IP Library Granted Patent US 9,925,637
Granted Patent B2
US 9,925,637 · App. 15/228,988 · Granted Mar 27, 2018

Tapered poromeric polishing pad

Inventors: Koichi Yoshida (Kyoto, JP); Kazutaka Miyamoto (Mie, JP); Katsumasa Kawabata (Kyoto, JP); Henry Sanford-Crane (Elkton, MD); Hui Bin Huang (Monroeville, NJ); George C. Jacob (Newark, DE); Shuiyuan Luo (Newark, DE)
Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
B24B37/26B24B37/24
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Quick Facts
Patent No.
US 9,925,637
App. No.
15/228,988
Granted
Mar 27, 2018
Kind
B2
Abstract

The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

Claims (14)

1. A porous polyurethane polishing pad comprising:

a porous polyurethane matrix having large pores extending upward from a base surface and open to an polishing surface, the large pores being interconnected with small pores; a portion of the large pores being open to a top polishing surface; the large pores extending to the polishing surface having a vertical orientation; and

a series of pillow structures formed from the porous matrix including the large pores and the small pores; the pillow structures having a downward surface from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

2. The porous polyurethane polishing pad of claim 1 wherein the downwardly sloped side walls have an initial taper region of 5 to 30 degrees as measured from the polishing surface leading into the downwardly sloped side walls.

3. The porous polyurethane polishing pad of claim 1 wherein the downwardly sloped sides terminate in a horizontal groove bottom of polyurethane matrix, the groove bottom having a porosity less than the pillow structures.

4. The porous polyurethane polishing pad of claim 1 wherein the interconnected side pores have an average diameter sufficient to allow flow of deionized water between vertical pores.

5. The porous polyurethane matrix of claim 1 wherein the pillows form a grid pattern.

6. A porous polyurethane polishing pad comprising:

a porous polyurethane matrix having large pores extending upward from a base surface and open to an polishing surface, the large pores being interconnected with small pores; a portion of the large pores being open to a top polishing surface; the large pores extending to the polishing surface having a vertical orientation and the porous polyurethane matrix being a thermoplastic; and

a series of pillow structures formed from the porous matrix including the large pores and the small pores; the pillow structures having a downward surface from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

7. The porous polyurethane polishing pad of claim 6 wherein the downwardly sloped side walls have an initial taper region of 5 to 30 degrees as measured from the polishing surface leading into the downwardly sloped side walls.

8. The porous polyurethane polishing pad of claim 6 wherein the downwardly sloped sides terminate in a horizontal groove bottom of compressed polyurethane matrix, the groove bottom being smooth and lacking open vertical or small pores.

9. The porous polyurethane polishing pad of claim 6 wherein the interconnected side pores have an average diameter sufficient to allow flow of deionized water between vertical pores.

10. The porous polyurethane matrix of claim 6 wherein the pillows form an X-Y grid pattern.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2016
From: YOSHIDA, KOICHI; MIYAMOTO, KAZUTAKA; KAWABATA, KATSUMASA; SANFORD-CRANE, HENRY; HUANG, HUI BIN; JACOB, GEORGE C.; LUO, SHUIYUAN
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 039812/0947 →
Continuity (1)
Related Publication 20180036862A1 · Feb 8, 2018