishing pad suitable for polishing at least one of semiconductor, optical and magnetic substrates, the polishing pad having a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix, the high modulus component having a modulus of at least 100 MPa, the impact modifier having a low modulus component and the low modulus component having a modulus of at least one order of magnitude less than the high modulus component, an average length of 10 to 1,000 nm in at least one direction, being 1 to 50 volume percent of the polishing pad and wherein the low modulus component increases the impact resistance of the polishing pad.

2. The polishing pad of claim 1 wherein the high modulus component has a modulus of 100 to 5,000 MPa.

3. The polishing pad of claim 1 wherein the low modulus component has an average length of 20 to 800 nm in at least one direction.

4. The polishing pad of claim 1 wherein the low modulus component comprises a core-shell structure.

5. The polishing pad of claim 1 wherein the low modulus component comprises a butadiene-styrene copolymer, butadiene-styrene-(meth)acrylate terpolymers, butadiene-styrene-acrylonitrile terpolymers, isoprene-styrene copolymers, divinylbenzene, diallyl maleate, butylene glycol diacrylate, ethylene glycol dimethacrylate, allyl methacrylate, methyl acrylate, ethyl acrylate, n-propyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, ethoxyethoxyethyl acrylate, methoxy tripropylene glycol acrylate, 4-hydroxybutyl acrylate, lauryl methacrylate and stearyl methacrylate.

6. A chemical mechanical polishing pad suitable for polishing at least one of semiconductor, optical and magnetic substrates, the polishing pad having a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix, the high modulus component having a modulus of 100 to 5,000 MPa, the impact modifier having a low modulus component and the low modulus component having a modulus of at least one order of magnitude less than the high modulus component, an average length of 20 to 800 nm in at least one direction, being 2 to 40 volume percent of the polishing pad and wherein the low modulus component increases the impact resistance of the polishing pad.

7. The polishing pad of claim 6 wherein the polymeric matrix includes a polymer derived from difunctional or polyfunctional isocyanates and the polymeric matrix includes at least one selected from polyetherureas, polyisocyanurates, polyurethanes, polyureas, polyurethaneureas, copolymers thereof and mixtures thereof.

8. The polishing pad of claim 7 including water soluble particles or hollow polymeric shells.

9. The polishing pad of claim 7 wherein the high modulus component has a modulus of 200 to 1,000 MPa.

10. The polishing pad of claim 6 wherein the low modulus component has an average length of 40 to 500 nm in at least one direction.